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公开(公告)号:US20190067235A1
公开(公告)日:2019-02-28
申请号:US16115060
申请日:2018-08-28
Inventor: Kwang-Seong CHOI , Yong-Sung Eom , Keon-Soo Jang , Seok Hwan Moon , Hyun-Cheol Bae , leeseul Jeong , Wagno Alves Braganca Junior
Abstract: Provided is a method of fabricating a semiconductor package. The method includes preparing a package substrate having a substrate pad, and mounting a semiconductor chip on the substrate pad. Mounting the semiconductor chip includes forming a resin layer containing a solder and reducing agent granules having a first capsule layer, between a chip pad of the semiconductor chip and the substrate pad, and bonding the chip pad to the substrate pad using laser irradiated to the semiconductor chip.
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公开(公告)号:US20150280041A1
公开(公告)日:2015-10-01
申请号:US14432681
申请日:2013-09-17
Applicant: KOREA ELECTRONICS TECHNOLOGY INSTITUTE , ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
Inventor: Hyung Man Lee , Seok Hwan Moon
IPC: H01L31/052 , H01L31/054
CPC classification number: H01L31/0521 , H01L31/0543 , Y02E10/52
Abstract: The present invention relates to a concentrated photovoltaic module and, more particularly, to a concentrated photovoltaic module that is capable of efficiently dissipating the heat generated in a solar cell to the atmosphere. The concentrated photovoltaic module according to the present invention includes: a concentrated lens array module having at least one condenser lens; a solar cell positioned at the lower end of the condenser lens; a substrate positioned at the lower end of the solar cell and supplied with the heat generated in the solar cell; a flat plate-type heat pipe positioned at the lower end of the substrate; a flat plate-type heat sink positioned at the lower end of the flat plate-type heat pipe; and a condenser lens array structure fixing the condenser lens array module to the substrate.
Abstract translation: 本发明涉及一种集中的光伏组件,更具体地说,涉及能够有效地将太阳能电池中产生的热量散发到大气中的集中光伏组件。 根据本发明的集中光伏模块包括:集中透镜阵列模块,其具有至少一个聚光透镜; 位于聚光透镜的下端的太阳能电池; 位于太阳能电池下端并提供在太阳能电池中产生的热的基板; 位于基板的下端的平板型热管; 位于平板式热管的下端的平板型散热器; 以及将聚光透镜阵列模块固定在基板上的聚光透镜阵列结构。
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公开(公告)号:US20250062276A1
公开(公告)日:2025-02-20
申请号:US18807628
申请日:2024-08-16
Inventor: Jung Ho Shin , Chan Mi Lee , Ji Ho Joo , Gwang Mun Choi , Yong Sung Eom , Kwang Seong Choi , Seok Hwan Moon , Jin Hyuk Oh , Ho Gyeong Yun , Ki Seok Jang
IPC: H01L23/00
Abstract: The present invention relates to a method for dipping an adhesive material, and the method for dipping an adhesive material includes dipping an adhesive material onto a first dipping stamp, transferring the adhesive material, which is dipped onto the first dipping stamp, to a target substrate, and transferring a device to the target substrate, to which the adhesive material is transferred.
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