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公开(公告)号:US20240159710A1
公开(公告)日:2024-05-16
申请号:US18548847
申请日:2022-03-03
Applicant: FREC'N'SYS
Inventor: Sylvain BALLANDRAS , Thierry LAROCHE , Julien GARCIA , Emilie COURJON
CPC classification number: G01N29/022 , H03H9/14502 , H03H9/25 , G01N2291/0422
Abstract: An acoustic wave sensor device comprises a first interdigitated transducer, a first reflection structure, a second reflection structure, a first resonance cavity comprising a first upper surface and formed between the first interdigitated transducer and the first reflection structure, and a second resonance cavity comprising a second upper surface and formed between the first interdigitated transducer and the second reflection structure. At least one of the first and second upper surfaces is covered at least partly by a metalization layer or a passivation layer. The present invention relates also to an acoustic wave sensor assembly.
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公开(公告)号:US20220060173A1
公开(公告)日:2022-02-24
申请号:US17418824
申请日:2019-12-27
Applicant: THALES , CENTRE NATIONAL DE LA RECHERCHE SCIENTIFIQUE , FREC'N'SYS , YNCREA HAUTS-DE-FRANCE ETABLISSEMENT ISEN LILLE , UNIVERSITE DE LILLE , ECOLE CENTRALE DE LILLE , UNIVERSITE POLYTECHNIQUE HAUTS-DE-FRANCE
Inventor: Thi Mai PHAM COLOMBAN , Claude PRÉVOT , Paolo MARTINS , Anne-Christine HLADKY- HENNION , Bertrand DUBUS , Marianne SAGNARD , Thierry LAROCHE , Sylvain BALLANDRAS , Charles CROENNE
Abstract: A surface acoustic wave device: includes at least one transducer; two acoustic reflectors disposed on either side of the at least one transducer so as to form a cavity, each acoustic reflector comprising an array of electrodes in the form of lines parallel with each other, each array comprising a subset of electrodes connected to a reference potential denoted mass defining a first connection type, and a subset of electrodes that are not connected to any potential, i.e. that have a floating connection defining a second connection type; at least one switching circuit configured to modify the distribution of the connections of at least one part of the electrodes of each array between the different connection types.
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