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公开(公告)号:US09603574B2
公开(公告)日:2017-03-28
申请号:US14574050
申请日:2014-12-17
Applicant: GENERAL ELECTRIC COMPANY
Inventor: James Wilson Rose , Donna Marie Sherman , Jeffrey Scott Erlbaum
Abstract: The present disclosure relates to the fabrication of electrical components and, in particular to the use of a reconfigurable substrate to which a flexible circuit may be affixed. In certain embodiments, the reconfigurable substrate may be moved between different configurations, certain of which are suitable for fabrication and certain of which are suitable for operation.
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公开(公告)号:US20160183365A1
公开(公告)日:2016-06-23
申请号:US14574050
申请日:2014-12-17
Applicant: GENERAL ELECTRIC COMPANY
Inventor: James Wilson Rose , Donna Marie Sherman , Jeffrey Scott Erlbaum
Abstract: The present disclosure relates to the fabrication of electrical components and, in particular to the use of a reconfigurable substrate to which a flexible circuit may be affixed. In certain embodiments, the reconfigurable substrate may be moved between different configurations, certain of which are suitable for fabrication and certain of which are suitable for operation.
Abstract translation: 本公开涉及电气部件的制造,特别是涉及可以将柔性电路固定到其上的可重新配置的基板的使用。 在某些实施例中,可重新配置的衬底可以在不同配置之间移动,其中某些构造适合于制造,并且其中某些适合于操作。
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