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公开(公告)号：US20240258367A1
公开(公告)日：2024-08-01
申请号：US18518855
申请日：2023-11-24
Applicant: FUJI ELECTRIC CO., LTD.
Inventor： Kazuo ENOMOTO , Yushi SATO
IPC: H01G15/00 , H01L23/522
CPC classification number: H01L28/90 , H01L23/5228 , H01L28/20
Abstract: A capacitor device connected to a semiconductor device includes a capacitor element including a first electrode and a second electrode, a first wiring and a second wiring. The first wiring has a first one end portion connected to the first electrode and a first other end portion connected to a first electrode terminal of the semiconductor device, and the second wiring has a second one end portion connected to the second electrode and a second other end portion connected to a second electrode terminal of the semiconductor device. A resistor is provided between the first one end portion and the first other end portion of the first wiring and is electrically connected directly to the first wiring.
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公开(公告)号：US20250038146A1
公开(公告)日：2025-01-30
申请号：US18677690
申请日：2024-05-29
Applicant: FUJI ELECTRIC CO., LTD.
Inventor： Yushi SATO
IPC: H01L23/00 , H01L23/373 , H01L23/473 , H01L25/07
Abstract: A semiconductor device includes: a semiconductor chip including upper and lower surfaces and transistor regions and diode regions being arranged alternately with one another along the upper and lower surfaces; a lead frame containing copper disposed on the upper surface of the semiconductor chip; a plating layer containing nickel disposed on a semiconductor chip-side surface of the lead frame; a solder layer that contains tin and bonds the upper surface of the semiconductor chip to the plating layer; an insulated circuit board that is disposed on the lower surface of the semiconductor chip and has a wiring layer containing copper disposed on a semiconductor chip-side surface thereof; a plating layer containing nickel that is disposed on a semiconductor chip-side surface of the wiring layer; and a solder layer containing tin that bonds the lower surface of the semiconductor chip to the plating layer.
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公开(公告)号：US20240258194A1
公开(公告)日：2024-08-01
申请号：US18633183
申请日：2024-04-11
Applicant: FUJI ELECTRIC CO., LTD.
Inventor： Yushi SATO
IPC: H01L23/367 , H01L23/473
CPC classification number: H01L23/3677 , H01L23/473
Abstract: A semiconductor apparatus, including an insulated substrate having a first surface and a second surface that are opposite to each other, a semiconductor element that is mounted on the first surface of the insulated substrate, and a cooler for cooling the semiconductor element. The cooler includes a heat dissipation board having a bonding surface and a heat dissipation surface that are opposite to each other, the bonding surface being bonded to the second surface of the insulated substrate, a plurality of fins provided on the heat dissipation surface of the heat dissipation board, and a cooling case having a recess accommodating the plurality of fins, an inner wall surface of the cooling case being in the recess. The heat dissipation surface is provided with a plurality of engagement pieces that position the cooling case by engaging portions of the inner wall surface of the cooling case.
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公开(公告)号：US20240203928A1
公开(公告)日：2024-06-20
申请号：US18590567
申请日：2024-02-28
Applicant: FUJI ELECTRIC CO., LTD.
Inventor： Yushi SATO , Kazuo ENOMOTO
CPC classification number: H01L24/37 , H01L24/40 , H01L25/072 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L2224/32225 , H01L2224/3701 , H01L2224/37124 , H01L2224/37147 , H01L2224/3716 , H01L2224/40225 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48227 , H01L2224/49175 , H01L2224/73221 , H01L2224/73263 , H01L2224/73265 , H01L2924/10253 , H01L2924/10254 , H01L2924/10272 , H01L2924/1033 , H01L2924/1203 , H01L2924/13055 , H01L2924/13091
Abstract: A metal wiring for connecting a semiconductor element and to a circuit board, includes: a first joining portion having a rectangular shape in a planar view and configured to be joined to an upper surface of a main electrode of the semiconductor element; a second joining portion having a rectangular shape in the planar view and joined to an upper surface of the circuit board; and a coupling portion having first and second joining sides, respectively connected to coupling sides of the first and second joining portions so as to couple the first and second joining portions such that the coupling sides of the first and second joining portions face each other. The first joining side of the coupling portion is coupled to the coupling side of the first joining portion approximately at a center thereof in a first direction parallel to the coupling side of the first joining portion.
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公开(公告)号：US20220278018A1
公开(公告)日：2022-09-01
申请号：US17586264
申请日：2022-01-27
Applicant: FUJI ELECTRIC CO., LTD.
Inventor： Yushi SATO , Yuichiro HINATA , Naoyuki KANAI
IPC: H01L23/373 , H01L23/31 , H01L21/48 , H01L21/56
Abstract: A semiconductor device includes a semiconductor chip, an insulated circuit board including a metal plate, an insulating plate and a circuit pattern, each of which has a rectangular shape, and a spacer part disposed on the periphery of a rear surface of the metal plate including at least one of the four corners thereof. The spacer part protrudes from a rear surface of the metal plate in the thickness direction away from a front surface of the insulated circuit board.
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Patent Agency Ranking
公开(公告)号：US20210120706A1
公开(公告)日：2021-04-22
申请号：US17003722
申请日：2020-08-26
Applicant: FUJI ELECTRIC CO., LTD.
Inventor： Yushi SATO
Abstract: A semiconductor module, including a cooler having first and second flow passages respectively formed on first and second sides of the semiconductor module that are opposite to each other, and a third flow passage connecting the first and second flow passages. The semiconductor module further includes a laminated substrate disposed on the cooler and having first to third circuit boards, a first sensing chip having a sensing function for detecting a temperature and a first non-sensing chip not having the sensing function, disposed on the first circuit board side by side along the third flow passage, and a second sensing chip having the sensing function and a second non-sensing chip not having the sensing function, disposed on the third circuit board side by side along the third flow passage. The first and second sensing chips are respectively disposed on the second side and the first side of the semiconductor module.
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公开(公告)号：US20240355713A1
公开(公告)日：2024-10-24
申请号：US18589156
申请日：2024-02-27
Applicant: FUJI ELECTRIC CO., LTD.
Inventor： Yushi SATO
IPC: H01L23/495 , H01L29/739
CPC classification number: H01L23/49548 , H01L29/7393
Abstract: A semiconductor device includes a substrate with one side and another side in a first direction parallel to a surface thereof and including a semiconductor element provided thereon, and first and second main terminals located at the one side of the substrate, side by side a second direction parallel to the surface of the substrate and orthogonal to the first direction. The first and second main terminals respectively include first and second external connection portions respectively connected to separate external conductors, and respectively include first and second narrow portions connected to the substrate. In the second direction, widths of the first and second narrow portions are respectively less than widths of the first and second external connection portions. Centers of the first and second narrow portions are located closer respectively to the second and first main terminals than are centers of the first and second external connection portions.
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公开(公告)号：US20240203929A1
公开(公告)日：2024-06-20
申请号：US18592387
申请日：2024-02-29
Applicant: FUJI ELECTRIC CO., LTD.
Inventor： Yushi SATO , Kazuo ENOMOTO
CPC classification number: H01L24/37 , H01L24/05 , H01L24/06 , H01L24/40 , H01L25/072 , H01L23/3121 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L2224/05553 , H01L2224/0603 , H01L2224/32225 , H01L2224/3701 , H01L2224/37124 , H01L2224/37147 , H01L2224/3716 , H01L2224/40225 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48106 , H01L2224/48227 , H01L2224/49175 , H01L2224/73221 , H01L2224/73263 , H01L2224/73265 , H01L2924/10253 , H01L2924/10254 , H01L2924/10272 , H01L2924/1033 , H01L2924/13055 , H01L2924/13091
Abstract: A semiconductor module includes: first to third circuit boards respectively connected to first to third terminals; first and second semiconductor elements respectively on the first and second circuit boards; first and second metal wiring boards respectively connecting the first semiconductor element to the second circuit board and the second semiconductor element to the third circuit board. The first metal wiring board includes first and second joining portions and a first coupling portion coupling the first and second joining portions at respective one sides thereof such that the respective one sides of the first and second joining portions face each other. The second metal wiring board includes third and fourth joining portions and a second coupling portion coupling the third and fourth joining portions at respective one sides thereof such that the respective one sides of the third and fourth joining portions face each other.
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公开(公告)号：US20220328665A1
公开(公告)日：2022-10-13
申请号：US17677582
申请日：2022-02-22
Applicant: Fuji Electric Co., Ltd.
Inventor： Yushi SATO
IPC: H01L29/739 , H01L29/417
Abstract: A semiconductor module includes: a first power semiconductor element that includes a first main current electrode; a main body that accommodates therein the first power semiconductor element; and a first main current terminal connectable to the first main current electrode. The main body includes: a top face; a side face that connects to the top face; a bottom face fixable to a cooler; and a recessed portion that is on the side face, and accommodates therein an end portion of an insulating member. The first main current terminal protrudes from the side face of the main body, and includes: a first face; and a second face on an opposite side of the first face. The second face is closer to the bottom face than the first face on the side face. The recessed portion is on the side face between the bottom face and the second face, and is at a position apart from the bottom face.
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公开(公告)号：US20210050277A1
公开(公告)日：2021-02-18
申请号：US17039710
申请日：2020-09-30
Applicant: FUJI ELECTRIC CO., LTD.
Inventor： Yushi SATO
IPC: H01L23/367 , H01L23/473
Abstract: A semiconductor apparatus, including an insulated substrate having a first surface and a second surface that are opposite to each other, a semiconductor element that is mounted on the first surface of the insulated substrate, and a cooler for cooling the semiconductor element. The cooler includes a heat dissipation board having a bonding surface and a heat dissipation surface that are opposite to each other, the bonding surface being bonded to the second surface of the insulated substrate, a plurality of fins provided on the heat dissipation surface of the heat dissipation board, and a cooling case having a recess accommodating the plurality of fins, an inner wall surface of the cooling case being in the recess. The heat dissipation surface is provided with a plurality of engagement pieces that position the cooling case by engaging portions of the inner wall surface of the cooling case.
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