公开(公告)号：US20190181275A1

公开(公告)日：2019-06-13

申请号：US16308116

申请日：2017-05-30

Applicant: HAMAMATSU PHOTONICS K.K.

Inventor： Ryutaro TSUCHIYA ,  Terumasa NAGANO ,  Yuta TSUJI ,  Go KAWAI ,  Yuki OKUWA

IPC: H01L31/0216 ,  G01J1/44 ,  G01J1/04 ,  H01L31/02 ,  H01L25/04 ,  H01L23/00 ,  H01L31/107 ,  H01L31/0203

Abstract: An optical detection unit includes a first wiring substrate that has a first main surface, a plurality of optical detection chips that each have a light receiving surface and a rear surface on a side opposite to the light receiving surface and are two-dimensionally arranged on the first main surface, a first bump electrode that electrically connects the optical detection chip to the first wiring substrate, a light transmitting portion that is provided on the light receiving surface, and a light shielding portion that has light reflection properties or light absorption properties. The optical detection chip includes a Geiger-mode APD and is mounted on the first wiring substrate by the first bump electrode in a state in which the rear surface faces the first main surface.