Multidimensional Structural Access
    1.
    发明申请
    Multidimensional Structural Access 审中-公开
    多维结构访问

    公开(公告)号:US20150260784A1

    公开(公告)日:2015-09-17

    申请号:US14432712

    申请日:2013-10-04

    Applicant: FEI COMPANY

    Abstract: Multiple planes within the sample are exposed from a single perspective for contact by an electrical probe. The sample can be milled at a non-orthogonal angle to expose different layers as sloped surfaces. The sloped edges of multiple, parallel conductor planes provide access to the multiple levels from above. The planes can be accessed, for example, for contacting with an electrical probe for applying or sensing a voltage. The level of an exposed layer to be contacted can be identified, for example, by counting down the exposed layers from the sample surface, since the non-orthogonal mill makes all layers visible from above. Alternatively, the sample can be milled orthogonally to the surface, and then tilted and/or rotated to provide access to multiple levels of the device. The milling is preferably performed away from the region of interest, to provide electrical access to the region while minimizing damage to the region.

    Abstract translation: 样品中的多个平面从单个角度暴露出来,用于通过电探针进行接触。 样品可以以非正交角度研磨,以将不同的层暴露于倾斜的表面。 多个平行导体平面的倾斜边缘可从上方进入多个层次。 例如,可以访问平面,以便与用于施加或感测电压的电探针接触。 可以例如通过从样品表面倒下暴露的层来鉴定待接触的暴露层的水平,因为非正交磨机使得所有层从上方可见。 或者,样品可以与表面正交地研磨,然后倾斜和/或旋转以提供对该装置的多个级别的访问。 铣削优选地远离感兴趣的区域进行,以提供对该区域的电通路,同时使对该区域的损害最小化。

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