公开(公告)号：US11338449B2

公开(公告)日：2022-05-24

申请号：US16030340

申请日：2018-07-09

Applicant: GRABIT, INC.

Inventor： Harsha Prahlad ,  Richard J. Casler ,  Susan Kim ,  Matthew Leettola ,  Jon Smith ,  Kenneth Tan ,  Patrick Wang ,  John Mathew Farren ,  Patrick Conall Regan ,  Po Cheng Chen ,  Howard Fu ,  Dragan Jurkovic ,  Aishwarya Varadhan ,  Chang-Chu Liao ,  Chih-Chi Chang ,  Kuo-Hung Lee ,  Ming-Feng Jean

IPC: B25J15/00 ,  B25J9/00 ,  B25J19/02 ,  B25J15/06 ,  B25J9/16 ,  B23P19/00 ,  B32B37/18 ,  B25H1/20 ,  H02N13/00 ,  B23P21/00 ,  B32B38/18 ,  A43D111/00

Abstract: Systems, apparatus, and methods of manufacturing an article using electroadhesion technology for the pick-up and release of materials, respectively.

公开(公告)号：US10987815B2

公开(公告)日：2021-04-27

申请号：US16030497

申请日：2018-07-09

Applicant: GRABIT, INC.

Inventor： Harsha Prahlad ,  Richard J. Casler ,  Susan Kim ,  Matthew Leettola ,  Jon Smith ,  Kenneth Tan ,  Patrick Wang ,  John Mathew Farren ,  Patrick Conall Regan ,  Po Cheng Chen ,  Howard Fu ,  Honam Ko ,  Dragan Jurkovic ,  Aishwarya Varadhan ,  Tsung Tai Chien ,  Chang-Chu Liao ,  Chih-Chi Chang ,  Kuo-Hung Lee ,  Ming-Feng Jean ,  TaeHoun Kim ,  Qingde Chen ,  Greg Miller

IPC: B25J15/00 ,  B25J15/06 ,  H02N13/00 ,  B25J9/00 ,  B25J19/02 ,  B25J9/16 ,  H05K13/02 ,  H05K13/04 ,  B23P19/00 ,  B32B37/18 ,  A43D111/00 ,  B23P21/00 ,  H01L21/683 ,  B32B38/18

Abstract: Systems, apparatus, and methods of manufacturing an article using electroadhesion technology, either as a sole modality of handling such materials or in concert with at least one mechanically actuated modality for the pick-up and release of materials, respectively. The mechanically actuated modality in one embodiment is configured as a netting configured to be placed over a contact surface of an electroadhesive plate to facilitate the handling of an object.

公开(公告)号：US11203123B2

公开(公告)日：2021-12-21

申请号：US16030707

申请日：2018-07-09

Applicant: GRABIT, INC.

Inventor： Harsha Prahlad ,  Richard J. Casler ,  Susan Kim ,  Matthew Leettola ,  Jon Smith ,  Kenneth Tan ,  Patrick Wang ,  John Mathew Farren ,  Patrick Conall Regan ,  Po Cheng Chen ,  Honam Ko ,  Dragan Jurkovic ,  Aishwarya Varadhan ,  Tsung Tai Chien ,  Chang-Chu Liao ,  Chih-Chi Chang ,  Kuo-Hung Lee ,  TaeHoun Kim

IPC: B25J15/00 ,  B25J15/06 ,  B25J9/16 ,  B23P19/00 ,  A43D111/00 ,  B23P21/00 ,  B25J9/00 ,  B25J19/02 ,  B32B37/18 ,  H02N13/00 ,  H01L21/683 ,  B32B38/18

Abstract: Systems, apparatus, and methods of manufacturing an article using electroadhesion technology, either as a sole modality of handling such materials or in concert with vacuum for the pick up and release of materials, respectively.