公开(公告)号：US20230178496A1

公开(公告)日：2023-06-08

申请号：US18161227

申请日：2023-01-30

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Zhongli JI ,  Xulei LIU ,  Fengtian HU ,  Hongwu ZHANG

IPC: H01L23/552 ,  H01L23/31 ,  H01L21/56 ,  H01L25/18 ,  H01L21/768 ,  H05K1/18

CPC classification number: H01L23/552 ,  H01L21/56 ,  H01L21/76837 ,  H01L21/76898 ,  H01L23/3121 ,  H01L25/18 ,  H05K1/181

Abstract: The technology of this application relates to a packaging module and a packaging method therefor, and an electronic device. The packaging module includes at least two device groups and a shielding structure configured to shield the at least two device groups. The shielding structure includes a partition structure configured to perform electromagnetic isolation between every two adjacent device groups. The partition structure includes a plurality of conductive pillars and conductive adhesive, and a conductivity of the conductive pillar is greater than a conductivity of the conductive adhesive. The plurality of conductive pillars are arranged at intervals and are electrically connected to a ground layer of a substrate, the conductive adhesive fills a gap between any adjacent conductive pillars, and any adjacent conductive pillars are electrically connected by using the conductive adhesive.