CONDUCTIVE THERMAL MANAGEMENT ARCHITECTURE FOR ELECTRONIC DEVICES

    公开(公告)号:US20220148939A1

    公开(公告)日:2022-05-12

    申请号:US17092542

    申请日:2020-11-09

    摘要: An electronic assembly includes a first printed wiring board (PWB) on a first side of the electronic assembly, and a first stiffener secured to the first PWB. The electronic assembly also includes a second PWB on a second side of the electronic assembly, opposite the first side, a second stiffener secured to the second PWB, and a center stiffener seated in the second stiffener and between the first stiffener and the second stiffener. The center stiffener has a first side facing the first stiffener, a second side that is opposite the first side and facing the second stiffener, a first end, and a second end, opposite the first end. Electronic devices are secured to the center stiffener. The center stiffener dissipates heat from the electronic devices, and the electronic devices include power dies.