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公开(公告)号:US20240157643A1
公开(公告)日:2024-05-16
申请号:US18236114
申请日:2023-08-21
发明人: John Sterle , Vadim Bromberg
IPC分类号: B29C64/307 , B29C64/214
CPC分类号: B29C64/307 , B29C64/214 , B33Y30/00
摘要: A build material escapement assembly for an additive manufacturing system includes a retaining plate for coupling the build material escapement assembly to the additive manufacturing system. A base having a plurality of ports is disposed beneath the retaining plate, and a support frame is disposed within the base. A diaphragm is disposed around the base, and a retractable plate is disposed between the support frame and the diaphragm. A top plate is further coupled to the retractable plate through the diaphragm and a plurality of connectors are coupled to the plurality of ports of the base. The base, support frame, diaphragm, retractable plate, and top plate define a cavity, and the top plate is movable between a retracted position by applying a negative pressure and an extended position by applying positive pressure to the cavity via the plurality of connectors.
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公开(公告)号:US20240017486A1
公开(公告)日:2024-01-18
申请号:US18033624
申请日:2021-10-25
发明人: John Sterle , Vadim Bromberg
IPC分类号: B29C64/209 , B29C64/25 , B29C64/295 , B29C64/165 , B29C64/364 , B33Y40/00 , B33Y10/00 , B33Y30/00
CPC分类号: B29C64/209 , B29C64/25 , B29C64/295 , B29C64/165 , B29C64/364 , B33Y40/00 , B33Y10/00 , B33Y30/00
摘要: Additive manufacturing assemblies, printing assemblies, and methods for utilizing same are provided. A method includes providing a linear traversing stage (212) movable in a direction transverse to a rail (104) extending along a working axis of the additive manufacturing apparatus, and coupling a printing assembly (150) to the linear traversing stage (212) such that the printing assembly is movable along the linear traversing stage in a direction transverse to the working axis. In embodiments, the printing assembly includes a housing (201) including a printing head (154). At least one adjustment member (232) may be extended or retracted through a yaw bar (224) to rotate the housing. In embodiments, a printing head receptacle (502) may be provided for coupling the printing assembly to the rail. In embodiments, the yaw bar (224) may be provided between the housing and the printing head receptacle (502) for rotating the printing assembly relative to the printing head receptacle.
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3.
公开(公告)号:US20230398740A1
公开(公告)日:2023-12-14
申请号:US18032259
申请日:2021-10-18
IPC分类号: B29C64/295 , B29C35/04 , B29C64/218 , B29C64/264
CPC分类号: B29C64/295 , B29C35/045 , B29C64/218 , B29C64/264 , B33Y10/00
摘要: A method for forming an object includes moving an assembly including an energy source, heating an initial layer of build material (31i, 31s, 31, 3, 50) positioned in a build area via forced convection around the energy source of the assembly, and spreading build material (31) on the build area, thereby depositing a second layer of build material (31i, 31s, 31, 3, 50) over the initial layer of build material (31 i, 31s, 31, 3, 50).
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公开(公告)号:US11806191B2
公开(公告)日:2023-11-07
申请号:US15984541
申请日:2018-05-21
发明人: Douglas Glenn Wildes , Lowell Scott Smith , Kwok Pong Chan , Vadim Bromberg , David Martin Mills , Warren Lee , Timothy James Fiorillo , Chi Tat Chiu
CPC分类号: A61B8/4488 , A61B8/4494 , A61B8/463 , A61B8/5207 , H01L21/78 , H10N30/063 , H10N30/20 , H10N30/872 , H10N39/00 , Y10T29/42
摘要: A grid of phased array transducers includes a piezoelectric layer and a plurality of ground contact traces. The piezoelectric layer includes a first side and a second side. The plurality of ground contact traces is disposed on the first side of the piezoelectric layer along an elevational direction, where each ground contact trace of the plurality of ground contact traces extends along an azimuthal direction. Further, each phased array transducer of the grid of phased array transducers is disposed between an adjacently disposed pair of ground contact traces of the plurality of ground contact traces. Moreover, each phased array transducer includes at least a portion of at least one ground contact trace of a corresponding pair of ground contact traces, and where each phased array transducer includes a plurality of transducer elements.
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公开(公告)号:US11673323B2
公开(公告)日:2023-06-13
申请号:US17326707
申请日:2021-05-21
CPC分类号: B29C64/165 , B33Y10/00 , B33Y70/10 , B33Y80/00 , C08K5/0041 , C09B57/00
摘要: A method of manufacturing a green body part comprises depositing a layer of a powder on a working surface; and selectively depositing a binder solution comprising a thermoplastic binder, a fluorescent material, and a binder medium into the layer of powder in a pattern representative of a structure of a layer of the green body part. The thermoplastic binder comprises one or more polymer strands dissolved in a solvent medium having an average molecular weight from greater than or equal to 7,000 g/mol to less than or equal to 100,000 g/mol. Binder solutions comprising fluorescent material and green body parts adhered together using the same are also disclosed.
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公开(公告)号:US20220314329A1
公开(公告)日:2022-10-06
申请号:US17608809
申请日:2020-05-22
发明人: Vadim Bromberg , John Sterle , Victor Fulton , Tyler Andrew Griffith , Peter Douglas Lueschen , Carlos H. Bonilla , Joseph L. Smolenski , Timothy Francis Andrews , Younkoo Jeong
IPC分类号: B22F12/00 , B33Y30/00 , B33Y40/00 , B33Y50/00 , B28B1/00 , B22F10/80 , B22F10/68 , B22F12/90 , B22F10/73 , B22F12/70
摘要: Additive manufacturing apparatuses are disclosed. In one embodiment, an additive manufacturing apparatus may comprise a support chassis including a print bay, a build bay, and a material supply bay. Each bay may comprise an upper compartment and a lower compartment. A working surface may separate each of the print bay, the build bay, and the material supply bay into the upper compartment and the lower compartment, wherein: the build bay may be disposed between the print bay and the material supply bay. The lower compartment of the build bay comprises bulkheads sealing the lower compartment of the build bay from the lower compartment of the print bay and the lower compartment of the material supply bay.
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公开(公告)号:US20220258236A1
公开(公告)日:2022-08-18
申请号:US17612492
申请日:2020-05-22
发明人: Timothy Francis Andrews , Carlos H. Bonilla , Vadim Bromberg , Victor Fulton , Tyler Andrew Griffith , Younkoo Jeong , John Sterle
摘要: Embodiments of the present disclosure are directed to additive manufacturing apparatuses, cleaning stations incorporated therein, and methods of cleaning using the cleaning stations.
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公开(公告)号:US20220242130A1
公开(公告)日:2022-08-04
申请号:US17612452
申请日:2020-05-22
发明人: William C. Alberts , Vadim Bromberg , Kwok Pong Chan , Robert Edgar Estes , Jacob Mayer , Joshua Tyler Mook , Janet Mekker , William Cosmo Murphy , Arunkumar Natarjan , Mary Kathryn Thompson , Xi Yang , Travis Sands
IPC分类号: B41J2/165 , C09D9/00 , C09D11/107 , C09D11/30
摘要: Embodiments of the present disclosure are directed to additive manufacturing apparatuses, cleaning stations incorporated therein, and methods of cleaning using the cleaning stations.
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公开(公告)号:US20220134668A1
公开(公告)日:2022-05-05
申请号:US17509692
申请日:2021-10-25
发明人: Timothy Francis Andrews , Victor Fulton , Glen Charles Fedyk , Carlos H. Bonilla , Jacob Mayer , John Sterle , Vadim Bromberg
摘要: Embodiments of the present disclosure are directed to additive manufacturing apparatuses, cleaning stations incorporated therein, and methods of cleaning using the cleaning stations.
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公开(公告)号:US10918356B2
公开(公告)日:2021-02-16
申请号:US15358160
申请日:2016-11-22
发明人: Vadim Bromberg , Lowell Scott Smith , Douglas Glenn Wildes , Kwok Pong Chan , Reinhold Bruestle , Matthew Harvey Krohn , Chester Frank Saj
摘要: An ultrasound transducer includes a transducer array having a plurality of transducer elements. The transducer array has a first side and a second side. Further, one or more ground electrodes are disposed on the first side of the transducer array, and one or more signal electrodes are disposed on the second side of the transducer array. Moreover, an acoustic backing structure is operatively coupled to the plurality of transducer elements of the transducer array. Also, a plurality of electrical traces is routed on a surface of the acoustic backing structure and operatively coupled to at least one of the one or more signal electrodes and one or more ground electrodes.
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