Integrating optimal planar and three-dimensional semiconductor design layouts
    1.
    发明授权
    Integrating optimal planar and three-dimensional semiconductor design layouts 有权
    整合最优平面和三维半导体设计布局

    公开(公告)号:US08966423B2

    公开(公告)日:2015-02-24

    申请号:US13792946

    申请日:2013-03-11

    IPC分类号: G06F17/50

    CPC分类号: G06F17/5072 Y02T10/82

    摘要: An approach and apparatus are provided for optimizing and combining different semiconductor technologies into a single graphic data system. Embodiments include generating a planar semiconductor layout design, generating a three-dimensional (e.g., FinFET) semiconductor layout design, and combining the planar design and the FinFET design in a common graphic data system.

    摘要翻译: 提供了将不同半导体技术优化并组合成单个图形数据系统的方法和装置。 实施例包括生成平面半导体布局设计,产生三维(例如,FinFET)半导体布局设计,以及将平面设计和FinFET设计组合在通用图形数据系统中。