公开(公告)号：US07803660B2

公开(公告)日：2010-09-28

申请号：US12330739

申请日：2008-12-09

申请人： Fumio Murakami ,  Kenichi Imura ,  Makoto Araki

发明人： Fumio Murakami ,  Kenichi Imura ,  Makoto Araki

IPC分类号： H01L21/00

CPC分类号： H01L24/97 ,  H01L21/565 ,  H01L23/3128 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2223/54486 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/0102 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/3511 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： In the method of manufacturing a semiconductor device that semiconductor chips are mounted facing-up on the printed wiring board on which a protective insulation film is formed by means of a film-like resist and a plurality of the semiconductor chips are collectively molded by a transfer mold technology, when transfer molding is performed, among the adsorption face of the printed wiring board and the lower die to make adsorb the printed wiring board, the through holes reaching the exterior space of the lower die from the vicinity of the end portion opposing the gate to pour mold resin of a mold cavity are formed as many as possible in order to prevent a short circuit and an open circuit by big deformation of a bonding wire connecting an electrode of the semiconductor chip and an conductor pattern of the printed wiring board.

摘要翻译： 在制造半导体器件的方法中，半导体芯片通过薄膜状抗蚀剂面向上安装在其上形成保护绝缘膜的印刷线路板上，并且多个半导体芯片通过转印共同模制 模具技术，当进行传递成型时，在印刷线路板的吸附面和下模之间，使得吸附印刷电路板，通孔从相对的端部附近到达下模的外部空间 为了防止连接半导体芯片的电极和印刷电路板的导体图案的接合线的大变形，防止短路和开路，模具腔的浇注模塑树脂形成为尽可能多的浇口。

公开(公告)号：US20090093087A1

公开(公告)日：2009-04-09

申请号：US12330739

申请日：2008-12-09

申请人： Fumio MURAKAMI ,  Kenichi Imura ,  Makoto Araki

发明人： Fumio MURAKAMI ,  Kenichi Imura ,  Makoto Araki

IPC分类号： H01L21/02

CPC分类号： H01L24/97 ,  H01L21/565 ,  H01L23/3128 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2223/54486 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/0102 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/3511 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： In the method of manufacturing a semiconductor device that semiconductor chips are mounted facing-up on the printed wiring board on which a protective insulation film is formed by means of a film-like resist and a plurality of the semiconductor chips are collectively molded by a transfer mold technology, when transfer molding is performed, among the adsorption face of the printed wiring board and the lower die to make adsorb the printed wiring board, the through holes reaching the exterior space of the lower die from the vicinity of the end portion opposing the gate to pour mold resin of a mold cavity are formed as many as possible in order to prevent a short circuit and an open circuit by big deformation of a bonding wire connecting an electrode of the semiconductor chip and an conductor pattern of the printed wiring board.

摘要翻译： 在制造半导体器件的方法中，半导体芯片通过薄膜状抗蚀剂面向上安装在其上形成保护绝缘膜的印刷线路板上，并且多个半导体芯片通过转印共同模制 模具技术，当进行传递成型时，在印刷线路板的吸附面和下模之间，使得吸附印刷电路板，通孔从相对的端部附近到达下模的外部空间 为了防止连接半导体芯片的电极和印刷电路板的导体图案的接合线的大变形，防止短路和开路，模具腔的浇注模塑树脂形成为尽可能多的浇口。

公开(公告)号：US20060046340A1

公开(公告)日：2006-03-02

申请号：US11213771

申请日：2005-08-30

申请人： Fumio Murakami ,  Kenichi Imura ,  Makoto Araki

发明人： Fumio Murakami ,  Kenichi Imura ,  Makoto Araki

IPC分类号： H01L21/00

CPC分类号： H01L24/97 ,  H01L21/565 ,  H01L23/3128 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2223/54486 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/0102 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/3511 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： In the method of manufacturing a semiconductor device that semiconductor chips are mounted facing-up on the printed wiring board on which a protective insulation film is formed by means of a film-like resist and a plurality of the semiconductor chips are collectively molded by a transfer mold technology, when transfer molding is performed, among the adsorption face of the printed wiring board and the lower die to make adsorb the printed wiring board, the through holes reaching the exterior space of the lower die from the vicinity of the end portion opposing the gate to pour mold resin of a mold cavity are formed as many as possible in order to prevent a short circuit and an open circuit by big deformation of a bonding wire connecting an electrode of the semiconductor chip and an conductor pattern of the printed wiring board.

摘要翻译： 在制造半导体器件的方法中，半导体芯片通过薄膜状抗蚀剂面向上安装在其上形成保护绝缘膜的印刷线路板上，并且多个半导体芯片通过转印共同模制 模具技术，当进行传递成型时，在印刷线路板的吸附面和下模之间，使得吸附印刷电路板，通孔从相对的端部附近到达下模的外部空间 为了防止连接半导体芯片的电极和印刷电路板的导体图案的接合线的大变形，防止短路和开路，模具腔的浇注模塑树脂形成为尽可能多的浇口。

公开(公告)号：US07465609B2

公开(公告)日：2008-12-16

申请号：US11213771

申请日：2005-08-30

申请人： Fumio Murakami ,  Kenichi Imura ,  Makoto Araki

发明人： Fumio Murakami ,  Kenichi Imura ,  Makoto Araki

IPC分类号： H01L21/00 ,  H01L21/46

CPC分类号： H01L24/97 ,  H01L21/565 ,  H01L23/3128 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2223/54486 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/0102 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/3511 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： In the method of manufacturing a semiconductor device that semiconductor chips are mounted facing-up on the printed wiring board on which a protective insulation film is formed by means of a film-like resist and a plurality of the semiconductor chips are collectively molded by a transfer mold technology, when transfer molding is performed, among the adsorption face of the printed wiring board and the lower die to make adsorb the printed wiring board, the through holes reaching the exterior space of the lower die from the vicinity of the end portion opposing the gate to pour mold resin of a mold cavity are formed as many as possible in order to prevent a short circuit and an open circuit by big deformation of a bonding wire connecting an electrode of the semiconductor chip and an conductor pattern of the printed wiring board.

摘要翻译： 在制造半导体器件的方法中，半导体芯片通过薄膜状抗蚀剂面向上安装在其上形成保护绝缘膜的印刷线路板上，并且多个半导体芯片通过转印共同模制 模具技术，当进行传递成型时，在印刷线路板的吸附面和下模之间，使得吸附印刷电路板，通孔从相对的端部附近到达下模的外部空间 为了防止连接半导体芯片的电极和印刷电路板的导体图案的接合线的大变形，防止短路和开路，模具腔的浇注模塑树脂形成为尽可能多的浇口。

公开(公告)号：US08029255B2

公开(公告)日：2011-10-04

申请号：US11266279

申请日：2005-11-04

申请人： Naoya Morozumi ,  Yasuhiro Sakakibara ,  Makoto Araki ,  Hiroki Tomoda ,  Toshihiko Fukuda

发明人： Naoya Morozumi ,  Yasuhiro Sakakibara ,  Makoto Araki ,  Hiroki Tomoda ,  Toshihiko Fukuda

IPC分类号： F04C18/02 ,  F04C2/00

CPC分类号： F04C23/008 ,  F04C18/0215 ,  F04C29/02

摘要： It provides at a low price a compressor capable of preventing a waste oil pipe from falling off and curbing leakage of lubricating oil and oscillation of the pipe. An L-shaped waste oil pipe 8 for returning lubricating oil 20 to a bottom of a motor chamber 22 is connected to a waste oil passage 33 of a main frame 3 so as to put at least a part of the waste oil pipe 8 in elastic contact with an internal surface of an airtight container 2.

摘要翻译： 它以低价格提供了能够防止废油管脱落并且抑制润滑油泄漏和管道振荡的压缩机。 用于将润滑油20返回到电动机室22的底部的L形废油管8连接到主框架3的废油通道33，以使废油管8的至少一部分具有弹性 与气密容器2的内表面接触。

公开(公告)号：US07136825B2

公开(公告)日：2006-11-14

申请号：US09753728

申请日：2001-01-03

申请人： Makoto Araki ,  Atsushi Okada ,  Takashi Hirashima ,  Takashi Fukuda

发明人： Makoto Araki ,  Atsushi Okada ,  Takashi Hirashima ,  Takashi Fukuda

IPC分类号： G06Q99/00

CPC分类号： G06Q10/10 ,  G06Q10/06311 ,  G06Q10/063116 ,  G06Q10/06312 ,  G06Q10/06398

摘要： A work assignment system for assigning and composing a work formed from a plurality of work standards to a plurality of stations. A display displays the names of the plurality of work standards as composition targets. A composition condition is input. The plurality of work standards are divided in accordance with the composition condition and one group of the divided work standards is assigned to a station. The assignment result of the work standards of each station to a work assignment file is output.

摘要翻译： 一种工作分配系统，用于将从多个工作标准形成的工作分配和组合到多个工位。 显示器将多个工作标准的名称显示为组合目标。 输入组合条件。 多个工作标准根据组成条件划分，一组分工作标准分配给一个工位。 输出每个工作站到工作分配文件的工作标准的分配结果。

公开(公告)号：US20060245050A1

公开(公告)日：2006-11-02

申请号：US11401712

申请日：2006-04-11

申请人： Tomohiro Uchida ,  Makoto Araki ,  Kenji Sasaki

发明人： Tomohiro Uchida ,  Makoto Araki ,  Kenji Sasaki

IPC分类号： G02B21/26

CPC分类号： H01L27/14618 ,  G02B7/00 ,  H01L2924/0002 ,  H04N5/2251 ,  H01L2924/00

摘要： An imaging device includes an imager including an optical receiver, an optical element located on an optical path extending to the optical receiver, a substrate to which the imager is fixed, a casing which covers the imager and the optical element, and a dustproof light-shielding member interposed between the imager and the optical element. The dustproof light-shielding member has an opening which allows light to pass, and a fitting portion formed like a recess in which the imager is to be fitted. The dustproof light-shielding member is held between the imager and the optical element to form a sealed space, protecting a space between the imager and the optical element against dust.

摘要翻译： 一种成像装置包括：成像装置，包括光接收器，位于延伸到光接收器的光路上的光学元件，固定有成像器的基板，覆盖成像器和光学元件的外壳， 插入在成像器和光学元件之间的屏蔽构件。 防尘遮光构件具有允许光通过的开口，以及形成为类似成像装置所在的凹部的嵌合部。 防尘遮光部件保持在成像器和光学元件之间，形成密封空间，保护成像器与光学元件之间的空间免受灰尘侵害。

公开(公告)号：US07894200B2

公开(公告)日：2011-02-22

申请号：US11913559

申请日：2006-11-28

申请人： Yutaka Yoshino ,  Takahiro Shirai ,  Shinji Kadono ,  Mineo Kawamoto ,  Minoru Enomoto ,  Masakatsu Goto ,  Makoto Araki ,  Naoki Toda

发明人： Yutaka Yoshino ,  Takahiro Shirai ,  Shinji Kadono ,  Mineo Kawamoto ,  Minoru Enomoto ,  Masakatsu Goto ,  Makoto Araki ,  Naoki Toda

IPC分类号： H05K1/18

CPC分类号： H01L23/5389 ,  H01L25/105 ,  H01L2224/16237 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/82039 ,  H01L2924/01004 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12044 ,  H01L2924/3011 ,  H05K1/023 ,  H05K1/186 ,  H05K3/4602 ,  H05K3/4623 ,  H05K3/4652 ,  H05K2201/0187 ,  H05K2201/10674 ,  Y10T29/49146 ,  H01L2924/00014

摘要： The present invention provides a printed wiring board with a built-in semiconductor element in which an insufficient or excessive amount of filled sealing material does not affect excellent adhesion of the printed wiring board to an overlying wiring board. The printed wiring board with a built-in semiconductor element comprises a built-in semiconductor element, in which at least the lower surface, the upper surface, or the side surface of the semiconductor element is covered with an insulating film, and an insulating layer is provided in the side and upper portions of the semiconductor element. There is also provided a process for producing a printed wiring board with a built-in semiconductor element, comprising the steps of mounting a semiconductor element on a base substrate and covering at least the lower surface, the upper surface, or the side surface of the semiconductor element with an insulating film, disposing and stacking a semicured insulating sheet in the side portion of the semiconductor element, and disposing and stacking a semicured insulating sheet in the upper portion of the semiconductor element.

摘要翻译： 本发明提供一种具有内置半导体元件的印刷电路板，其中填充的密封材料的量不足或过量不会影响印刷电路板对上覆布线板的优异的粘附性。 具有内置半导体元件的印刷线路板包括内置半导体元件，其中至少半导体元件的下表面，上表面或侧表面被绝缘膜覆盖，绝缘层 设置在半导体元件的侧部和上部。 还提供了一种用于制造具有内置半导体元件的印刷线路板的方法，包括以下步骤：将半导体元件安装在基底基板上，并且至少覆盖基底基板的下表面，上表面或侧表面 具有绝缘膜的半导体元件，在半导体元件的侧部设置和层叠半固化绝缘片，并且在半导体元件的上部设置和层叠半固化绝缘片。

公开(公告)号：US07889341B2

公开(公告)日：2011-02-15

申请号：US12148671

申请日：2008-04-21

申请人： Makoto Araki ,  Yasunari Matsukawa ,  Hiroshi Sasaki ,  Makio Ueno

发明人： Makoto Araki ,  Yasunari Matsukawa ,  Hiroshi Sasaki ,  Makio Ueno

IPC分类号： G01N21/25

CPC分类号： G02B21/0076 ,  G01N21/6458 ,  G02B21/0064 ,  G02B21/008

摘要： A multiphoton-excitation laser scanning microscope capable of efficiently collecting fluorescence emitted from a specimen to acquire a brighter multiphoton-excitation fluorescence image is provided. This multiphoton-excitation laser scanning microscope includes a multiphoton-excitation laser light source for emitting ultrashort pulsed laser light, a light-scanning unit configured to scan a specimen with the ultrashort pulsed laser light emitted from the multiphoton-excitation laser light source in two dimensions, an objective lens configured to focus the ultrashort pulsed laser light scanned by the light-scanning unit on the specimen, a collector lens disposed opposite the objective lens, with the light-scanning unit disposed therebetween, to collect fluorescence emitted from the specimen, and a light detector configured to detect the fluorescence collected by the collector lens. The collector lens has a higher numerical aperture and a larger field number than the objective lens.

摘要翻译： 提供能够有效地收集从样本发出的荧光以获得更明亮的多光子激发荧光图像的多光子激发激光扫描显微镜。 该多光子激发激光扫描显微镜包括用于发射超短脉冲激光的多光子激发激光光源，被配置为使用从多光子激发激光光源发射的超短脉冲激光二维扫描样本的光扫描单元 配置为将由所述光扫描单元扫描的超短脉冲激光对准在所述检体上的物镜，与所述物镜相对设置的集光透镜，其间设置有所述光扫描单元，以收集从所述检体发出的荧光，以及 光检测器，被配置为检测由所述收集透镜收集的荧光。 收集透镜具有比物镜更高的数值孔径和更大的场数。

公开(公告)号：US07878292B2

公开(公告)日：2011-02-01

申请号：US12292436

申请日：2008-11-19

申请人： Toichiro Hikichi ,  Satoru Kiyota ,  Takuya Tagami ,  Makoto Araki

发明人： Toichiro Hikichi ,  Satoru Kiyota ,  Takuya Tagami ,  Makoto Araki

IPC分类号： B62D5/04

CPC分类号： B62K21/00 ,  B62K19/30 ,  B62K2207/02

摘要： A steering system includes a steering unit which can be configured to convert an operation input to an input shaft into an arbitrary amount of rotation or an arbitrary turning force and output the arbitrary amount of rotation or the arbitrary turning force from an output shaft. A steering handlebar can be configured to be coupled to the input shaft. A support bracket can be configured to be coupled to the output shaft and to support a front wheel of the vehicle. A housing can be configured to accommodate the steering unit. The steering unit can be configured to be mounted to a front end portion of a vehicle body frame of the vehicle integrally therewith by the housing.

摘要翻译： 转向系统包括转向单元，该转向单元可被构造成将输入轴的操作输入转换成任意的转动量或任意的转动力，并从输出轴输出任意的旋转力或任意转动力。 转向车把可以被配置成联接到输入轴。 支撑托架可以被配置成联接到输出轴并且支撑车辆的前轮。 壳体可以被配置成容纳转向单元。 转向单元可以被构造成通过壳体与车辆的车身框架的前端部分一体地安装。