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    Ventilated housing and assembly
    1.
    发明申请
    Ventilated housing and assembly 审中-公开
    通风外壳和组装

    公开(公告)号：US20070264921A1

    公开(公告)日：2007-11-15

    申请号：US11431364

    申请日：2006-05-10

    申请人： Fabien Letourneau ,  Bevin Schmidt ,  Nicholas Bundza

    发明人： Fabien Letourneau ,  Bevin Schmidt ,  Nicholas Bundza

    IPC分类号： E04F17/02

    CPC分类号： H05K7/20009

    摘要： A ventilated housing for accommodating one or more components comprises opposed first and second-spaced apart end portions. An air barrier extends at least partially between the first and second end portions for limiting movement of air inside the housing and defining an upper or lower surface of the housing. A first part of the air barrier proximate the first end portion is positioned at a level below the level of a second part of the air barrier proximate the second end portion. An inlet is defined for admitting air into the housing and an outlet is defined for discharging air from the housing. An ventilated housing assembly comprises first and second housings with an angled space between a lower air barrier of the first housing and an upper air barrier of the second housing.

    摘要翻译： 用于容纳一个或多个部件的通风外壳包括相对的第一和第二间隔开的端部。 至少部分地在第一和第二端部之间延伸出一个空气屏障，以限制壳体内的空气的移动并限定外壳的上表面或下表面。 靠近第一端部的空气阻挡件的第一部分被定位在靠近第二端部的空气阻挡件的第二部分的高度以下的水平。 入口被限定为允许空气进入壳体，并且限定了用于从壳体排出空气的出口。 通风的壳体组件包括第一和第二壳体，第一壳体和第二壳体在第一壳体的下部空气障壁和第二壳体的上部空气障壁之间具有倾斜的空间。

    Optimization of connector density and identification carrier for high density front plates
    2.
    发明申请
    Optimization of connector density and identification carrier for high density front plates 审中-公开
    用于高密度前板的连接器密度和识别载体的优化

    公开(公告)号：US20090097212A1

    公开(公告)日：2009-04-16

    申请号：US11907557

    申请日：2007-10-15

    申请人： Bevin Schmidt ,  Fabien Letourneau

    发明人： Bevin Schmidt ,  Fabien Letourneau

    IPC分类号： H05K1/00 ,  H01R12/14

    CPC分类号： H04Q1/08 ,  H01R13/465 ,  H01R13/518 ,  H04Q1/136

    摘要： A high connector density printed circuit board, and high connector density device containing the same, including one or more of the following: a face plate; a plurality of connector ports in the face plate; a tab integral with the face plate label and bent to extend away from the face plate; information printed on the tab; the tab forming a plane at an angle of ninety degrees with respect to the face plate; the tab fabricated from a material having a combination of a thickness and a stiffness minimally able to resist a deformation resulting from a force of gravity; a second tab that is integral with the face plate and bent to extend away from the face plate; and the tabs do not infringe on an adjacent space occupied by another high connector density printed circuit board.

    摘要翻译： 高连接器密度印刷电路板，以及包含以下的一个或多个的高连接器密度装置：面板; 面板中的多个连接器端口; 与面板标签一体形成的折片并弯曲以远离面板延伸; 标签上印有信息; 所述突片相对于所述面板形成90度角的平面; 由具有最小能够抵抗由重力引起的变形的厚度和刚度的组合的材料制成的突片; 与面板一体并弯曲以远离面板延伸的第二突片; 并且标签不会侵入由另一高连接器密度印刷电路板占据的相邻空间。

    Sealed expansion module
    3.
    发明授权
    Sealed expansion module 有权
    密封扩展模块

    公开(公告)号：US08023271B2

    公开(公告)日：2011-09-20

    申请号：US11975002

    申请日：2007-10-17

    申请人： Angelo Arlotta ,  Nicholas Adam Bundza ,  Stefano De Cecco ,  Peter Serjak ,  Bevin Schmidt

    发明人： Angelo Arlotta ,  Nicholas Adam Bundza ,  Stefano De Cecco ,  Peter Serjak ,  Bevin Schmidt

    IPC分类号： H05K5/00

    CPC分类号： H02G3/088 ,  G02B6/4441

    摘要： Improved Sealed Expansion Module is an enclosure for housing electronics, such as circuit boards, POTS/VDSL cables having connectors, a fiber cable having a connector and a power cable having a connector. The preferred embodiment of Improved Sealed Expansion Module is comprised of at least some of the following: an enclosure having two internally undivided chambers (upper and lower), an access hatch attached with captive fasteners to the lower chamber of the enclosure, circuit boards located in the upper chamber of the enclosure, a surge protector and POTS/VDSL, fiber and power cables with connectors within the lower chamber of the enclosure, and a plurality of openings on the bottom of the lower chamber for POTS/VDSL interconnection cables, fiber interconnection cables, power interconnection cables at customer sites.

    摘要翻译： 改进的密封扩展模块是用于外壳电子器件的外壳，例如电路板，具有连接器的POTS / VDSL电缆，具有连接器的光缆和具有连接器的电力电缆。 改进的密封膨胀模块的优选实施例由以下至少一部分组成：具有两个内部未分隔的室（上部和下部）的外壳，具有固定紧固件的入口盖连接到外壳的下腔室，电路板位于 外壳的上腔室，浪涌保护器和POTS / VDSL，在外壳下腔室内具有连接器的光纤和电力电缆，以及用于POTS / VDSL互连电缆的下腔室底部的多个开口，光纤互连 电缆，电力互连电缆在客户现场。

    Sealed expansion module
    7.
    发明申请
    Sealed expansion module 有权
    密封扩展模块

    公开(公告)号：US20090101382A1

    公开(公告)日：2009-04-23

    申请号：US11975002

    申请日：2007-10-17

    申请人： Angelo Arlotta ,  Nicholas Adam Bundza ,  Stefano De Cecco ,  Peter Serjak ,  Bevin Schmidt

    发明人： Angelo Arlotta ,  Nicholas Adam Bundza ,  Stefano De Cecco ,  Peter Serjak ,  Bevin Schmidt

    IPC分类号： H02G3/08

    CPC分类号： H02G3/088 ,  G02B6/4441

    摘要： Improved Sealed Expansion Module is an enclosure for housing electronics, such as circuit boards, POTS/VDSL cables having connectors, a fiber cable having a connector and a power cable having a connector. The preferred embodiment of Improved Sealed Expansion Module is comprised of at least some of the following: an enclosure having two internally undivided chambers (upper and lower), an access hatch attached with captive fasteners to the lower chamber of the enclosure, circuit boards located in the upper chamber of the enclosure, a surge protector and POTS/VDSL, fiber and power cables with connectors within the lower chamber of the enclosure, and a plurality of openings on the bottom of the lower chamber for POTS/VDSL interconnection cables, fiber interconnection cables, power interconnection cables at customer sites.

    摘要翻译： 改进的密封扩展模块是用于外壳电子器件的外壳，例如电路板，具有连接器的POTS / VDSL电缆，具有连接器的光缆和具有连接器的电力电缆。 改进的密封膨胀模块的优选实施例由以下至少一部分组成：具有两个内部未分隔的室（上部和下部）的外壳，具有固定紧固件的入口盖连接到外壳的下腔室，电路板位于 外壳的上腔室，浪涌保护器和POTS / VDSL，在外壳下腔室内具有连接器的光纤和电力电缆，以及用于POTS / VDSL互连电缆的下腔室底部的多个开口，光纤互连 电缆，电力互连电缆在客户现场。

    Electronic circuit pack and shelf and electronic circuit pack combinations
    9.
    发明授权
    Electronic circuit pack and shelf and electronic circuit pack combinations 有权
    电子电路板和电子电路板组合

    公开(公告)号：US06370035B1

    公开(公告)日：2002-04-09

    申请号：US09472909

    申请日：1999-12-27

    申请人： Stefano De Cecco ,  David Kiesekamp ,  Bevin Schmidt ,  Simon Davis

    发明人： Stefano De Cecco ,  David Kiesekamp ,  Bevin Schmidt ,  Simon Davis

    IPC分类号： H05K714

    CPC分类号： H05K7/1409 ,  H05K7/1448 ,  H05K7/1461

    摘要： An electronic circuit pack having a printed circuit board with a faceplate at a front of the board. The faceplate has two end regions carrying latches for holding the board into a shelf. A front wall of the faceplate has an intermediate part between the end regions, the intermediate part extending forwardly of the end regions and lying at least between the latches. Preferably, the intermediate part of the front wall extends as far as a frontal vertical plane of the shelf which is the foremost position allowable for a shelf and a circuit board combination. The intermediate part of the front wall lying in this forward position provides additional space behind it for extending the electronic circuitry of the circuit pack for a unitary shelf size. This additional space is occupied by the printed circuit board with conductors and electronic components and/or connectors for test purposes and memory cards.

    摘要翻译： 一种具有印刷电路板的电子电路板，其在板的前部具有面板。 面板具有两个端部区域，其带有用于将板保持在搁架中的闩锁。 面板的前壁在端部区域之间具有中间部分，中间部分在端部区域的前方延伸并且至少位于闩锁之间。 优选地，前壁的中间部分延伸到架子的正面垂直平面，其是架子和电路板组合的最前面的位置。 位于该前方位置的前壁的中间部分在其后面提供了额外的空间，用于使电路板的电子电路延伸到一体式搁架尺寸。 这种额外的空间被印刷电路板占据，导体和电子元件和/或用于测试目的的连接器和存储卡。