公开(公告)号：US10085363B2

公开(公告)日：2018-09-25

申请号：US14285034

申请日：2014-05-22

Applicant: General Electric Company

Inventor： Gamal Refai-Ahmed ,  Hendrik Pieter Jacobus de Bock ,  Yogen Vishwas Utturkar ,  Matthew A. Ferguson ,  Bryan Patrick Whalen ,  Christian M. Giovanniello

IPC: F28F7/00 ,  H05K5/00 ,  H05K7/20 ,  B23P15/26 ,  H01L23/467

CPC classification number: H05K7/20272 ,  B23P15/26 ,  H01L23/467 ,  H01L2924/0002 ,  H05K7/20263 ,  Y10T29/49352 ,  H01L2924/00

Abstract: A thermal management system that provides cooling to an electronic device is disclosed. The thermal management system includes a surface having a plurality of extended elements thermally coupled to the surface, a plurality of vibrator assemblies configured to generate a cooling flow across the surface, and a mounting structure disposed atop the plurality of extended elements of the surface to position the plurality of vibrator assemblies relative to the surface. The mounting structure is configured to orient each of the plurality of vibrator assemblies to the surface at an angel, such that the cooling flow generated by the plurality of vibrator assemblies impinges on the extended elements at an angle.

公开(公告)号：US20150342088A1

公开(公告)日：2015-11-26

申请号：US14285034

申请日：2014-05-22

Applicant: General Electric Company

Inventor： Gamal Refai-Ahmed ,  Hendrik Pieter Jacobus de Bock ,  Yogen Vishwas Utturkar ,  Matthew A. Ferguson ,  Bryan Patrick Whalen ,  Christian M. Giovanniello

IPC: H05K7/20 ,  B23P15/26

CPC classification number: H05K7/20272 ,  B23P15/26 ,  H01L23/467 ,  H01L2924/0002 ,  H05K7/20263 ,  Y10T29/49352 ,  H01L2924/00

Abstract: A thermal management system that provides cooling to an electronic device is disclosed. The thermal management system includes a surface having a plurality of extended elements thermally coupled to the surface, a plurality of vibrator assemblies configured to generate a cooling flow across the surface, and a mounting structure disposed atop the plurality of extended elements of the surface to position the plurality of vibrator assemblies relative to the surface. The mounting structure is configured to orient each of the plurality of vibrator assemblies to the surface at an angel, such that the cooling flow generated by the plurality of vibrator assemblies impinges on the extended elements at an angle.

Abstract translation: 公开了一种向电子设备提供冷却的热管理系统。 热管理系统包括具有热耦合到表面的多个延伸元件的表面，多个振动器组件，其构造成产生跨过该表面的冷却流，以及安装结构，其布置在表面的多个延伸元件顶部到位置 所述多个振动器组件相对于所述表面。 安装结构构造成使得多个振动器组件中的每一个以一个角度定向到该表面，使得由多个振动器组件产生的冷却流以一定角度撞击在延伸元件上。