公开(公告)号：US20150130004A1

公开(公告)日：2015-05-14

申请号：US14401224

申请日：2013-03-13

Applicant: HAMAMATSU PHOTONICS K.K.

Inventor： Hiroya Kobayashi ,  Masaharu Muramatsu

IPC: H01L27/146

CPC classification number: H01L27/1464 ,  H01L27/14618 ,  H01L27/14621 ,  H01L27/14625 ,  H01L31/02162 ,  H01L31/0232 ,  H01L31/02327 ,  H01L2224/48091 ,  H01L2924/10158 ,  H01L2924/00014

Abstract: A portion on the light exit end surface side of a fiber optic plate includes a first portion and a second portion. The first portion corresponds to a peripheral portion of a semiconductor photodetecting element. The second portion corresponds to a thin portion of the semiconductor photodetecting element and projects more toward the semiconductor photodetecting element than the first portion. A height of a step made between the first portion and the second portion of the fiber optic plate is lower than a height of a step made between the thin portion and the peripheral portion of the semiconductor photodetecting element. The semiconductor photodetecting element and the fiber optic plate are fixed by a resin, in a state in which the first portion and the peripheral portion are in contact and in which the second portion and the thin portion are separated.

Abstract translation: 光纤板的光出射端面侧的一部分包括第一部分和第二部分。 第一部分对应于半导体光电检测元件的周边部分。 第二部分对应于半导体光电检测元件的薄部分，并且比第一部分更多地朝向半导体光电检测元件投射。 在光纤板的第一部分和第二部分之间形成的台阶的高度低于在半导体光电检测元件的薄部分和周边部分之间形成的台阶的高度。 半导体光电检测元件和光纤板在第一部分和周边部分接触并且第二部分和薄部分分离的状态下由树脂固定。

公开(公告)号：US10199418B2

公开(公告)日：2019-02-05

申请号：US14766336

申请日：2013-10-17

Applicant: HAMAMATSU PHOTONICS K.K.

Inventor： Kenichi Sugimoto ,  Hiroya Kobayashi ,  Kentaro Maeta ,  Masaharu Muramatsu

IPC: H01L27/146 ,  H01L23/00 ,  H01L23/498

Abstract: A plurality of semiconductor photodetecting elements have a planar shape having a pair of first sides opposed to each other in a first direction and a pair of second sides being shorter than the pair of first sides and opposed to each other in a second direction perpendicular to the first direction, and are disposed on a base so as to be adjacent to each other in juxtaposition. A plurality of bump electrodes each are disposed on sides where the pair of first sides lie in each semiconductor photodetecting element, to electrically and mechanically connect the base to each semiconductor photodetecting element. A plurality of dummy bumps are disposed so that at least one dummy bump is disposed on each of sides where the pair of second sides lie in each semiconductor photodetecting element, to mechanically connect the base to each semiconductor photodetecting element.

公开(公告)号：US09401381B2

公开(公告)日：2016-07-26

申请号：US14401224

申请日：2013-03-13

Applicant: HAMAMATSU PHOTONICS K.K.

Inventor： Hiroya Kobayashi ,  Masaharu Muramatsu

IPC: H01L27/146 ,  H01L31/0216 ,  H01L31/0232

CPC classification number: H01L27/1464 ,  H01L27/14618 ,  H01L27/14621 ,  H01L27/14625 ,  H01L31/02162 ,  H01L31/0232 ,  H01L31/02327 ,  H01L2224/48091 ,  H01L2924/10158 ,  H01L2924/00014

Abstract: A portion on the light exit end surface side of a fiber optic plate includes a first portion and a second portion. The first portion corresponds to a peripheral portion of a semiconductor photodetecting element. The second portion corresponds to a thin portion of the semiconductor photodetecting element and projects more toward the semiconductor photodetecting element than the first portion. A height of a step made between the first portion and the second portion of the fiber optic plate is lower than a height of a step made between the thin portion and the peripheral portion of the semiconductor photodetecting element. The semiconductor photodetecting element and the fiber optic plate are fixed by a resin, in a state in which the first portion and the peripheral portion are in contact and in which the second portion and the thin portion are separated.

Abstract translation: 光纤板的光出射端面侧的一部分包括第一部分和第二部分。 第一部分对应于半导体光电检测元件的周边部分。 第二部分对应于半导体光电检测元件的薄部分，并且比第一部分更多地朝向半导体光电检测元件投射。 在光纤板的第一部分和第二部分之间形成的台阶的高度低于在半导体光电检测元件的薄部分和周边部分之间形成的台阶的高度。 半导体光电检测元件和光纤板在第一部分和周边部分接触并且第二部分和薄部分分离的状态下由树脂固定。