公开(公告)号：US20230307428A1

公开(公告)日：2023-09-28

申请号：US18325306

申请日：2023-05-30

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Zhongli JI ,  Wei XU

IPC: H01L25/10 ,  H01L23/31 ,  H01L23/498 ,  H01L23/00

CPC classification number: H01L25/105 ,  H01L23/3121 ,  H01L23/49822 ,  H01L24/16 ,  H01L24/32 ,  H01L24/33 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/3303 ,  H01L2224/48145 ,  H01L2224/48225 ,  H01L2224/73207 ,  H01L2224/73215 ,  H01L2224/73253 ,  H01L2924/1436 ,  H01L2924/1432 ,  H01L2924/14511 ,  H01L2924/1438

Abstract: A packaging module includes a substrate layer disposed in a stacking manner, and a plurality of chip layers stacked on the substrate layer. The plurality of chip layers include a top chip layer, and the top chip layer is a chip layer furthest from the substrate layer in the plurality of chip layers. The top chip layer includes a first chip, a connection surface of the first chip faces the substrate layer, and the connection surface of the first chip is conductively connected to a chip of an adjacent chip layer by using a first conductor. The connection surface of the first chip faces the substrate layer, so that the first conductor connected to the first chip and another chip does not occupy additional space, to reduce the thickness of the packaging module, and facilitate miniaturization of the packaging module.

公开(公告)号：US20240321771A1

公开(公告)日：2024-09-26

申请号：US18734122

申请日：2024-06-05

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Bai DU ,  Zhongli JI ,  Fei SHE ,  Ruilin LI ,  Qingchao GUO

IPC: H01L23/552 ,  H01L23/00 ,  H01L23/31 ,  H01L23/498

CPC classification number: H01L23/552 ,  H01L23/3135 ,  H01L23/49816 ,  H01L24/16 ,  H01L24/32 ,  H01L24/73 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/15333

Abstract: A chip system includes a chip package body and an electromagnetic shielding enclosure. The chip package body is electrically connected to a circuit board through a first connection part. The chip package body includes a package substrate and at least one chip that are electrically connected. The electromagnetic shielding enclosure includes a conductive first shielding structure and a conductive second shielding structure. The first shielding structure is connected to the package substrate. A first cavity included in the first shielding structure is configured to accommodate at least one chip. A first end of the second shielding structure is connected to the circuit board or a solder pad of the circuit board; or a second end of the second shielding structure is connected to the first shielding structure to form a second cavity.

公开(公告)号：US20230178496A1

公开(公告)日：2023-06-08

申请号：US18161227

申请日：2023-01-30

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Zhongli JI ,  Xulei LIU ,  Fengtian HU ,  Hongwu ZHANG

IPC: H01L23/552 ,  H01L23/31 ,  H01L21/56 ,  H01L25/18 ,  H01L21/768 ,  H05K1/18

CPC classification number: H01L23/552 ,  H01L21/56 ,  H01L21/76837 ,  H01L21/76898 ,  H01L23/3121 ,  H01L25/18 ,  H05K1/181

Abstract: The technology of this application relates to a packaging module and a packaging method therefor, and an electronic device. The packaging module includes at least two device groups and a shielding structure configured to shield the at least two device groups. The shielding structure includes a partition structure configured to perform electromagnetic isolation between every two adjacent device groups. The partition structure includes a plurality of conductive pillars and conductive adhesive, and a conductivity of the conductive pillar is greater than a conductivity of the conductive adhesive. The plurality of conductive pillars are arranged at intervals and are electrically connected to a ground layer of a substrate, the conductive adhesive fills a gap between any adjacent conductive pillars, and any adjacent conductive pillars are electrically connected by using the conductive adhesive.