公开(公告)号：US20160052084A1

公开(公告)日：2016-02-25

申请号：US14778621

申请日：2014-03-13

Applicant: HAMAMATSU PHOTONICS K.K.

Inventor： Daisuke KAWAGUCHI ,  Makoto NAKANO ,  Ryota SUGIO ,  Tsubasa HIROSE ,  Keisuke ARAKI

IPC: B23K26/00 ,  B23K26/06 ,  B23K26/53 ,  B23K26/064

CPC classification number: B23K26/0624 ,  B23K26/0006 ,  B23K26/03 ,  B23K26/064 ,  B23K26/0643 ,  B23K26/0648 ,  B23K26/0853 ,  B23K26/53 ,  B23K2103/52 ,  B23K2103/54 ,  B23K2103/56

Abstract: The laser processing device comprises a laser light source emitting a laser light, a converging optical system converging the laser light at an object to be processed, and an aberration providing part for imparting an aberration to the laser light converged at the object by the converging optical system. In an optical axis direction of the laser light, letting a reference aberration range be a range of a converging-induced aberration as an aberration occurring at a position where the laser light is converged as a result of converging the laser light at the object, the aberration providing part imparts a first aberration to the laser light such that the laser light has an elongated range longer than the reference aberration range in the optical axis direction as an aberration range and an intensity distribution in the optical axis direction with a continuous undulation in the elongated range.

Abstract translation: 激光加工装置包括发射激光的激光光源，将激光会聚在待处理对象的会聚光学系统，以及用于通过会聚光学会聚在物体上的激光赋予像差的像差提供部 系统。 在激光的光轴方向上，通过使参考像差范围成为会聚诱发像差的范围，作为在激光会聚在激光的对象的位置处发生的像差， 像差提供部分给激光赋予第一像差，使得激光具有比光轴方向上的参考像差范围更长的细长范围，作为像差范围，并且在光轴方向上的强度分布与连续起伏 伸长范围。

公开(公告)号：US20160052088A1

公开(公告)日：2016-02-25

申请号：US14778766

申请日：2014-03-13

Applicant: HAMAMATSU PHOTONICS K.K.

Inventor： Daisuke KAWAGUCHI ,  Makoto NAKANO ,  Ryota SUGIO ,  Tsubasa HIROSE ,  Keisuke ARAKI

IPC: B23K26/0622 ,  B23K26/06 ,  B23K26/53 ,  B23K26/00

CPC classification number: B23K26/0624 ,  B23K26/0006 ,  B23K26/03 ,  B23K26/064 ,  B23K26/0643 ,  B23K26/0648 ,  B23K26/0853 ,  B23K26/53 ,  B23K2103/52 ,  B23K2103/54 ,  B23K2103/56

Abstract: A laser processing device forms a modified region in an object to be processed by converging ultrashort pulse laser light at the object and comprises a laser light source emitting the laser light, a converging optical system converging the laser light emitted from the laser light source at the object, and an aberration providing part imparting an aberration to the laser light converged at the object by the converging optical system. In an optical axis direction of the laser light, letting a reference aberration range be a range of a converging-induced aberration as an aberration occurring at a position where the laser light is converged as a result of converging the laser light at the object, the aberration providing part imparts a first aberration to the laser light such that the laser light has an elongated range longer than the reference aberration range in the optical axis direction as an aberration range and an intensity distribution in the optical axis direction with a continuous undulation in the elongated range.

Abstract translation: 激光加工装置通过在物体上会聚超短脉冲激光来形成待处理物体中的改质区域，并且包括发射激光的激光光源，会聚光学系统，将从激光源射出的激光会聚在 物体和通过会聚光学系统对会聚于物体的激光赋予像差的像差提供部。 在激光的光轴方向上，通过使参考像差范围成为会聚诱发像差的范围，作为在激光会聚在激光的对象的位置处发生的像差， 像差提供部分给激光赋予第一像差，使得激光具有比光轴方向上的参考像差范围更长的细长范围，作为像差范围，并且在光轴方向上的强度分布与连续起伏 伸长范围。

公开(公告)号：US20160052083A1

公开(公告)日：2016-02-25

申请号：US14778619

申请日：2014-03-13

Applicant: HAMAMATSU PHOTONICS K.K.

Inventor： Daisuke KAWAGUCHI ,  Tsubasa HIROSE ,  Keisuke ARAKI

IPC: B23K26/00 ,  B23K26/067 ,  B23K26/53 ,  B23K26/06

CPC classification number: B23K26/0057 ,  B23K26/0648 ,  B23K26/0736 ,  B23K26/40 ,  B23K26/53 ,  B23K2103/172 ,  B23K2103/50 ,  B23K2103/54 ,  C03B33/0222 ,  C03B33/07 ,  H01L21/78 ,  Y02P40/57

Abstract: A laser processing device converges laser light at an object to be processed having a silicon part containing silicon mounted on a glass part containing glass with a resin part interposed therebetween so as to form a modified region within the object along a line to cut. The laser processing device comprises a laser light source emitting the laser light, a spatial light modulator modulating the laser light emitted from the laser light source, and a converging optical system converging the laser light modulated by the spatial light modulator at the object. When forming the modified region in the glass part, the spatial light modulator displays an axicon lens pattern as a modulation pattern so as to form converging points at a plurality of positions juxtaposed close to each other along a laser light irradiation direction.

Abstract translation: 激光加工装置将激光在同时具有硅树脂部分的硅玻璃部分上装载有含有硅部分的待处理物体，其中树脂部分插入其间，沿着切割线在物体内形成改质区域。 激光加工装置包括发射激光的激光光源，调制从激光光源发射的激光的空间光调制器，以及将由空间光调制器调制的激光会聚在物体处的会聚光学系统。 当在玻璃部分中形成改质区域时，空间光调制器将旋转透镜图案显示为调制图案，以便在激光照射方向上彼此靠近并列的多个位置处形成会聚点。

公开(公告)号：US20160052085A1

公开(公告)日：2016-02-25

申请号：US14778746

申请日：2014-03-13

Applicant: HAMAMATSU PHOTONICS K.K.

Inventor： Daisuke KAWAGUCHI ,  Makoto NAKANO ,  Ryota SUGIO ,  Tsubasa HIROSE ,  Keisuke ARAKI

IPC: B23K26/00 ,  B23K26/53 ,  B23K26/06

CPC classification number: B23K26/53 ,  B23K26/0643 ,  B23K26/0648 ,  B23K26/0736 ,  B23K26/40 ,  B23K2103/50 ,  B28D5/00 ,  C03B33/0222 ,  C03B33/07 ,  G02B3/08 ,  G02B5/001 ,  Y02P40/57

Abstract: A laser processing device converges laser light at an object to be processed so as to form a modified region within the object along a line to cut. The laser processing device comprises a laser light source emitting the laser light, a spatial light modulator modulating the laser light emitted from the laser light source, and a converging optical system converging the laser light modulated by the spatial light modulator at the object. The spatial light modulator displays an axicon lens pattern as a modulation pattern so as to form converging points at a plurality of positions juxtaposed close to each other along a laser light irradiation direction.

Abstract translation: 激光加工装置将激光会聚在待处理物体上，以沿着切割线在物体内形成改质区域。 激光加工装置包括发射激光的激光光源，调制从激光光源发射的激光的空间光调制器，以及将由空间光调制器调制的激光会聚在物体处的会聚光学系统。 空间光调制器将旋转透镜图案显示为调制图案，以便沿着激光照射方向在彼此靠近并列的多个位置处形成会聚点。

公开(公告)号：US20160045979A1

公开(公告)日：2016-02-18

申请号：US14778673

申请日：2014-03-13

Applicant: HAMAMATSU PHOTONICS K.K.

Inventor： Daisuke KAWAGUCHI ,  Tsubasa HIROSE ,  Keisuke ARAKI

IPC: B23K26/00 ,  B23K26/53 ,  B23K26/06

CPC classification number: B23K26/0057 ,  B23K26/0617 ,  B23K26/064 ,  B23K26/0643 ,  B23K26/0648 ,  B23K26/0665 ,  B23K26/0736 ,  B23K26/40 ,  B23K26/53 ,  B23K2103/50 ,  B28D5/00 ,  C03B33/0222 ,  Y02P40/57

Abstract: A laser processing device comprises a laser light source emitting the laser light, a spatial light modulator modulating the laser light emitted from the laser light source, and a converging optical system converging the laser light modulated by the spatial light modulator at the object. A plurality of rows of modified regions include at least an entrance-surface-side modified region located on the laser light entrance surface side, an opposite-surface-side modified region located on the opposite surface side of the laser light entrance surface, and a middle modified region located between the entrance-surface-side modified region and opposite-surface-side modified region. When forming the middle modified region, the spatial light modulator displays an axicon lens pattern as a modulation pattern so as to form converging points at a plurality of positions juxtaposed close to each other along a laser light irradiation direction. When forming the entrance-surface-side modified region and opposite-surface-side modified region, the spatial light modulator is restrained from displaying the axicon lens pattern as the modulation pattern.

Abstract translation: 激光加工装置包括发射激光的激光光源，调制从激光光源发出的激光的空间光调制器，以及将由空间光调制器调制的激光会聚在物体处的会聚光学系统。 多列修改区域至少包括位于激光入射面侧的入射面侧改质区域，位于激光入射面的相对面侧的相对面侧改质区域，以及 位于入口表面侧改质区域和反面侧改性区域之间的中间改质区域。 当形成中间改变区域时，空间光调制器将旋转透镜图案显示为调制图案，以便沿着激光照射方向彼此靠近并置的多个位置处形成会聚点。 当形成入射表面侧改质区域和反面侧改性区域时，抑制空间光调制器显示作为调制图案的旋转透镜图案。