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公开(公告)号:US12035092B2
公开(公告)日:2024-07-09
申请号:US17834635
申请日:2022-06-07
发明人: Amanda Lind , Sally Abolitz
CPC分类号: H04R1/086 , B81B7/0058 , B81B7/0061 , B81C1/00309 , H04R1/04 , H04R3/00 , H04R19/04 , B81B2201/0257 , B81B2203/0127 , B81C2203/0109 , H04R3/005 , H04R3/007 , H04R2201/003 , H04R2499/13
摘要: The disclosed technology provides solutions for preventing the ingress of potentially harmful materials, such as moisture and debris, into a sensor housing. In some aspects, an ingress-protection sub-assembly is provided. The sub-assembly can include a t-protector mounted to an outer surface of a face-plate, wherein the t-protector is disposed above an inlet in the face-plate, a printed circuit board (PCB) mounted to an inner surface of the face-plate, and a membrane disposed between the PCB and the face-plate. Methods for assembling and mounting a sub-assembly are also provided.
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公开(公告)号:US20240080631A1
公开(公告)日:2024-03-07
申请号:US17939700
申请日:2022-09-07
发明人: Anurup Guha , Amanda Lind , Sally Abolitz
CPC分类号: H04R19/04 , B81B7/0058 , H04R1/04 , H04R1/086 , H04R1/406 , B60W60/00 , B81B2201/0257 , H04R2201/003 , H04R2499/13
摘要: Aspects of the present disclosure relate to sealing and protecting micro-electromechanical systems (MEMS) microphones. In some cases, a MEMS microphone protection apparatus may include a housing, at least one acoustic port extending through the housing providing an aperture; and at least one membrane positioned within the at least one acoustic port. In some examples, the membrane can seal the at least one acoustic port.
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公开(公告)号:US20230396908A1
公开(公告)日:2023-12-07
申请号:US17834635
申请日:2022-06-07
发明人: Amanda Lind , Sally Abolitz
CPC分类号: H04R1/086 , B81B7/0058 , B81B7/0061 , B81C1/00309 , H04R19/04 , H04R3/00 , H04R1/04 , H04R2201/003 , H04R3/007 , H04R3/005 , B81B2201/0257 , B81B2203/0127 , B81C2203/0109 , H04R2499/13
摘要: The disclosed technology provides solutions for preventing the ingress of potentially harmful materials, such as moisture and debris, into a sensor housing. In some aspects, an ingress-protection sub-assembly is provided. The sub-assembly can include a t-protector mounted to an outer surface of a face-plate, wherein the t-protector is disposed above an inlet in the face-plate, a printed circuit board (PCB) mounted to an inner surface of the face-plate, and a membrane disposed between the PCB and the face-plate. Methods for assembling and mounting a sub-assembly are also provided.
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