公开(公告)号：US11841393B2

公开(公告)日：2023-12-12

申请号：US17417190

申请日：2019-10-09

Applicant: HAMAMATSU PHOTONICS K.K.

Inventor： Tomonori Nakamura ,  Hirotaka Nonaka ,  Hiroyuki Matsuura ,  Hirotoshi Terada

IPC: G01R31/28 ,  G01R31/26 ,  H01L23/473

CPC classification number: G01R31/2877 ,  G01R31/26 ,  G01R31/2868 ,  H01L23/473

Abstract: Provided is a cooling unit to be used in an inspection of a semiconductor device. The cooling unit includes a jacket for dissipating heat of the semiconductor device. The jacket is provided with a light passing portion for passing light from the semiconductor device. The jacket has a space defining surface that faces the semiconductor device and defines a space between the space defining surface and the semiconductor device in a state where the light passing portion faces the semiconductor device. The jacket is provided with a supply flow path through which a fluid to be supplied to the space flows.