Contactless microstrip to waveguide transition

    公开(公告)号:US11959954B2

    公开(公告)日:2024-04-16

    申请号:US17285125

    申请日:2019-09-19

    Applicant: GAPWAVES AB

    CPC classification number: G01R29/10 H01P5/107 H01Q9/0407 H01Q21/005 H01Q13/10

    Abstract: A microstrip to waveguide transition comprising a waveguide module and a section of printed circuit board (PCB). The waveguide module comprises a waveguide aperture and a repetitive structure, the waveguide aperture being arranged extending through the module for attaching a waveguide to an external side of the module, the repetitive structure comprising a plurality of protruding elements arranged to surround the waveguide aperture on an internal side of the module and to define a passage into the waveguide aperture on the internal side, wherein the repetitive structure is configured to attenuate electromagnetic signal propagation in a frequency band past the repetitive structure while allowing propagation via the passage, the transition further comprising a PCB with a patch antenna connected to a transmission line and arranged to face the passage into the waveguide aperture.

    Scalable modular antenna arrangement

    公开(公告)号:US11978957B2

    公开(公告)日:2024-05-07

    申请号:US17796435

    申请日:2021-01-12

    Applicant: GAPWAVES AB

    Abstract: An antenna arrangement having a stacked layered structure. The antenna arrangement includes a radiation layer including one or more radiation elements, and a distribution layer facing the radiation layer. The distribution layer is arranged to distribute a radio frequency signal to the one or more radiation elements. The distribution layer includes at least one distribution layer feed and a first electromagnetic bandgap, EBG, structure arranged to form at least one first waveguide intermediate the distribution layer and the radiation layer. The first EBG structure is also arranged to prevent electromagnetic propagation in a frequency band of operation from propagating from the at least one first waveguide in directions other than through the at least one distribution layer feed and the one or more radiation elements. The distribution layer includes a plurality of distribution modules and a positioning structure, the positioning structure is arranged to fix the distribution modules in position.

    Contactless microstrip to waveguide transition

    公开(公告)号:US12163991B2

    公开(公告)日:2024-12-10

    申请号:US18601799

    申请日:2024-03-11

    Applicant: GAPWAVES AB

    Abstract: A micro strip to waveguide transition comprising a waveguide module and a section of printed circuit board (PCB). The waveguide module comprises a waveguide aperture and a repetitive structure, the waveguide aperture being arranged extending through the module for attaching a waveguide to an external side of the module, the repetitive structure comprising a plurality of protruding elements arranged to surround the waveguide aperture on an internal side of the module and to define a passage into the waveguide aperture on the internal side, wherein the repetitive structure is configured to attenuate electromagnetic signal propagation in a frequency band past the repetitive structure while allowing propagation via the passage, the transition further comprising a PCB with a patch antenna connected to a transmission line and arranged to face the passage into the waveguide aperture.

Patent Agency Ranking