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公开(公告)号：US20230217580A1
公开(公告)日：2023-07-06
申请号：US17867774
申请日：2022-07-19
发明人： Nianbin Cheng , Cheng Li , Lifang Liang , Yikai Yuan , Honggui Zhan , Xiangxuan Tan
摘要： Provided are a power module and a heat sink system. The power module includes a first circuit board, a second circuit board, at least one discrete component and an encapsulation body. One discrete component includes a lead frame and at least one chip, the lead frame is disposed between the first circuit board and the second circuit board, the lead frame includes two end faces and multiple mounting lateral surfaces connected in sequence, an angle is formed between one end face and one mounting lateral surface, one of the two end faces is electrically connected to the first circuit board and the other of the two end faces is electrically connected to the second circuit board, and the chip is disposed on each of the multiple mounting lateral surfaces. The encapsulation body is configured to pot a space between the first circuit board and the second circuit board.
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公开(公告)号：US20230245945A1
公开(公告)日：2023-08-03
申请号：US17870932
申请日：2022-07-22
发明人： Nianbin Cheng , Cheng Li , Lifang Liang , Yikai Yuan , Honggui Zhan , Xiangxuan Tan
IPC分类号： H01L23/367 , H01L23/48 , H01L23/495 , H01L29/423 , H01L25/07
CPC分类号： H01L23/3675 , H01L23/481 , H01L23/49568 , H01L25/072 , H01L29/42304
摘要： Provided are a discrete component, a power module and a heat sink system. The discrete component includes a lead frame and a chip. The lead frame includes a top and a bottom disposed adjacent to each other. The top includes a support surface and multiple lateral surfaces connected in sequence. The multiple lateral surfaces are located between the support surface and the bottom. The chip is disposed on each of at least one lateral surface of the multiple lateral surfaces separately. The top of the lead frame is configured to be a metal structure.
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公开(公告)号：US11974387B2
公开(公告)日：2024-04-30
申请号：US17867774
申请日：2022-07-19
发明人： Nianbin Cheng , Cheng Li , Lifang Liang , Yikai Yuan , Honggui Zhan , Xiangxuan Tan
CPC分类号： H05K1/021 , H05K3/284 , H05K1/181 , H05K7/20254 , H05K7/20927 , H05K2201/066
摘要： Provided are a power module and a heat sink system. The power module includes a first circuit board, a second circuit board, at least one discrete component and an encapsulation body. One discrete component includes a lead frame and at least one chip, the lead frame is disposed between the first circuit board and the second circuit board, the lead frame includes two end faces and multiple mounting lateral surfaces connected in sequence, an angle is formed between one end face and one mounting lateral surface, one of the two end faces is electrically connected to the first circuit board and the other of the two end faces is electrically connected to the second circuit board, and the chip is disposed on each of the multiple mounting lateral surfaces. The encapsulation body is configured to pot a space between the first circuit board and the second circuit board.
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