公开(公告)号：US20190241771A1

公开(公告)日：2019-08-08

申请号：US16339145

申请日：2017-09-26

Applicant: HITACHI CHEMICAL COMPANY, LTD.

Inventor： Takashi TATSUZAWA ,  Kazuya MATSUDA ,  Yutaka TSUCHIDA ,  Takashi SEKI ,  Mitsuyoshi SHIMAMURA ,  Kengo SHINOHARA ,  Tetsuyuki SHIRAKAWA ,  Yasunori KAWABATA ,  Satoru MATSUMOTO

IPC: C09J9/02 ,  H01L23/00 ,  C09J11/04 ,  C09J7/30 ,  C09J7/40

CPC classification number: C09J9/02 ,  C09J7/00 ,  C09J7/30 ,  C09J7/401 ,  C09J11/04 ,  C09J201/00 ,  C09J2203/326 ,  C09J2423/045 ,  C09J2423/105 ,  C09J2425/00 ,  C09J2463/00 ,  C09J2467/005 ,  C09J2483/00 ,  H01B1/22 ,  H01B5/14 ,  H01B5/16 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/29239 ,  H01L2224/29244 ,  H01L2224/29247 ,  H01L2224/29255 ,  H01L2224/29264 ,  H01L2224/29293 ,  H01L2224/83121 ,  H01L2224/83851 ,  H01R11/01

Abstract: A conductive film includes an elongated release film and a plurality of conductive adhesive film pieces provided on the release film. Then, the plurality of adhesive film pieces are arranged in a longitudinal direction X of the release film. For this reason, the adhesive film piece can be set to an arbitrary shape. Accordingly, it is possible to attach the adhesive film piece to adhesive surfaces having various shapes and to efficiently use the adhesive film piece.