公开(公告)号：US20150111365A1

公开(公告)日：2015-04-23

申请号：US14587677

申请日：2014-12-31

Applicant: HAMAMATSU PHOTONICS K.K.

Inventor： Fumitsugu FUKUYO ,  Kenshi FUKUMITSU ,  Naoki UCHIYAMA ,  Toshimitsu WAKUDA

IPC: H01L21/78

CPC classification number: H01L21/78 ,  B23K20/023 ,  B23K20/16 ,  B23K20/233 ,  B23K20/26 ,  B23K26/03 ,  B23K26/032 ,  B23K26/034 ,  B23K26/046 ,  B23K26/0624 ,  B23K26/066 ,  B23K26/073 ,  B23K26/0853 ,  B23K26/16 ,  B23K26/364 ,  B23K26/40 ,  B23K26/53 ,  B23K2101/40 ,  B23K2103/50 ,  B28D5/0011 ,  B65G2249/04 ,  C03B33/023 ,  C03B33/082 ,  C03B33/102 ,  C03C23/0025 ,  G02F1/1368 ,  H01L21/6836 ,  H01L2221/68327 ,  Y02P40/57 ,  Y10T29/49144 ,  Y10T83/0341

Abstract: A laser beam machining method and a laser beam machining device capable of cutting a work without producing a fusing and a cracking out of a predetermined cutting line on the surface of the work, wherein a pulse laser beam is radiated on the predetermined cut line on the surface of the work under the conditions causing a multiple photon absorption and with a condensed point aligned to the inside of the work, and a modified area is formed inside the work along the predetermined determined cut line by moving the condensed point along the predetermined cut line, whereby the work can be cut with a rather small force by cracking the work along the predetermined cut line starting from the modified area and, because the pulse laser beam radiated is not almost absorbed onto the surface of the work, the surface is not fused even if the modified area is formed.

Abstract translation: 一种激光束加工方法和激光束加工装置，其能够切割工件而不产生在工件表面上的预定切割线的定影和裂纹，其中脉冲激光束照射在工件的预定切割线上 在导致多光子吸收的条件下并且具有与工件内部对准的凝聚点的工作表面，并且沿着预定的切割线沿着预定的切割线沿着预定的切割线移动凝聚点而在工件内部形成改质区域 由此，可以用相当小的力通过从修改区域开始沿着预定切割线的工作而切割工件，并且因为辐射的脉冲激光束几乎不被吸收到工件的表面上，所以表面不熔合 即使形成了修改区域。

公开(公告)号：US20180068897A1

公开(公告)日：2018-03-08

申请号：US15808211

申请日：2017-11-09

Applicant: HAMAMATSU PHOTONICS K.K.

Inventor： Fumitsugu FUKUYO ,  Kenshi FUKUMITSU ,  Naoki UCHIYAMA ,  Toshimitsu WAKUDA

IPC: H01L21/78 ,  C03C23/00 ,  B23K20/233 ,  B23K26/066 ,  B23K26/364 ,  C03B33/023 ,  C03B33/08 ,  B23K20/02 ,  B23K20/16 ,  B28D5/00 ,  C03B33/10 ,  B23K26/40 ,  B23K26/16 ,  B23K26/08 ,  B23K26/073 ,  B23K26/046 ,  B23K26/03 ,  B23K26/00 ,  B23K20/26 ,  B23K26/0622 ,  B23K103/00 ,  B23K101/40 ,  G02F1/1368 ,  H01L21/683

Abstract: A laser beam machining method and a laser beam machining device capable of cutting a work without producing a fusing and a cracking out of a predetermined cutting line on the surface of the work, wherein at pulse laser beam is radiated on the predetermined cut line on the surface of the work under the conditions causing a multiple photon absorption and with a condensed point aligned to the inside of the work, and a modified area is formed inside the work along the predetermined determined cut line by moving the condensed point along the predetermined cut line, whereby the work can be cut with a rather small force by cracking the work along the predetermined cut line starting from the modified area and, because the pulse laser beam radiated is not almost absorbed onto the surface of the work, the surface is not fused even if the modified area is formed.