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公开(公告)号：US20210351157A1
公开(公告)日：2021-11-11
申请号：US16757798
申请日：2018-10-23
Applicant: HITACHI CHEMICAL COMPANY, LTD.
Inventor： Motohiro NEGISHI , Hideo NAKAKO , Yuki KAWANA , Dai ISHIKAWA , Chie SUGAMA , Yoshinori EJIRI
Abstract: This member connection method includes a printing step. In the printing step, a coating film-formed region in which the coating film is formed, and a coating film non-formed region in which the coating film is not formed are formed in the print pattern, and the coating film-formed region is divided into a plurality of concentric regions and a plurality of radial regions by means of a plurality of line-shaped regions provided so as to connect various points, which are separated apart from one another in the marginal part of the connection region.
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公开(公告)号：US20200344893A1
公开(公告)日：2020-10-29
申请号：US16762041
申请日：2018-11-08
Applicant: HITACHI CHEMICAL COMPANY, LTD.
Inventor： Hideo NAKAKO , Yoshinori EJIRI , Dai ISHIKAWA , Chie SUGAMA , Yuki KAWANA , Motohiro NEGISHI , Yuichi YANAKA
Abstract: Provided is a method for producing a joined body, the method including a first step of preparing a laminated body which includes a first member having a metal pillar provided on a surface thereof, a second member having an electrode pad provided on a surface thereof, and a joining material provided between the metal pillar and the electrode pad and containing metal particles and an organic compound, and a second step of heating the laminated body to sinter the joining material at a predetermined sintering temperature, in which the joining material satisfies the condition of the following Formula (I): (M1−M2)/M1×100≥1.0 (I) [in Formula (I), M1 represents a mass of the joining material when a temperature of the joining material reaches the sintering temperature in the second step, and M2 represents a non-volatile content in the joining material.]
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公开(公告)号：US20200075528A1
公开(公告)日：2020-03-05
申请号：US16493507
申请日：2018-01-18
Applicant: HITACHI CHEMICAL COMPANY, LTD.
Inventor： Yuki KAWANA , Hideo NAKAKO , Motohiro NEGISHI , Dai ISHIKAWA , Chie SUGAMA , Yoshinori EJIRI
Abstract: Provided is a metal paste for joints, containing: metal particles; and linear or branched monovalent aliphatic alcohol having 1 to 20 carbon atoms, in which the metal particles include sub-micro copper particles having a volume average particle diameter of 0.12 μm to 0.8 μM.
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4.发明申请公开(公告)号：US20180250751A1
公开(公告)日：2018-09-06
申请号：US15757790
申请日：2016-09-07
Applicant: HITACHI CHEMICAL COMPANY, LTD.
Inventor： Yuki KAWANA , Kazuhiko KURAFUCHI , Yoshinori EJIRI , Hideo NAKAKO , Chie SUGAMA , Dai ISHIKAWA
CPC classification number: B22F7/08 , B22F1/00 , B22F1/0018 , B22F1/0055 , B22F2001/0033 , B22F2301/10 , B22F2304/056 , B22F2304/058 , B22F2304/10 , B22F2998/00 , B23K35/025 , C04B37/00 , H01B1/22 , H01L21/52 , H01L24/27 , H01L24/32 , H01L2224/33 , H01L2224/371 , H01L2224/40137 , H01L2224/40225 , H01L2224/40245 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/73265 , H01L2924/01029 , H01L2924/181 , H01L2924/00012 , H01L2924/00014
Abstract: Provided is copper paste for joining including metal particles, and a dispersion medium. The metal particles include sub-micro copper particles having a volume-average particle size of 0.12 μm to 0.8 μm, and micro copper particles having a volume-average particle size of 2 μm to 50 μm, a sum of the amount of the sub-micro copper particles contained and the amount of the micro copper particles contained is 80% by mass or greater on the basis of a total mass of the metal particles, and the amount of the sub-micro copper particles contained is 30% by mass to 90% by mass on the basis of a sum of a mass of the sub-micro copper particles and a mass of the micro copper particles.
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公开(公告)号：US20130295276A1
公开(公告)日：2013-11-07
申请号：US13935302
申请日：2013-07-03
Applicant: Hitachi Chemical Company, Ltd.
Inventor： Hideo NAKAKO , Kazunori YAMAMOTO , Youichi MACHII , Yasushi KUMASHIRO , Shunya YOKOZAWA , Yoshinori EJIRI , Katsuyuki MASUDA
IPC: H05K3/10
CPC classification number: H05K3/102 , H01B1/026 , H01B1/22 , H01L21/4867 , H01L23/49866 , H01L2924/0002 , H01L2924/09701 , H05K3/105 , H05K2203/0315 , H05K2203/1131 , H05K2203/1157 , Y10T428/12181 , H01L2924/00
Abstract: There is provided a method wherein a surface treating agent, which is essential for making copper particles antioxidative and dispersing the copper particles in the prior art, is hardly used, but copper particles, which cause little electromigration and are small in the price rate of material itself, are used to form a low-resistance copper wiring pattern while the generation of cracks therein is restrained. The method includes the step of using a dispersion slurry wherein copper based particles having a copper oxide surface are dispersed to form any pattern over a substrate, and the step of reducing the copper oxide surface of the copper based particles in the pattern with atomic form hydrogen to return the oxide to copper, and sintering particles of the copper metal generated by the reduction and bonding the particles to each other.
Abstract translation: 提供了一种方法，其中在现有技术中对铜颗粒进行抗氧化和分散铜颗粒所必需的表面处理剂几乎不被使用，但是几乎没有电迁移并且材料的价格率小的铜颗粒 本身用于形成低电阻铜布线图案，同时抑制其中的裂纹的产生。 该方法包括使用其中分散有氧化铜表面的铜基颗粒在基底上分散以形成任何图案的分散浆料的步骤，以原子形式的氢还原铜基颗粒的铜氧化物表面的步骤 将氧化物返回到铜中，并且通过还原并将颗粒彼此粘合而产生的铜金属的烧结颗粒。
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Patent Agency Ranking
6.发明申请公开(公告)号：US20200176411A1
公开(公告)日：2020-06-04
申请号：US16096807
申请日：2017-04-20
Applicant: HITACHI CHEMICAL COMPANY, LTD.
Inventor： Yuki KAWANA , Hideo NAKAKO , Dai ISHIKAWA , Chie SUGAMA , Kazuhiko KURAFUCHI , Yoshinori EJIRI
Abstract: Provided is a copper paste for joining including copper particles, second particles including a metal element other than copper, and a dispersion medium, in which the copper particles include submicro copper particles having a volume-average particle diameter of 0.12 μm or more and 0.8 μm or less and micro copper particles having a volume-average particle diameter of 2 μm or more and 50 μm or less, a sum of a content of the submicro copper particles and a content of the micro copper particles is 80% by mass or more of a sum of masses of the copper particles and the second particles, the content of the submicro copper particles is 30% by mass or more and 90% by mass or less of a sum of a mass of the submicro copper particles and a mass of the micro copper particles, and a content of the second particles is 0.01% by mass or more and 10% by mass or less of the sum of the masses of the copper particles and the second particles.
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公开(公告)号：US20180342478A1
公开(公告)日：2018-11-29
申请号：US15757852
申请日：2016-09-07
Applicant: HITACHI CHEMICAL COMPANY, LTD.
Inventor： Hideo NAKAKO , Kazuhiko KURAFUCHI , Yoshinori EJIRI , Dai ISHIKAWA , Chie SUGAMA , Yuki KAWANA
IPC: H01L23/00 , B22F7/08 , B22F1/00 , H01L23/367
Abstract: Provided is a joined body including: a first member; a second member; and a sintered metal layer that joins the first member and the second member. The sintered metal layer includes a structure that is derived from flake-shaped copper particles which are oriented in approximately parallel to an interface between the first member or the second member, and the sintered metal layer, and the amount of copper contained in the sintered metal layer is 65% by volume or greater on the basis of a volume of the sintered metal layer.
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公开(公告)号：US20190109082A1
公开(公告)日：2019-04-11
申请号：US16087269
申请日：2017-02-23
Applicant: HITACHI CHEMICAL COMPANY, LTD.
Inventor： Kazuyuki MITSUKURA , Masaya TOBA , Yoshinori EJIRI , Kazuhiko KURAFUCHI
IPC: H01L23/498 , H01L21/48 , H01L23/14 , H01L23/538
Abstract: There are provided an organic interposer capable of improving insulation reliability and a method for manufacturing the organic interposer. An organic interposer 10 is provided with: an organic insulating laminate 12 comprising a plurality of organic insulating layers; and a plurality of wires 13 arranged in the organic insulating laminate 12, and each of the wires 13 and each of the organic insulating layers are separated by a barrier metal film 14. The organic insulating laminate 12 may include: a first organic insulating layer 21 having a plurality of grooves 21a each having each of the wires 13 disposed therein; and a second organic insulating layer 22 laminated to the first organic insulating layer 21 in such a way as to embed the wires 13.
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公开(公告)号：US20200295248A1
公开(公告)日：2020-09-17
申请号：US16758166
申请日：2018-10-24
Applicant: HITACHI CHEMICAL COMPANY, LTD.
Inventor： Motohiro NEGISHI , Yuki KAWANA , Dai ISHIKAWA , Chie SUGAMA , Hideo NAKAKO , Yoshinori EJIRI
Abstract: A method for manufacturing a thermoelectric conversion module of the present invention is a method for manufacturing a thermoelectric conversion module including a thermoelectric semiconductor part in which a plurality of p-type semiconductors and a plurality of n-type semiconductors are alternately arranged, and a high temperature side electrode bound to a binding surface of the p-type semiconductor and the n-type semiconductor on a high temperature heat source side and a low temperature side electrode bound to a binding surface of the p-type semiconductor and the n-type semiconductor on a low temperature heat source side, which electrically connect the p-type semiconductor and the n-type semiconductor adjacent to each other in series, and includes a binding step of binding at least one of the high temperature side electrode and the low temperature side electrode, and the p-type semiconductor and the n-type semiconductor together, by sintering a binding layer containing metal particles, which is provided between the electrode and the semiconductor.
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公开(公告)号：US20190355690A1
公开(公告)日：2019-11-21
申请号：US16476969
申请日：2017-01-11
Applicant: HITACHI CHEMICAL COMPANY, LTD.
Inventor： Hideo NAKAKO , Kazuhiko KURAFUCHI , Yoshinori EJIRI , Dai ISHIKAWA , Chie SUGAMA , Yuki KAWANA
Abstract: A copper paste for pressureless bonding is a copper paste for pressureless bonding, containing: metal particles; and a dispersion medium, in which the metal particles include sub-micro copper particles having a volume average particle diameter of greater than or equal to 0.01 μm and less than or equal to 0.8 μm, and micro copper particles having a volume average particle diameter of greater than or equal to 2.0 μm and less than or equal to 50 μm, and the dispersion medium contains a solvent having a boiling point of higher than or equal to 300° C., and a content of the solvent having a boiling point of higher than or equal to 300° C. is greater than or equal to 2 mass % on the basis of a total mass of the copper paste for pressureless bonding.
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