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公开(公告)号：US09187816B2
公开(公告)日：2015-11-17
申请号：US13669754
申请日：2012-11-06
Applicant: GENERAL ELECTRIC COMPANY
Inventor： Stephen Gerard Pope , Dennis William Cavanaugh , John Gregory Obeirne , Eric Eicher McConnell , Mark Lawrence Hunt , Canan Hardwicke
CPC classification number: C23C10/18 , C23C10/20 , C23C10/28 , C23C10/60 , F23C2900/07001 , F23D2212/00 , F23D2900/14004 , F23R3/286 , F23R2900/00018 , F23R2900/00019
Abstract: Methods of reducing an initial cross-sectional area of a hole in a component to a predetermined cross-sectional area including preparing a composition comprising at least an aluminum alloy with a melting temperature higher than aluminum, applying the composition to an interior surface of the hole, and then heating the component to cause a metal within the component to diffuse from the component into the composition and react with the aluminum alloy in the composition to form a coating on the interior surface of the hole. The heating step is performed to selectively modify the initial cross-sectional area of the hole and thereby directly attain the predetermined cross-sectional area thereof.
Abstract translation: 将组件中的孔的初始横截面积减小到预定横截面积的方法包括制备至少包含熔融温度高于铝的铝合金的组合物，将该组合物施加到孔的内表面 ，然后加热组分以使组分内的金属从组分扩散到组合物中并与组合物中的铝合金反应，以在孔的内表面上形成涂层。 执行加热步骤以选择性地修改孔的初始横截面积，从而直接达到其预定的横截面面积。
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公开(公告)号：US09956637B2
公开(公告)日：2018-05-01
申请号：US14860199
申请日：2015-09-21
Applicant: GENERAL ELECTRIC COMPANY
Inventor： Dechao Lin , John Gregory Obeirne , David Vincent Bucci , Srikanth Chandrudu Kottilingam , Yan Cui
IPC: B23K9/04 , B23K9/173 , B23K9/28 , B23K9/29 , B23K9/32 , B23K9/16 , B23K37/00 , B23P6/00 , F01D5/00 , B23K101/00
CPC classification number: B23K9/044 , B23K9/04 , B23K9/164 , B23K9/173 , B23K9/285 , B23K9/291 , B23K9/32 , B23K9/324 , B23K37/003 , B23K2101/001 , B23P6/007 , F01D5/005 , F05D2230/233
Abstract: A system and method for repairing a metal substrate includes an electrospark device and an electrode removably supported in the electrode holder. The electrospark device applies a coating of a material when placed into contact with the metal substrate. A cooling device to lowers the temperature of shielding gas flow below an ambient temperature. A conduit is arranged to direct a flow of the shielding gas to the interface of the electrode and the substrate to cool the area of the substrate receiving the coating.
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公开(公告)号：US20140124100A1
公开(公告)日：2014-05-08
申请号：US13669754
申请日：2012-11-06
Applicant: GENERAL ELECTRIC COMPANY
Inventor： Stephen Gerard Pope , Dennis William Cavanaugh , John Gregory Obeirne , Eric Eicher McConnell , Mark Lawrence Hunt , Canan Hardwicke
CPC classification number: C23C10/18 , C23C10/20 , C23C10/28 , C23C10/60 , F23C2900/07001 , F23D2212/00 , F23D2900/14004 , F23R3/286 , F23R2900/00018 , F23R2900/00019
Abstract: Methods of reducing an initial cross-sectional area of a hole in a component to a predetermined cross-sectional area including preparing a composition comprising at least an aluminum alloy with a melting temperature higher than aluminum, applying the composition to an interior surface of the hole, and then heating the component to cause a metal within the component to diffuse from the component into the composition and react with the aluminum alloy in the composition to form a coating on the interior surface of the hole. The heating step is performed to selectively modify the initial cross-sectional area of the hole and thereby directly attain the predetermined cross-sectional area thereof.
Abstract translation: 将组件中的孔的初始横截面积减小到预定横截面积的方法包括制备至少包含熔融温度高于铝的铝合金的组合物，将该组合物施加到孔的内表面 ，然后加热组分以使组分内的金属从组分扩散到组合物中并与组合物中的铝合金反应，以在孔的内表面上形成涂层。 执行加热步骤以选择性地修改孔的初始横截面积，从而直接达到其预定的横截面面积。
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