公开(公告)号：US10175133B2

公开(公告)日：2019-01-08

申请号：US14890752

申请日：2014-06-04

Applicant: Entegris, Inc.

Inventor： Richard A. Cooke ,  George Gonnella ,  Sung In Moon ,  Charles W. Extrand ,  John E. Pillion

IPC: G01L19/06 ,  B81B7/00

Abstract: A sensor comprises a sensor layer comprising a ceramic material; an adhesion layer comprising chromium, the adhesion layer adhered to one or more portions of a liquid facing surface of the sensor layer; and an isolator film comprising a polymer, the isolator film overlaying a liquid facing surface of the adhesion layer. The isolator film may be used to protect the sensor from corrosive and high temperature fluids, for example to protect the sensor from long term exposure to hot water between 85° C. and 100° C.

公开(公告)号：US20180044800A1

公开(公告)日：2018-02-15

申请号：US15550630

申请日：2016-02-13

Applicant: Entegris, Inc.

Inventor： Bryan C. Hendrix ,  David W. Peters ,  Weimin Li ,  Carlo Waldfried ,  Richard A. Cooke ,  Nilesh Gunda ,  I-Kuan Lin

IPC: C23C28/04 ,  C23C16/40 ,  C23C16/455 ,  C23C14/24 ,  C23C14/50

CPC classification number: C23C28/044 ,  C23C14/243 ,  C23C14/50 ,  C23C16/042 ,  C23C16/403 ,  C23C16/404 ,  C23C16/405 ,  C23C16/4404 ,  C23C16/4412 ,  C23C16/45525 ,  C23C16/45555 ,  C23C16/56 ,  C23C28/042

Abstract: Coatings applicable to a variety of substrate articles, structures, materials, and equipment are described. In various applications, the substrate includes metal surface susceptible to formation of oxide, nitride, fluoride, or chloride of such metal thereon, wherein the metal surface is configured to be contacted in use with gas, solid, or liquid that is reactive therewith to form a reaction product that is deleterious to the substrate article, structure, material, or equipment. The metal surface is coated with a protective coating preventing reaction of the coated surface with the reactive gas, and/or otherwise improving the electrical, chemical, thermal, or structural properties of the substrate article or equipment. Various methods of coating the metal surface are described, and for selecting the coating material that is utilized.

公开(公告)号：US10734270B2

公开(公告)日：2020-08-04

申请号：US14764436

申请日：2014-02-11

Applicant: Entegris, Inc.

Inventor： John Glasko ,  Richard A. Cooke ,  I-Kuan Lin

IPC: H01L21/683 ,  H01L21/687

Abstract: A vacuum chuck with polymeric embossments is disclosed. The polymeric embossments are formed on the surface of a base substrate and are lapped to a flatness such that a wafer substrate clamped by the vacuum chuck has a peak to valley flatness that is less than a peak to valley flatness across the base substrate. Lapping of the polymeric embossments accommodates for variations in the flatness of the base substrate so long as the embossments are tall enough to stand over the peak to valley height variations in the base substrate.

公开(公告)号：US09721821B2

公开(公告)日：2017-08-01

申请号：US14439464

申请日：2013-10-29

Applicant: Entegris, Inc.

Inventor： I-Kuan Lin ,  Richard A. Cooke ,  Jakub Rybczynski

IPC: H01T23/00 ,  H01L21/683 ,  H02N13/00 ,  C23C16/458 ,  H01L21/687

CPC classification number: H01L21/6831 ,  C23C16/4581 ,  H01L21/6875 ,  H01L21/68757 ,  H02N13/00

Abstract: In accordance with an embodiment of the invention, there is provided a soft protrusion structure for an electrostatic chuck, which offers a non-abrasive contact surface for wafers, workpieces or other substrates, while also having improved manufacturability and compatibility with grounded surface platen designs. The soft protrusion structure comprises a photo-patternable polymer.

公开(公告)号：US12084778B2

公开(公告)日：2024-09-10

申请号：US16898149

申请日：2020-06-10

Applicant: Entegris, Inc.

Inventor： Bryan C. Hendrix ,  David W. Peters ,  Weimin Li ,  Carlo Waldfried ,  Richard A. Cooke ,  Nilesh Gunda ,  I-Kuan Lin

IPC: C23C28/04 ,  B01D39/20 ,  B01D67/00 ,  C23C14/24 ,  C23C14/50 ,  C23C16/04 ,  C23C16/40 ,  C23C16/44 ,  C23C16/455 ,  C23C16/56

CPC classification number: C23C28/044 ,  B01D39/2027 ,  B01D67/00 ,  C23C14/243 ,  C23C14/50 ,  C23C16/042 ,  C23C16/403 ,  C23C16/404 ,  C23C16/405 ,  C23C16/4404 ,  C23C16/4412 ,  C23C16/45525 ,  C23C16/45555 ,  C23C16/56 ,  C23C28/042 ,  B01D2239/0478 ,  B01D2239/1216

Abstract: Coatings applicable to a variety of substrate articles, structures, materials, and equipment are described. In various applications, the substrate includes metal surface susceptible to formation of oxide, nitride, fluoride, or chloride of such metal thereon, wherein the metal surface is configured to be contacted in use with gas, solid, or liquid that is reactive therewith to form a reaction product that is deleterious to the substrate article, structure, material, or equipment. The metal surface is coated with a protective coating preventing reaction of the coated surface with the reactive gas, and/or otherwise improving the electrical, chemical, thermal, or structural properties of the substrate article or equipment. Various methods of coating the metal surface are described, and for selecting the coating material that is utilized.

公开(公告)号：US20150380294A1

公开(公告)日：2015-12-31

申请号：US14764436

申请日：2014-02-11

Applicant: ENTEGRIS, INC.

Inventor： John Glasko ,  Richard A. Cooke ,  I-Kuan Lin

IPC: H01L21/683

Abstract: A vacuum chuck with polymeric embossments is disclosed. The polymeric embossments are formed on the surface of a base substrate and are lapped to a flatness such that a wafer substrate clamped by the vacuum chuck has a peak to valley flatness that is less than a peak to valley flatness across the base substrate. Lapping of the polymeric embossments accommodates for variations in the flatness of the base substrate so long as the embossments are tall enough to stand over the peak to valley height variations in the base substrate.

Abstract translation: 公开了一种具有聚合物压花的真空吸盘。 聚合物压花形成在基底基材的表面上并且被研磨成平坦度，使得由真空吸盘夹持的晶片基底具有小于基底基底上的峰谷平坦度的峰谷平坦度。 聚合物压花的研磨适应于基底基材的平整度的变化，只要压花高到足以支撑基底基板的峰谷高度变化即可。

公开(公告)号：US20150294891A1

公开(公告)日：2015-10-15

申请号：US14439464

申请日：2013-10-29

Applicant: ENTEGRIS, INC.

Inventor： I-Kuan Lin ,  Richard A. Cooke ,  Jakub Rybczynski

IPC: H01L21/683

CPC classification number: H01L21/6831 ,  C23C16/4581 ,  H01L21/6875 ,  H01L21/68757 ,  H02N13/00

Abstract: In accordance with an embodiment of the invention, there is provided a soft protrusion structure for an electrostatic chuck, which offers a non-abrasive contact surface for wafers, workpieces or other substrates, while also having improved manufacturability and compatibility with grounded surface platen designs. The soft protrusion structure comprises a photo-patternable polymer.

Abstract translation: 根据本发明的实施例，提供了一种用于静电卡盘的软突起结构，其提供用于晶片，工件或其它基板的非研磨接触表面，同时具有改进的可制造性和与接地的平台台板设计的兼容性。 软突起结构包括可光致图案的聚合物。

公开(公告)号：US20160336210A1

公开(公告)日：2016-11-17

申请号：US15111591

申请日：2015-02-06

Applicant: ENTEGRIS, INC.

Inventor： Richard A. Cooke ,  Wolfram Neff ,  Carlo Waldfried ,  Jakub Rybczynski ,  Michael Hanagan ,  Wade Krull

IPC: H01L21/683 ,  H01L21/67

CPC classification number: H01L21/6833 ,  H01L21/67248 ,  H01L21/6831

Abstract: An electrostatic chuck includes a ceramic structural element, at least one electrode disposed on the ceramic structural element, and a surface dielectric layer disposed over the at least one electrode, the surface layer activated by a voltage in the electrode to form an electric charge to electrostatically clamp a substrate to the electrostatic chuck. The surface dielectric layer comprises: (i) an insulator layer of amorphous alumina, of a thickness of less than about 5 microns, disposed over the at least one electrode; and (ii) a stack of dielectric layers disposed over the insulator layer. The stack of dielectric layers includes: (a) at least one dielectric layer including aluminum oxynitride; and (b) at least one dielectric layer including at least one of silicon oxide and silicon oxynitride.

Abstract translation: 静电卡盘包括陶瓷结构元件，设置在陶瓷结构元件上的至少一个电极和设置在至少一个电极上的表面电介质层，该表面层由电极中的电压激活以形成静电电荷 将基板夹紧到静电卡盘。 所述表面介电层包括：（i）厚度小于约5微米的无定形氧化铝绝缘体层，设置在所述至少一个电极上; 和（ii）设置在绝缘体层之上的一叠电介质层。 电介质层的叠层包括：（a）至少一个介电层，包括氮氧化铝; 和（b）至少一个包括氧化硅和氮氧化硅中的至少一种的电介质层。

公开(公告)号：US20160103033A1

公开(公告)日：2016-04-14

申请号：US14890752

申请日：2014-06-04

Applicant: ENTEGRIS, INC.

Inventor： Richard A. Cooke ,  George Gonnella ,  Sung In Moon ,  Charles W. Extrand ,  John E. Pillion

IPC: G01L19/06

CPC classification number: G01L19/0645 ,  B81B7/0025

Abstract: A sensor comprises a sensor layer comprising a ceramic material; an adhesion layer comprising chromium, the adhesion layer adhered to one or more portions of a liquid facing surface of the sensor layer; and an isolator film comprising a polymer, the isolator film overlaying a liquid facing surface of the adhesion layer. The isolator film may be used to protect the sensor from corrosive and high temperature fluids, for example to protect the sensor from long term exposure to hot water between 85° C. and 100° C.

Abstract translation: 传感器包括包含陶瓷材料的传感器层; 包含铬的粘合层，所述粘合层粘附到所述传感器层的面向液体的表面的一个或多个部分; 以及隔离膜，其包含聚合物，所述隔离膜覆盖所述粘附层的面向液体的表面。 隔离膜可用于保护传感器免受腐蚀性和高温流体的侵害，例如保护传感器免受长时间暴露于85℃至100℃之间的热水。

公开(公告)号：US08861170B2

公开(公告)日：2014-10-14

申请号：US13667516

申请日：2012-11-02

Applicant: Entegris, Inc.

Inventor： I-Kuan Lin ,  Richard A. Cooke ,  Jakub Rybczynski

IPC: H02N13/00 ,  C23C16/458 ,  H01L21/683 ,  H01L21/687

CPC classification number: H01L21/6831 ,  C23C16/4581 ,  H01L21/6875 ,  H01L21/68757 ,  H02N13/00

Abstract: In accordance with an embodiment of the invention, there is provided a soft protrusion structure for an electrostatic chuck, which offers a non-abrasive contact surface for wafers, workpieces or other substrates, while also having improved manufacturability and compatibility with grounded surface platen designs. The soft protrusion structure comprises a photo-patternable polymer.

Abstract translation: 根据本发明的实施例，提供了一种用于静电卡盘的软突起结构，其提供用于晶片，工件或其它基板的非研磨接触表面，同时具有改进的可制造性和与接地的平台台板设计的兼容性。 软突起结构包括可光致图案的聚合物。