公开(公告)号：US20150298288A1

公开(公告)日：2015-10-22

申请号：US14254052

申请日：2014-04-16

Applicant: General Electric Company

Inventor： Blake Allen Fulton ,  Michael Anthony DePalma ,  Craig Lowell Sarratt ,  Ryan Jeffrey Cardillo

IPC: B24B49/02 ,  F01D5/00 ,  B24B49/16 ,  B23P6/00 ,  B24B19/14 ,  B24B49/00

CPC classification number: B24B49/02 ,  B08B1/04 ,  B23P6/00 ,  B23P6/002 ,  B24B7/20 ,  B24B19/14 ,  B24B19/22 ,  B24B27/033 ,  B24B49/00 ,  B24B49/006 ,  B24B49/16 ,  F01D5/005 ,  F01D5/288

Abstract: A system for use in removing a multi-layer coating from a substrate is provided. The multi-layer coating includes a first coating applied to the substrate and a second coating applied over the first coating. The first coating is formed from a first material and the second coating is formed from a second material different from the first material. The system includes a grinding mechanism configured to remove the multi-layer coating from the substrate, and a controller coupled in communication with the grinding mechanism. The controller is configured to position the grinding mechanism against the multi-layer coating, initiate a first removal mode that directs the grinding mechanism to traverse across the substrate, monitor a variable operating parameter of the grinding mechanism during the first removal mode, and evaluate a value of the variable operating parameter against a predetermined threshold to determine whether the second coating has been removed from the substrate.

Abstract translation: 提供了一种用于从基板去除多层涂层的系统。 多层涂层包括施加到基底的第一涂层和施加在第一涂层上的第二涂层。 第一涂层由第一材料形成，第二涂层由不同于第一材料的第二材料形成。 该系统包括被配置为从衬底去除多层涂层的研磨机构，以及与磨削机构连通的控制器。 所述控制器被配置成将所述研磨机构定位在所述多层涂层上，启动引导所述研磨机构穿过所述基板的第一移除模式，在所述第一移除模式期间监测所述研磨机构的可变操作参数，并评估 所述可变操作参数的值相对于预定阈值来确定所述第二涂层是否已经从所述基板移除。

公开(公告)号：US09358663B2

公开(公告)日：2016-06-07

申请号：US14254052

申请日：2014-04-16

Applicant: General Electric Company

Inventor： Blake Allen Fulton ,  Michael Anthony DePalma ,  Craig Lowell Sarratt ,  Ryan Jeffrey Cardillo

IPC: B24B49/02 ,  B08B1/04 ,  B24B19/22 ,  B24B27/033 ,  B23P6/00 ,  B24B49/00 ,  B24B7/20 ,  B24B19/14 ,  B24B49/16 ,  F01D5/00 ,  F01D5/28

CPC classification number: B24B49/02 ,  B08B1/04 ,  B23P6/00 ,  B23P6/002 ,  B24B7/20 ,  B24B19/14 ,  B24B19/22 ,  B24B27/033 ,  B24B49/00 ,  B24B49/006 ,  B24B49/16 ,  F01D5/005 ,  F01D5/288

Abstract: A system for use in removing a multi-layer coating from a substrate is provided. The multi-layer coating includes a first coating applied to the substrate and a second coating applied over the first coating. The first coating is formed from a first material and the second coating is formed from a second material different from the first material. The system includes a grinding mechanism configured to remove the multi-layer coating from the substrate, and a controller coupled in communication with the grinding mechanism. The controller is configured to position the grinding mechanism against the multi-layer coating, initiate a first removal mode that directs the grinding mechanism to traverse across the substrate, monitor a variable operating parameter of the grinding mechanism during the first removal mode, and evaluate a value of the variable operating parameter against a predetermined threshold to determine whether the second coating has been removed from the substrate.

Abstract translation: 提供了一种用于从基板去除多层涂层的系统。 多层涂层包括施加到基底的第一涂层和施加在第一涂层上的第二涂层。 第一涂层由第一材料形成，第二涂层由不同于第一材料的第二材料形成。 该系统包括被配置为从衬底去除多层涂层的研磨机构，以及与磨削机构连通的控制器。 所述控制器被配置成将所述研磨机构定位在所述多层涂层上，启动引导所述研磨机构穿过所述基板的第一移除模式，在所述第一移除模式期间监测所述研磨机构的可变操作参数，并评估 所述可变操作参数的值相对于预定阈值来确定所述第二涂层是否已经从所述基板移除。