- Patent Title: Conductive thermal management architecture for electronic devices
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Application No.: US17092542Application Date: 2020-11-09
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Publication No.: US11929297B2Publication Date: 2024-03-12
- Inventor: Hebri Vijayendra Nayak , Scott C. Wohlfarth , Michael Anthony Futrell
- Applicant: Hamilton Sundstrand Corporation
- Applicant Address: US NC Charlotte
- Assignee: HAMILTON SUNDSTRAND CORPORATION
- Current Assignee: HAMILTON SUNDSTRAND CORPORATION
- Current Assignee Address: US NC Charlotte
- Agency: CANTOR COLBURN LLP
- Main IPC: H01L23/367
- IPC: H01L23/367 ; H01L23/00 ; H01L23/31 ; H01L23/40 ; H01L23/495 ; H01L23/498

Abstract:
An electronic assembly includes a first printed wiring board (PWB) on a first side of the electronic assembly, and a first stiffener secured to the first PWB. The electronic assembly also includes a second PWB on a second side of the electronic assembly, opposite the first side, a second stiffener secured to the second PWB, and a center stiffener seated in the second stiffener and between the first stiffener and the second stiffener. The center stiffener has a first side facing the first stiffener, a second side that is opposite the first side and facing the second stiffener, a first end, and a second end, opposite the first end. Electronic devices are secured to the center stiffener. The center stiffener dissipates heat from the electronic devices, and the electronic devices include power dies.
Public/Granted literature
- US20220148939A1 CONDUCTIVE THERMAL MANAGEMENT ARCHITECTURE FOR ELECTRONIC DEVICES Public/Granted day:2022-05-12
Information query
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