Mask blank, phase-shift mask and method for manufacturing semiconductor device

    公开(公告)号:US10444620B2

    公开(公告)日:2019-10-15

    申请号:US15897330

    申请日:2018-02-15

    申请人: HOYA CORPORATION

    IPC分类号: G03F1/32 G03F1/58 G03F7/20

    摘要: To provide a phase-shift mask in which the reduction in thickness of a light-shielding film is provided when a transition metal silicide-based material is used for the light-shielding film and by which the problem of ArF light fastness can be solved; and a mask blank for manufacturing the phase-shift mask.A mask blank has a structure in which a phase-shift film, an etching stopper film, a light-shielding film, and a hard mask film are laminated in said order on a transparent substrate, and at least one layer in the light-shielding film is made of a material which contains transition metal and silicon, and satisfies the conditions of Formula (1) below: CN≤9.0×10−6×RM4−1.65×10−4×RM3−7.718×10−2×RM2+3.611×RM−21.084   Formula (1) wherein RM is a ratio of the content of transition metal to the total content of transition metal and silicon in said one layer, and CN is the content of nitrogen in said one layer.

    Mask blank, phase-shift mask and method for manufacturing semiconductor device

    公开(公告)号:US09933698B2

    公开(公告)日:2018-04-03

    申请号:US15121124

    申请日:2014-12-09

    申请人: HOYA CORPORATION

    CPC分类号: G03F1/32 G03F1/58 G03F7/2053

    摘要: To provide a phase-shift mask in which the reduction in thickness of a light-shielding film is provided when a transition metal silicide-based material is used for the light-shielding film and by which the problem of ArF light fastness can be solved; and a mask blank for manufacturing the phase-shift mask.A mask blank 10 comprises a phase-shift film 2 and a light-shielding film 4 on a transparent substrate 1, the phase-shift film 2 is made of a material with ArF light fastness, and at least one layer in the light-shielding film 4 is made of a material which contains transition metal, silicon, and nitrogen, and satisfies the conditions of Formula (1) below: CN≤9.0×10−6×RM4−1.65×10−4×RM3−7.718×10−2×RM2+3.611×RM−21.084  Formula (1) wherein RM is a ratio of the content of transition metal to the total content of transition metal and silicon in said one layer, and CN is the content of nitrogen in said one layer.

    Mask blank, phase shift mask and method for manufacturing semiconductor device

    公开(公告)号:US11119399B2

    公开(公告)日:2021-09-14

    申请号:US15760265

    申请日:2016-09-08

    申请人: HOYA CORPORATION

    摘要: According to the present invention, provided is a mask blank (10), in which: a light shielding film (4) has a single layer structure or a laminate structure of a plurality of layers; at least one layer of the light shielding film (4) is formed of a material which contains a transition metal and silicon and is free from nitrogen and oxygen, or a material which contains a transition metal, silicon, and nitrogen and satisfies a condition of the following expression (1); a phase shift film (2) has a surface layer and a layer other than the surface layer; and the layer other than the surface layer is formed of a material which contains a transition metal, silicon, nitrogen, and oxygen, has a content of oxygen of 3 atom % or more, and satisfies a condition of the following expression (A). CN≤9.0×10−6×RM4−1.65×10−4×RM3−7.718×10−2×RM2+3.611×RM−21.084   Expression (1) 0.04×AS−0.06×AM>1  Expression (A)

    Mask blank, method for manufacturing transfer mask, and method for manufacturing semiconductor device

    公开(公告)号:US11435662B2

    公开(公告)日:2022-09-06

    申请号:US17391593

    申请日:2021-08-02

    申请人: HOYA CORPORATION

    IPC分类号: G03F1/32

    摘要: In the present invention, an etching stopper film (2), a light-blocking film (3) comprising a material containing one or more elements selected from among silicon and tantalum, and a hard mask film (4) are laminated in that order on a translucent substrate (1). The etching stopper film is made of a material containing chromium, oxygen and carbon, the chromium content is 50 atom % or more, the maximum peak in a N1s narrow spectrum obtained by means of analysis using X-Ray photoelectron spectroscopy is below the detection limit, and a Cr2p narrow spectrum obtained by means of analysis using X-Ray photoelectron spectroscopy has a maximum peak at a bond energy of 574 eV or less.

    Mask blank, method for manufacturing transfer mask, and method for manufacturing semiconductor device

    公开(公告)号:US11119400B2

    公开(公告)日:2021-09-14

    申请号:US16603127

    申请日:2018-04-02

    申请人: HOYA CORPORATION

    IPC分类号: G03F1/32

    摘要: In the present disclosure, an etching stopper film, a light shielding film comprising a material containing one or more elements selected from silicon and tantalum, and a hard mask film are laminated in that order on a transparent substrate. The etching stopper film is made of a material containing chromium, oxygen and carbon, the chromium content is 50 atomic % or more, the maximum peak in N1s narrow spectrum obtained by means of analysis using X-Ray photoelectron spectroscopy is below the detection limit, and Cr2p narrow spectrum obtained by means of analysis using X-Ray photoelectron spectroscopy has a maximum peak at a binding energy of 574 eV or less.

    Reflective film coated substrate, mask blank, reflective mask, and semiconductor device manufacturing method

    公开(公告)号:US11899356B2

    公开(公告)日:2024-02-13

    申请号:US17958088

    申请日:2022-09-30

    申请人: HOYA CORPORATION

    IPC分类号: G03F1/24

    CPC分类号: G03F1/24

    摘要: A reflective film coated substrate includes a substrate having two main surfaces opposite to each other and end faces connected to outer edges of the two main surfaces; and a reflective film formed on one of the main surfaces and extending onto at least part of the end faces. The reflective film on the main surface has a multilayer structure including low refractive index layers and high refractive index layers alternately formed. The reflective film which extends onto the end faces has a single-layer structure containing a first element higher in content than any other element in the low refractive index layers and a second element higher in content than any other element in the high refractive index layers.

    Reflective film coated substrate, mask blank, reflective mask, and semiconductor device manufacturing method

    公开(公告)号:US11500281B2

    公开(公告)日:2022-11-15

    申请号:US17008949

    申请日:2020-09-01

    申请人: HOYA CORPORATION

    IPC分类号: G03F1/24

    摘要: A reflective film coated substrate includes a substrate having two main surfaces opposite to each other and end faces connected to outer edges of the two main surfaces; and a reflective film formed on one of the main surfaces and extending onto at least part of the end faces. The reflective film on the main surface has a multilayer structure including low refractive index layers and high refractive index layers alternately formed. The reflective film which extends onto the end faces has a single-layer structure containing a first element higher in content than any other element in the low refractive index layers and a second element higher in content than any other element in the high refractive index layers.