公开(公告)号：US06221437B1

公开(公告)日：2001-04-24

申请号：US09290912

申请日：1999-04-12

申请人： H. Vincent Reynolds

发明人： H. Vincent Reynolds

IPC分类号： B05D118

CPC分类号： C25D21/02 ,  C25D7/12

摘要： A heated platen or chuck is employed in connection with a wet chemistry process cell, such as a plating cell for plating a flat substrate. A flow of electrolyte or other wet process solution is introduced into the cell across the surface of the substrate which is mounted on a the chuck or holder. A cathode ring may be disposed to make electrical contact with the substrate. The cathode ring can include a thin metal thieving ring. A fluid-powered rotary blade or wiper may be employed to draw bubbles or other impurities from the substrate, and a megasonic transducer can apply megasonic acoustic energy to the solution. The cell can be used for electroless or galvanic plating. A heater in the chuck heats the substrate to a temperature significantly above that of the electrolyte. Heating the substrate during plating improves the grain structure of the plated metal.

摘要翻译： 与湿化学处理单元（例如用于电镀平面基板的电镀单元）结合使用加热的压板或卡盘。 将电解质或其它湿法溶液流引入安装在卡盘或保持器上的衬底的表面上的电池中。 可以设置阴极环以与衬底电接触。 阴极环可以包括薄金属盗窃环。 可以使用流体动力的旋转叶片或刮水器来从衬底吸出气泡或其它杂质，并且兆声换能器可以将超声波声能施加到溶液。 电池可用于无电镀或电镀。 卡盘中的加热器将基板加热到明显高于电解液的温度。 电镀过程中加热基板会改善电镀金属的晶粒结构。

公开(公告)号：US5683564A

公开(公告)日：1997-11-04

申请号：US731508

申请日：1996-10-15

申请人： H. Vincent Reynolds

发明人： H. Vincent Reynolds

IPC分类号： C25D1/10 ,  C25D5/08 ,  C25D5/20 ,  C25D17/00 ,  C25D21/10 ,  C25D17/02

CPC分类号： C25D5/20 ,  C25D1/10 ,  C25D5/08

摘要： A plating cell for plating a flat substrate, for example, a stamper for a high-density compact disk recording, employs a sparger to introduce a flow of electrolyte across the surface of the substrate to be plated. A fluid-powered rotary blade or wiper within the cathode chamber has a rotary blade with an edge spaced a small distance, preferably about three-eighths inch, from the substrate, and an annular turbine which rotates under a flow of the electrolytic fluid that is also being fed to the sparger. The rotary wiper is run at a speed between about 35 and 80 rpm and draws the electrolyte away from the substrate. This helps remove hydrogen bubble that form during electroplating. A semipermeable weir separates the cathode chamber from an anode chamber that contains an anode basket that is filled with plating material. The plating cell is provided with a backwash flow regime so that impurities and inclusions from the anode chamber are kept out of the plating bath.

摘要翻译： 用于电镀平面基板的电镀单元，例如用于高密度光盘记录的压模，采用喷射器将电解液流引入待镀基板的表面。 阴极室内的流体动力旋转刀片或擦拭器具有旋转刀片，其具有与衬底间隔开小的距离，优选约三分之八英寸的边缘，以及在电解液的流动下旋转的环形涡轮机， 也被送到分布器。 旋转擦拭器以约35至80rpm之间的速度运行，并将电解质从基板吸出。 这有助于去除在电镀过程中形成的氢气泡沫。 半透气堰将阴极室与包含填充有电镀材料的阳极筐的阳极室分开。 电镀槽具有回洗流动状态，使得来自阳极室的杂质和夹杂物保持在电镀液中。

公开(公告)号：US06217735B1

公开(公告)日：2001-04-17

申请号：US09314400

申请日：1999-05-19

申请人： H. Vincent Reynolds

发明人： H. Vincent Reynolds

IPC分类号： C25D500

CPC分类号： C25D7/12 ,  C25D5/20 ,  C25D7/123 ,  C25D17/10 ,  C25D21/10

摘要： A megasonic plating technique employs a megasonic transducer to create a ridge of electrolyte that extends upward above a plating tray. A chuck holds the substrate to be plated so the face of the wafer is oriented downwards. The megasonic transducer extends along a base of the center part of the tray, and an elongated anode element is positioned above the transducer. Spargers introduce electrolyte into the tray non-turbulently along opposite sides of the transducer. There is a transverse relative motion created between the tray and the chuck so that the ridge of electrolyte sweeps across the face of the substrate.

摘要翻译： 兆声波电镀技术采用兆声传感器来产生在电镀盘上方向上延伸的电解质脊。 卡盘保持要被电镀的基板，使得晶片的表面向下取向。 兆声传感器沿着托盘的中心部分的基部延伸，并且细长的阳极元件位于换能器上方。 喷雾器在传感器的相对侧非湍流地将电解液引入托盘。 在托盘和卡盘之间产生横向相对运动，使得电解质的脊线扫过基板的表面。

公开(公告)号：US5597460A

公开(公告)日：1997-01-28

申请号：US556463

申请日：1995-11-13

申请人： H. Vincent Reynolds

发明人： H. Vincent Reynolds

IPC分类号： C25D1/10 ,  C25D5/08 ,  C25D17/02 ,  C25D17/12 ,  C25D21/06 ,  C25D21/10

CPC分类号： C25D1/10 ,  C25D5/08

摘要： A plating cell for plating a flat substrate, for example, a stamper for a high-density compact disk recording, employs an arcuate sparger to introduce a laminar flow of electrolyte across the surface of the substrate to be plated. In a preferred embodiment, the sparger occupies about 90 to about 120 degrees of arc. A semipermeable weir separates the main plating bath from an anode chamber that contains an anode basket that is filled with nuggets of nickel or other plating material. The plating cell is provided with a backwash flow regime so that impurities and inclusions from the anode chamber are kept out of the plating bath. The substrate can be positioned between vertical and about forty-five degrees from vertical, and can be supported with or without rotation.

摘要翻译： 用于电镀平面基板的电镀单元，例如用于高密度光盘记录的压模，采用弧形喷雾器将电解质层流引入待镀基板的表面。 在优选实施例中，喷雾器占据约90度至约120度的弧度。 半渗透堰将主镀浴与阳极室分开，阳极室包含填充有镍或其他电镀材料的阳极筐。 电镀槽具有回洗流动状态，使得来自阳极室的杂质和夹杂物保持在电镀液中。 衬底可以垂直定位在垂直于大约四十五度之间，并且可以被支撑有或没有旋转。

公开(公告)号：US5932077A

公开(公告)日：1999-08-03

申请号：US20832

申请日：1998-02-09

申请人： H. Vincent Reynolds

发明人： H. Vincent Reynolds

IPC分类号： C25D1/10 ,  C25D5/20 ,  C25D17/00

CPC分类号： C25D5/20 ,  C23C18/1617 ,  C23C18/1628 ,  C23C18/163 ,  C23C18/1664 ,  C23C18/1666 ,  C23C18/1669 ,  C25D17/002 ,  C25D17/005 ,  C25D17/007 ,  C25D17/02 ,  C25D17/06 ,  C25D17/10 ,  C25D21/10 ,  C25D21/18 ,  C25D5/08 ,  C25D5/22 ,  Y10S204/07

摘要： A wet process apparatus, e.g., plating cell for plating a flat substrate introduces a flow of electrolyte or other plating solution across the surface of the substrate to be plated. The substrate is mounted on a holder that is positioned on a door that swings between a horizontal open position and a vertical closed position. There is a circular opening in a front wall against which the door seats. The door can have a sealing ring that contacts the wall of the cell outside of the opening. A cathode ring disposed in a recess in the periphery of the opening makes electrical contact with the substrate. The cathode ring can include a thin metal thieving ring. A fluid-powered rotary blade or wiper within the plating chamber rotates to draw bubbles or other impurities from the substrate, and a megasonic transducer applies megasonic acoustic energy to the solution, e.g., at 0.2 to 5 Mhz. The cell can be used for electroless or galvanic plating.

摘要翻译： 湿法处理装置，例如用于电镀平板基板的电镀槽，在电镀基板的表面上引入电解液或其它电镀液流。 衬底安装在位于门上的保持器上，该门在水平打开位置和垂直关闭位置之间摆动。 前门有一个圆形开口，门座与座椅相对。 门可以具有与开口外部的电池壁接触的密封环。 设置在开口周边的凹部中的阴极环与基板电接触。 阴极环可以包括薄金属盗窃环。 电镀室内的流体动力旋转刀片或擦拭器旋转以从衬底中吸出气泡或其他杂质，并且兆声传感器将超声波声能施加到溶液，例如以0.2至5Mhz。 电池可用于无电镀或电镀。

公开(公告)号：US5865894A

公开(公告)日：1999-02-02

申请号：US873154

申请日：1997-06-11

申请人： H. Vincent Reynolds

发明人： H. Vincent Reynolds

IPC分类号： C23C18/16 ,  C25D5/08 ,  C25D5/20 ,  C25D7/00 ,  B05C3/00

CPC分类号： C25D5/20 ,  C23C18/1619 ,  C23C18/1666 ,  C25D5/08

摘要： A plating cell adapted for electro-less plating of articles, for example, semiconductor wafers contained in a carrier or "boat", incorporates a megasonic transducer in the plating cell and a rotational drive supporting the wafer carrier in the plating cell. The megasonic transducer applies acoustic energy at megasonic frequencies to the solution in the cell during a plating operation, and the carrier is rotated at a suitable speed, e.g., 45 to 60 r.p.m. A rapid drain is provided to remove the solution from the cell quickly at the end of a plating operation, and a pair of spray tubes with a series of spray nozzles rinses the wafers with de-ionized water. Spargers at the base of the cell inject the plating solution, which proceeds generally upwards in a laminar flow, and spills over a spillway at the top of the plating tank. The spillway comprises a series of triangular teeth which avoid waves or turbulence.

摘要翻译： 适用于物品（例如，载体或“船”中所包含的半导体晶片）的电镀电镀的电镀池在电镀单元中包括兆声传感器和支撑电镀槽中的晶片载体的旋转驱动。 兆声传感器在电镀操作期间将声能以兆声频率施加到电池中的溶液，并且载体以合适的速度（例如45至60r.p.m）旋转。 提供快速排水以在电镀操作结束时快速地从电池中移除溶液，并且具有一系列喷嘴的一对喷射管用去离子水冲洗晶片。 电池底部的喷射器注入电镀溶液，电镀溶液通常以层流向上延伸，并溢出镀槽顶部的溢流道。 溢洪道包括一系列避免波浪或湍流的三角形齿。

公开(公告)号：US06319386B1

公开(公告)日：2001-11-20

申请号：US09497224

申请日：2000-02-03

申请人： H. Vincent Reynolds

发明人： H. Vincent Reynolds

IPC分类号： C25D520

CPC分类号： C23C18/1666 ,  C25D5/20 ,  C25D7/123 ,  C25D17/001

摘要： A megasonic plating technique employs a submerged megasonic transducer array (22) to create a ridge (38) of electrolyte that extends upward above a plating tray (12). A chuck (40) holds the substrate (42) so the face to be plated is oriented downwards. A controlled power supply (32) for the megasonic transducer array (22) energizes selected transducer cells (36) to create the ridge (38) of electrolyte and cause it to move or walk across the face of the substrate. This technique avoids need for drive mechanisms for either the tray (12) or the chuck (40). A annular anode element (24) may be positioned above the transducer array, and may be a consumable anode. This technique may be used for electroplating, electroless plating, or for other wet chemistry techniques such as planing or etching.

摘要翻译： 兆声波电镀技术采用浸没式超声波换能器阵列（22）来产生在电镀托盘（12）上方向上延伸的电解质脊（38）。 卡盘（40）保持基板（42），使被镀面朝下。 用于兆声换能器阵列（22）的受控电源（32）激励所选择的换能器单元（36）以产生电解质的脊（38）并使其移动或走过基板的表面。 这种技术避免了对托盘（12）或卡盘（40）的驱动机构的需要。 环形阳极元件（24）可以位于换能器阵列上方，并且可以是可消耗的阳极。 该技术可用于电镀，无电镀，或用于其它湿法化学技术，如刨光或蚀刻。

公开(公告)号：US6106690A

公开(公告)日：2000-08-22

申请号：US206728

申请日：1998-12-07

申请人： H. Vincent Reynolds

发明人： H. Vincent Reynolds

IPC分类号： H01L21/3063 ,  H01L21/00 ,  B23H3/00 ,  B23H7/26 ,  B23H11/00

CPC分类号： H01L21/67051

摘要： An electroplaning technique achieves superior flatness of the face of a wafer. A chuck holds the wafer so the face of the wafer is oriented downwards and lowers it to an electroplaner stage. The electroplaner includes an elongated, horizontally extending cup, an elongated horizontally extending nozzle within it. Electrolyte flows non-turbulently from an upper side of the nozzle to create a meniscus of electrolyte that contacts the wafer. The electroplaner moves transversely while the chuck is held steady so that said meniscus sweeps across the face of said wafer. A rinser of similar construction likewise has a meniscus or rinse that sweeps across the wafer. The nozzle can have a row of openings along its upper side, or may be formed at least in part of a microporous material. The wafer is electrically configured as cathode.

摘要翻译： 电镀技术实现了晶片表面的优异的平坦度。 卡盘夹持晶片，使得晶片的表面向下取向并将其降低到电极平台。 电解抛光机包括细长的水平延伸的杯，在其内的细长的水平延伸的喷嘴。 电解质从喷嘴的上侧非紊乱地流动，以产生接触晶片的电解液弯液面。 电摄影机横向移动，同时卡盘保持稳定，使得所述弯月面扫过所述晶片的表面。 类似结构的冲洗机同样具有扫过晶片的弯月面或冲洗液。 喷嘴可以沿其上侧具有一排开口，或者可以至少部分地由微孔材料形成。 晶片电气配置为阴极。

公开(公告)号：US5904827A

公开(公告)日：1999-05-18

申请号：US954239

申请日：1997-10-20

申请人： H. Vincent Reynolds

发明人： H. Vincent Reynolds

IPC分类号： C25D1/10 ,  C25D5/08 ,  C25D5/20 ,  C25D17/00 ,  C25D1/00

CPC分类号： C25D5/20 ,  C25D1/10 ,  C25D5/08

摘要： A plating cell for plating a flat substrate employs a sparger to introduce a flow of electrolyte or other plating solution across the surface of the substrate to be plated. A fluid-powered rotary blade or wiper within the cathode chamber has a rotary blade with an edge spaced a small distance, preferably about three-eighths inch, from the substrate, and an annular turbine which rotates under a flow of the electrolytic fluid that is also being fed to the sparger. The rotary wiper is run at a speed between about 35 and 80 rpm and draws the electrolyte away from the substrate. This helps remove hydrogen bubbles that form during electroplating. In addition, a megasonic transducer applies megasonic acoustic energy to the solution, e.g., at 0.2 to 5 MHz.

摘要翻译： 用于电镀平板基板的电镀槽采用喷射器，以在待镀的基板的表面上引入电解液或其它电镀液流。 阴极室内的流体动力旋转刀片或擦拭器具有旋转刀片，其具有与衬底间隔开小的距离，优选约三分之八英寸的边缘，以及在电解液的流动下旋转的环形涡轮机， 也被送到分布器。 旋转擦拭器以约35至80rpm之间的速度运行，并将电解质从基板吸出。 这有助于去除在电镀期间形成的氢气泡。 此外，兆声波换能器将超声波声能施加到溶液，例如以0.2至5MHz。