公开(公告)号：US11865663B2

公开(公告)日：2024-01-09

申请号：US16408571

申请日：2019-05-10

申请人： George Shuai ,  Gwo Shin Swei

发明人： George Shuai ,  Gwo Shin Swei

IPC分类号： B24D3/10 ,  B24B13/02 ,  B24B13/00 ,  B24B13/01 ,  B24B37/24 ,  B24D3/00 ,  C09K3/14 ,  C09G1/02

CPC分类号： B24B13/01 ,  B24B13/00 ,  B24B13/02 ,  B24B37/24 ,  B24D3/007 ,  B24D3/10 ,  C09G1/02 ,  C09K3/1409

摘要： A polishing pad or polishing tape with abrasive particles (e.g., diamond, aluminum-oxide, silicon-carbide, etc.) having an average particle size of between approximately 0.5 micrometers (μm) and 5.0 μm, which are strongly adhered with water-insoluble binders to a flexible and lens-conformable substrate having a cushion so that there is little-to-no shedding or release of the particles from the substrate.