公开(公告)号：US20230037617A1

公开(公告)日：2023-02-09

申请号：US17972689

申请日：2022-10-25

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Jiantao ZHENG ,  Nan ZHAO ,  Shanghsuan CHIANG ,  Yu JIANG ,  Jianbiao LU ,  Yiwei REN

IPC: H01L23/433 ,  H01L23/367 ,  H01L23/29 ,  H01L21/52 ,  H01L21/56

Abstract: A chip is mounted on a surface of the substrate, and the thermally conductive cover is disposed on a side that is of the chip and that is away from the substrate. There is a filling area on a surface that is of the thermally conductive cover and that faces the substrate, and the filling area is opposite to the chip. There is an accommodation cavity whose opening faces the substrate in the filling area. A thermal interface material layer is filled between the chip and a bottom surface of the accommodation cavity. Between an opening edge of the accommodation cavity and the substrate, there is a first gap connected to the accommodation cavity. The filling material encircles a side surface of the thermal interface material layer, so that the filling material separates the side surface of the thermal interface material layer from air.