Fill-level measuring device
    3.
    发明授权

    公开(公告)号:US11340106B2

    公开(公告)日:2022-05-24

    申请号:US16944921

    申请日:2019-01-14

    摘要: Disclosed is a fill-level measuring device for determining the fill level in a container. The device comprises: a radar module for determining a distance to the surface of the filling material; a 3D camera for capturing at least one region of the surface of the filling material; and an evaluation circuit that is designed to measure a maximum distance and a minimum distance from the captured distance values and to determine the fill level on the basis of the distance, providing that the distance is smaller than the maximum distance value and greater than the minimum distance value. As a result of the redundancy or the verification provided by the 3D camera of the distance calculated by the radar module, the fill-level measuring device according to the invention is therefore more reliable with regard to the miscalculation of an incorrect fill level.

    Method for positioning circuit boards and circuit board arrangement

    公开(公告)号:US10721818B2

    公开(公告)日:2020-07-21

    申请号:US16093531

    申请日:2017-03-16

    IPC分类号: H05K1/00 H05K1/14 H05K3/36

    摘要: The present disclosure relates to a method for positioning at least two circuit boards in a housing having a non-conductive surface, a first securement location for securing the first circuit board, and a second securement location for securing the second circuit board, wherein at least one conductive trace is arranged in the housing and is connected non-releasably with the housing, and wherein the conductive trace electrically contacts the first securement location with the second securement location, the method comprising securing the circuit boards in the securement locations of the housing such that the first circuit board is electrically in contact with the first securement location and the second circuit board is electrically in contact with the second securement location, wherein the first circuit board and the second circuit board are electrically in contact with one another via the at least one conductive trace.

    FILLING VOLUME MEASUREMENT
    5.
    发明公开

    公开(公告)号:US20240027252A1

    公开(公告)日:2024-01-25

    申请号:US18254196

    申请日:2021-10-28

    IPC分类号: G01F17/00 G01F23/284

    摘要: A measuring system for determining a filling volume of a filling material in a container comprises a 3D camera and a radar-based fill-level measurement device. The 3D camera is used to initially record at least one 3D image of at least one partial region of the empty container interior. Based on the 3D images, a data set or a digital spatial model is created by which at least such partial region the geometry of the empty container interior is represented. To create the required, three-dimensional surface or level profile, the fill-level measurement device is based on a principle of digital beam shaping, such as the MIMO principle. Thus, based on the data set reflecting the geometry in the container interior and based on the fill-level profile, the filling volume in the container can be determined.

    Method for energy management of a field device of process automation

    公开(公告)号:US10437216B2

    公开(公告)日:2019-10-08

    申请号:US15758383

    申请日:2016-08-12

    摘要: The invention relates to a method for energy management of a process automation field device having a first module and at least a second module, wherein the field device is supplied with energy by a two conductor bus, wherein the first module, at least temporarily, consumes more energy than the two conductor bus continuously delivers, and an energy storer supplied by the two conductor bus is associated with the first module, wherein the second module is supplied continuously with energy by the two conductor bus, wherein operation of the first and second modules is so controlled that the second module has precedence over the first module and the first module is, in given cases, at least temporarily, not functional.

    METHOD FOR POSITIONING CIRCUIT BOARDS AND CIRCUIT BOARD ARRANGEMENT

    公开(公告)号:US20190124770A1

    公开(公告)日:2019-04-25

    申请号:US16093531

    申请日:2017-03-16

    IPC分类号: H05K1/14 H05K3/36

    摘要: The present disclosure relates to a method for positioning at least two circuit boards in a housing having a non-conductive surface, a first securement location for securing the first circuit board, and a second securement location for securing the second circuit board, wherein at least one conductive trace is arranged in the housing and is connected non-releasably with the housing, and wherein the conductive trace electrically contacts the first securement location with the second securement location, the method comprising securing the circuit boards in the securement locations of the housing such that the first circuit board is electrically in contact with the first securement location and the second circuit board is electrically in contact with the second securement location, wherein the first circuit board and the second circuit board are electrically in contact with one another via the at least one conductive trace.