公开(公告)号：US20250062276A1

公开(公告)日：2025-02-20

申请号：US18807628

申请日：2024-08-16

Applicant: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE

Inventor： Jung Ho Shin ,  Chan Mi Lee ,  Ji Ho Joo ,  Gwang Mun Choi ,  Yong Sung Eom ,  Kwang Seong Choi ,  Seok Hwan Moon ,  Jin Hyuk Oh ,  Ho Gyeong Yun ,  Ki Seok Jang

IPC: H01L23/00

Abstract: The present invention relates to a method for dipping an adhesive material, and the method for dipping an adhesive material includes dipping an adhesive material onto a first dipping stamp, transferring the adhesive material, which is dipped onto the first dipping stamp, to a target substrate, and transferring a device to the target substrate, to which the adhesive material is transferred.