公开(公告)号：US20230099943A1

公开(公告)日：2023-03-30

申请号：US17523184

申请日：2021-11-10

Applicant: Elite Electronic Material (Zhongshan) Co., Ltd.

Inventor： Teng XU ,  Zhilong HU ,  Xiangnan LI ,  Shuwen LIU ,  Cheng LI

IPC: C08L79/08 ,  C08J5/24 ,  C09D179/08 ,  H05K1/03 ,  B32B15/20 ,  B32B5/02 ,  B32B15/14 ,  B32B5/26

Abstract: A resin composition includes 100 parts by weight of a prepolymer and 100 parts by weight to 250 parts by weight of a spherical silica prepared by vaporized metal combustion, wherein: the prepolymer is prepared by subjecting a reaction mixture to a prepolymerization reaction; the reaction mixture includes a maleimide resin, an amino-modified silicone and cyclohexanone, and relative to a total of 100 parts by weight of the maleimide resin, the amino-modified silicone and the cyclohexanone, the reaction mixture includes 60 parts by weight to 80 parts by weight of the maleimide resin, 15 parts by weight to 30 parts by weight of the amino-modified silicone and 2 parts by weight to 15 parts by weight of the cyclohexanone; the reaction mixture does not include m-aminophenol or p-aminophenol; and the amino-modified silicone has an amino equivalent of 750 g/mol to 2500 g/mol. The resin composition may be used to make various articles, such as a prepreg, a resin film, a laminate or a printed circuit board, and at least one of the following improvements can be achieved, including varnish transparency, varnish sedimentation property, glass transition temperature, X-axis coefficient of thermal expansion, T300 thermal resistance, resin cluster and resin filling property.

公开(公告)号：US20200095504A1

公开(公告)日：2020-03-26

申请号：US16194962

申请日：2018-11-19

Applicant: Elite Electronic Material (Zhongshan) Co., Ltd.

Inventor： Zhilong HU ,  Teng XU

IPC: C09K21/12 ,  C08L79/08 ,  C08K5/5313 ,  C08K5/521 ,  C08J5/18 ,  C08J5/24 ,  C07F9/28 ,  C07F9/145

Abstract: Disclosed is a compound useful in a resin composition for fabricating articles such as a prepreg, a resin film, a laminate or a printed circuit board, such that the articles have improved one or more properties including glass transition temperature, ratio of thermal expansion, peel strength, thermal resistance, dielectric constant, dissipation factor and flame retardancy.

公开(公告)号：US20210309852A1

公开(公告)日：2021-10-07

申请号：US15930846

申请日：2020-05-13

Applicant: Elite Electronic Material (Zhongshan) Co., Ltd.

Inventor： Zhilong HU ,  Teng XU ,  Hezong ZHANG ,  Shu-Hao CHANG

IPC: C08L71/12 ,  C08J5/24

Abstract: A resin composition includes 100 parts by weight of a vinyl-containing polyphenylene ether resin and 45 parts by weight to 75 parts by weight of an inorganic filler combination, wherein the inorganic filler combination at least includes chemically synthesized silica and silicon nitride, and a weight ratio of the chemically synthesized silica and the silicon nitride is between 1:2 and 5:2. The resin composition or an article made therefrom may achieve improvement in at least one of the following properties: dielectric constant, dissipation factor, peel strength, soldering resistance, T300 thermal resistance, laminate appearance, sedimentation property, water absorption rate, and ratio of thermal expansion.

公开(公告)号：US20210171770A1

公开(公告)日：2021-06-10

申请号：US16773602

申请日：2020-01-27

Applicant: Elite Electronic Material (Zhongshan) Co., Ltd.

Inventor： Zhilong HU ,  Teng XU ,  Hezong ZHANG

IPC: C08L79/08 ,  C08L71/12

Abstract: A resin composition includes a maleimide resin and a multifunctional vinylsilane. Also provided is an article made from the resin composition including such as a prepreg, a resin film, a laminate or a printed circuit board, wherein the article has improved one or more properties including glass transition temperature, difference in glass transition temperature, ratio of thermal expansion, peel strength, thermal resistance, dissipation factor and dissipation factor after ageing at high temperature.