公开(公告)号：US20240208803A1

公开(公告)日：2024-06-27

申请号：US18599907

申请日：2024-03-08

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Jiahao WU ,  Li ZENG ,  Wu ZHOU

IPC: B81B7/00 ,  B81B7/02 ,  G02B26/08

CPC classification number: B81B7/0016 ,  B81B7/02 ,  G02B26/0833

Abstract: Embodiments of this application provide a micromirror chip package structure. The micromirror chip package structure includes a micromirror chip, and a first substrate and a second substrate that are stacked, where the micromirror chip is disposed on a side that is of the first substrate and that faces away from the second substrate, where the micromirror chip includes a frame, a movable component, and a first torsion arm, and the movable component is connected to the frame through the first torsion arm; the first substrate includes a vibration isolation platform, an elastic beam, and a support frame, the micromirror chip is disposed on the vibration isolation platform, and the vibration isolation platform is connected to the support frame through the elastic beam; the support frame is fastened to the second substrate, and a gap is formed between the vibration isolation platform and the second substrate.