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1.
公开(公告)号:US20180299771A1
公开(公告)日:2018-10-18
申请号:US16008585
申请日:2018-06-14
IPC分类号: G03F1/80 , H01L21/311 , H01L21/265 , H01L21/02 , G03F1/82
摘要: A method of processing a trench, via, hole, recess, void, or other feature that extends a depth into a substrate to a base or bottom and has an opening by irradiation with an accelerated neutral beam derived from an accelerated gas cluster ion beam for processing materials at the base or bottom of the opening.
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2.
公开(公告)号:US11199769B2
公开(公告)日:2021-12-14
申请号:US16008585
申请日:2018-06-14
IPC分类号: G03F1/80 , H01L21/311 , H01L21/265 , H01L21/02 , G03F1/82 , H05H3/02 , H01J37/317 , H01J37/147 , H01J37/05 , H01L21/321 , H01J37/31 , H01L29/36 , B24B37/04
摘要: A method of processing a trench, via, hole, recess, void, or other feature that extends a depth into a substrate to a base or bottom and has an opening by irradiation with an accelerated neutral beam derived from an accelerated gas cluster ion beam for processing materials at the base or bottom of the opening.
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