-
公开(公告)号：US10746479B2
公开(公告)日：2020-08-18
申请号：US16034050
申请日：2018-07-12
Applicant: General Electric Company
Inventor： Brian Magann Rush , Daniel Jason Erno , Thomas Adcock , Stefano Angelo Mario Lassini
IPC: F28F7/00 , F28D15/04 , B33Y80/00 , B64G1/50 , H01L23/427 , B23K26/342 , B33Y10/00 , F28D21/00
Abstract: A cooling assembly includes walls extending around and defining an enclosed vapor chamber that holds a working fluid. An interior porous wick structure is disposed inside the chamber and lines interior surfaces of the walls. The wick structure includes pores that hold a liquid phase of the working fluid. The cooling assembly also includes an exterior porous wick structure lining exterior surfaces of the walls outside of the vapor chamber. The exterior wick structure includes pores that hold a liquid phase of a cooling fluid outside the vapor chamber. The interior wick structure holds the liquid working fluid until heat from an external heat source vaporizes the working fluid inside the vapor chamber. The exterior wick structure holds the liquid fluid outside the vapor chamber until heat from inside the vapor chamber vaporizes the liquid cooling fluid in the exterior wick structure for transferring heat away from the heat source.
-
公开(公告)号：US20150041104A1
公开(公告)日：2015-02-12
申请号：US13963473
申请日：2013-08-09
Applicant: GE Aviation Systems, LLC , General Electric Company
Inventor： Hendrik Pieter Jacobus De Bock , William Dwight Gerstler , Jonathan Mark Dunsdon , Stefano Angelo Mario Lassini , William Earl Gross, JR. , Delbert Warren Flaherty , Randall Lee Neuman , Christina Clyde Schroeder
CPC classification number: B05B17/0653 , F04D33/00 , H05K7/20172
Abstract: A modular synthetic cooling jet apparatus for cooling at least one electronic component and including a first synthetic cooling jet is provided. The first synthetic cooling jet includes a first piezoelectric element, and a first pair of plates coupled to the first piezoelectric element. The first pair of plates includes a first top plate and a first bottom plate. The first synthetic cooling jet also includes a first air gap defined between the first top plate and the first bottom plate. The first flex circuit is coupled to the first piezoelectric element. The first flex circuit is configured to be coupled to an electrical power source and to transmit a first electrical signal to the first piezoelectric element. The first piezoelectric element is configured to actuate at least one of the first top plate and the first bottom plate to induce a first expelling air stream.
Abstract translation: 提供一种用于冷却至少一个电子部件并包括第一合成冷却射流的模块化合成冷却喷射装置。 第一合成冷却射流包括第一压电元件和耦合到第一压电元件的第一对板。 第一对板包括第一顶板和第一底板。 第一合成冷却射流还包括限定在第一顶板和第一底板之间的第一气隙。 第一柔性电路耦合到第一压电元件。 第一柔性电路被配置为耦合到电源并且将第一电信号传输到第一压电元件。 第一压电元件构造成致动第一顶板和第一底板中的至少一个以引导第一排出气流。
-
公开(公告)号：US10660236B2
公开(公告)日：2020-05-19
申请号：US14592387
申请日：2015-01-08
Applicant: GENERAL ELECTRIC COMPANY
Inventor： Brian Magann Rush , William Dwight Gerstler , Stefano Angelo Mario Lassini , Todd Garrett Wetzel
Abstract: According to one embodiment, a thermal management system for electronic devices, including a heat frame, a conformal slot portion, chassis frame, and heat fins wherein the heat frame, conformal slot, chassis frame, and heat fins are integrally formed as a unitary structure by additive manufacturing. In another example, there is a modular vapor assembly for electronic components having a vapor chamber comprising a component surface and a top surface with a vapor channel formed therebetween with at least one liquid receptacle and having a wick structure on at least some of an interior of the component surface. In operation, there is a circuit card with at least some of the electronic components coupled to the vapor chamber component surface and the wick structures transfer at least some of the liquid from the receptacle towards the electronic components, wherein the liquid turns to a vapor that moves towards the receptacle.
-
公开(公告)号：US20180049307A1
公开(公告)日：2018-02-15
申请号：US15237054
申请日：2016-08-15
Applicant: General Electric Company
CPC classification number: H05K1/0203 , H05K5/0256 , H05K7/20309 , H05K7/2039 , H05K7/20672
Abstract: An electronic system includes a chassis. The chassis includes a first endwall, a second endwall, and a sidewall. The electronic system also includes at least one circuit card cartridge coupled to the chassis. The at least one circuit card cartridge is positioned between the first endwall and the second endwall. The at least one circuit card cartridge includes a printed circuit board including a first surface and at least one electronic component. The at least one electronic component is mounted on the first surface. The at least one circuit card cartridge further includes at least one heat transfer assembly coupled to the printed circuit board. The at least one heat transfer assembly is configured to contact the at least one electronic component and extend adjacent the printed circuit board across the first surface.
-
公开(公告)号：US20250048594A1
公开(公告)日：2025-02-06
申请号：US18919998
申请日：2024-10-18
Applicant: General Electric Company
Inventor： Brian Magann Rush , William Dwight Gerstler , Stefano Angelo Mario Lassini , Todd Garrett Wetzel
Abstract: According to one embodiment, a thermal management system for electronic devices, including a heat frame, a conformal slot portion, chassis frame, and heat fins wherein the heat frame, conformal slot, chassis frame, and heat fins are integrally formed as a unitary structure by additive manufacturing. In another example, there is a modular vapor assembly for electronic components having a vapor chamber comprising a component surface and a top surface with a vapor channel formed therebetween with at least one liquid receptacle and having a wick structure on at least some of an interior of the component surface. In operation, there is a circuit card with at least some of the electronic components coupled to the vapor chamber component surface and the wick structures transfer at least some of the liquid from the receptacle towards the electronic components, wherein the liquid turns to a vapor that moves towards the receptacle.
-
Patent Agency Ranking
公开(公告)号：US12150279B2
公开(公告)日：2024-11-19
申请号：US16845381
申请日：2020-04-10
Applicant: General Electric Company
Inventor： Brian Magann Rush , William Dwight Gerstler , Stefano Angelo Mario Lassini , Todd Garrett Wetzel
Abstract: According to one embodiment, a thermal management system for electronic devices, including a heat frame, a conformal slot portion, chassis frame, and heat fins wherein the heat frame, conformal slot, chassis frame, and heat fins are integrally formed as a unitary structure by additive manufacturing. In another example, there is a modular vapor assembly for electronic components having a vapor chamber comprising a component surface and a top surface with a vapor channel formed therebetween with at least one liquid receptacle and having a wick structure on at least some of an interior of the component surface. In operation, there is a circuit card with at least some of the electronic components coupled to the vapor chamber component surface and the wick structures transfer at least some of the liquid from the receptacle towards the electronic components, wherein the liquid turns to a vapor that moves towards the receptacle.
-
公开(公告)号：US11428475B2
公开(公告)日：2022-08-30
申请号：US16923080
申请日：2020-07-08
Applicant: General Electric Company
Inventor： Brian Magann Rush , Daniel Jason Erno , Thomas Adcock , Stefano Angelo Mario Lassini
IPC: F28D15/00 , F28D15/04 , B33Y80/00 , B64G1/50 , H01L23/427 , B23K26/342 , B33Y10/00 , F28D21/00
Abstract: A cooling assembly includes walls extending around and defining an enclosed vapor chamber that holds a working fluid. An interior porous wick structure is disposed inside the chamber and lines interior surfaces of the walls. The wick structure includes pores that hold a liquid phase of the working fluid. The cooling assembly also includes an exterior porous wick structure lining exterior surfaces of the walls outside of the vapor chamber. The exterior wick structure includes pores that hold a liquid phase of a cooling fluid outside the vapor chamber. The interior wick structure holds the liquid working fluid until heat from an external heat source vaporizes the working fluid inside the vapor chamber. The exterior wick structure holds the liquid fluid outside the vapor chamber until heat from inside the vapor chamber vaporizes the liquid cooling fluid in the exterior wick structure for transferring heat away from the heat source.
-
公开(公告)号：US20200281095A1
公开(公告)日：2020-09-03
申请号：US16845381
申请日：2020-04-10
Applicant: General Electric Company
Inventor： Brian Magann Rush , William Dwight Gerstler , Stefano Angelo Mario Lassini , Todd Garrett Wetzel
Abstract: According to one embodiment, a thermal management system for electronic devices, including a heat frame, a conformal slot portion, chassis frame, and heat fins wherein the heat frame, conformal slot, chassis frame, and heat fins are integrally formed as a unitary structure by additive manufacturing. In another example, there is a modular vapor assembly for electronic components having a vapor chamber comprising a component surface and a top surface with a vapor channel formed therebetween with at least one liquid receptacle and having a wick structure on at least some of an interior of the component surface. In operation, there is a circuit card with at least some of the electronic components coupled to the vapor chamber component surface and the wick structures transfer at least some of the liquid from the receptacle towards the electronic components, wherein the liquid turns to a vapor that moves towards the receptacle.
-
9.发明申请公开(公告)号：US20150289413A1
公开(公告)日：2015-10-08
申请号：US14592387
申请日：2015-01-08
Applicant: GENERAL ELECTRIC COMPANY
Inventor： Brian Magann Rush , William Dwight Gerstler , Stefano Angelo Mario Lassini , Todd Garrett Wetzel
IPC: H05K7/20
Abstract: According to one embodiment, a thermal management system for electronic devices, including a heat frame, a conformal slot portion, chassis frame, and heat fins wherein the heat frame, conformal slot, chassis frame, and heat fins are integrally formed as a unitary structure by additive manufacturing. In another example, there is a modular vapor assembly for electronic components having a vapor chamber comprising a component surface and a top surface with a vapor channel formed therebetween with at least one liquid receptacle and having a wick structure on at least some of an interior of the component surface. In operation, there is a circuit card with at least some of the electronic components coupled to the vapor chamber component surface and the wick structures transfer at least some of the liquid from the receptacle towards the electronic components, wherein the liquid turns to a vapor that moves towards the receptacle.
Abstract translation: 根据一个实施例，一种用于电子设备的热管理系统，包括加热框架，保形槽部分，底架框架和散热片，其中加热框架，保形槽，底架框架和散热片整体形成为一体结构 通过添加剂制造。 在另一示例中，存在用于电子部件的模块化蒸汽组件，其具有包括部件表面的蒸气室和具有形成在其间的蒸气通道的顶表面，其具有至少一个液体容器，并且在至少一个液体容器的至少一部分的内部具有芯结构 组件表面。 在操作中，存在电路卡，其中至少一些电子部件耦合到蒸气室部件表面，并且芯结构将至少一些液体从容器转移到电子部件，其中液体转变为蒸汽， 朝向插座移动。
-
10.发明申请公开(公告)号：US20200333084A1
公开(公告)日：2020-10-22
申请号：US16923080
申请日：2020-07-08
Applicant: General Electric Company
Inventor： Brian Magann Rush , Daniel Jason Erno , Thomas Adcock , Stefano Angelo Mario Lassini
IPC: F28D15/04 , B33Y80/00 , B64G1/50 , H01L23/427
Abstract: A cooling assembly includes walls extending around and defining an enclosed vapor chamber that holds a working fluid. An interior porous wick structure is disposed inside the chamber and lines interior surfaces of the walls. The wick structure includes pores that hold a liquid phase of the working fluid. The cooling assembly also includes an exterior porous wick structure lining exterior surfaces of the walls outside of the vapor chamber. The exterior wick structure includes pores that hold a liquid phase of a cooling fluid outside the vapor chamber. The interior wick structure holds the liquid working fluid until heat from an external heat source vaporizes the working fluid inside the vapor chamber. The exterior wick structure holds the liquid fluid outside the vapor chamber until heat from inside the vapor chamber vaporizes the liquid cooling fluid in the exterior wick structure for transferring heat away from the heat source.
-
-
-
-
-
-
-
-
-
Search Results
12
records
(took 0.013 seconds)
