公开(公告)号：US20220254765A1

公开(公告)日：2022-08-11

申请号：US17666911

申请日：2022-02-08

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Kai ZHANG ,  Jiahui XU ,  Baiyou CHEN ,  Weiwei YAO

IPC: H01L25/16 ,  H01L23/31 ,  H01L23/538 ,  H01L23/498 ,  H01L23/373

Abstract: Embodiments of this application disclose a power structure, a preparation method, and a device, to provide a power structure with a high integration degree, to meet a requirement of the high-frequency and high-power field. The embodiments of this application provide a power structure, including a first substrate, a second substrate, a driver chip, a power chip, and a conductive part. A first surface of the first substrate and a second surface of the second substrate are disposed opposite to each other; a first end of the conductive part is connected to the first surface, and a second end of the conductive part is connected to the second surface; the driver chip is disposed on the first substrate; and the power chip is disposed on the second substrate.

公开(公告)号：US20240083137A1

公开(公告)日：2024-03-14

申请号：US18518020

申请日：2023-11-22

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Yuan QIN ,  Yangyang LI ,  Chun ZOU ,  Weiwei YAO ,  Nanjian SUN ,  Taimeng CHEN ,  Zhaoliang SU

IPC: B32B5/12 ,  B32B3/14 ,  B32B5/02 ,  B32B9/00 ,  B32B9/04 ,  B32B15/14 ,  B32B27/12 ,  B32B27/28 ,  B32B27/40

CPC classification number: B32B5/12 ,  B32B3/14 ,  B32B5/024 ,  B32B9/007 ,  B32B9/047 ,  B32B15/14 ,  B32B27/12 ,  B32B27/281 ,  B32B27/40 ,  B32B2255/02 ,  B32B2255/205 ,  B32B2255/26 ,  B32B2260/023 ,  B32B2260/046 ,  B32B2262/0269 ,  B32B2262/101 ,  B32B2262/106 ,  B32B2274/00 ,  B32B2307/202 ,  B32B2307/302 ,  B32B2307/558 ,  B32B2457/20

Abstract: Embodiments of this application provide a composite structure including a substrate layer and a functional layer disposed on a surface of at least one side of the substrate layer. The substrate layer includes a first support member and a second support member that are disposed side by side and a bendable connecting member connected to and disposed between the first support member and the second support member. A material of the first support member and the second support member includes a hard rubber fiber composite material, and the functional layer includes one or more of an electrically conductive layer, a thermally conductive layer, or an impact-resistant layer.