公开(公告)号：US11709095B2

公开(公告)日：2023-07-25

申请号：US17499874

申请日：2021-10-13

申请人： Egis Technology Inc.

发明人： Chen-Chih Fan ,  Bruce C. S. Chou

IPC分类号： G01J1/04 ,  G01J1/44 ,  H01L27/146 ,  G01S7/4863

CPC分类号： G01J1/0422 ,  G01J1/44 ,  G01J2001/4466 ,  G01S7/4863 ,  H01L27/14605 ,  H01L27/14625 ,  H01L27/14643

摘要： A light sensing module including a photodiode array substrate, a distance increasing layer, and a light converging element array is provided. The photodiode array substrate includes a plurality of light sensing units arranged in an array and a circuit region. The circuit region is disposed on the periphery of the light sensing units. Each of the light sensing units includes a plurality of adjacent photodiodes arranged in an array. The distance increasing layer is disposed on the photodiode array substrate. The light converging element array is disposed on the distance increasing layer, and includes a plurality of light converging units arranged in an array. Reflected light from an outside is converged by the light converging elements on the light sensing units, respectively.

公开(公告)号：US20220299361A1

公开(公告)日：2022-09-22

申请号：US17499874

申请日：2021-10-13

申请人： Egis Technology Inc.

发明人： Chen-Chih Fan ,  Bruce C. S. Chou

IPC分类号： G01J1/04 ,  G01J1/44

摘要： A light sensing module including a photodiode array substrate, a distance increasing layer, and a light converging element array is provided. The photodiode array substrate includes a plurality of light sensing units arranged in an array and a circuit region. The circuit region is disposed on the periphery of the light sensing units. Each of the light sensing units includes a plurality of adjacent photodiodes arranged in an array. The distance increasing layer is disposed on the photodiode array substrate. The light converging element array is disposed on the distance increasing layer, and includes a plurality of light converging units arranged in an array. Reflected light from an outside is converged by the light converging elements on the light sensing units, respectively.

公开(公告)号：US20210209327A1

公开(公告)日：2021-07-08

申请号：US17073417

申请日：2020-10-19

申请人： Egis Technology Inc.

发明人： Tung-Yu Wu ,  Tang-Hung Po ,  Yu-Hsuan Lin ,  Bruce C. S. Chou

IPC分类号： G06K9/00 ,  G02F1/163 ,  G02F1/1333 ,  G06N3/02

摘要： A touch display device with a fingerprint anti-spoofing function and an associated fingerprint anti-spoofing method are provided, where the touch display device may include a touch display panel and a processing circuit. The touch display panel may include a plurality of display units and one or more codebooks, where each of the display units includes a sensor unit, and the one or more codebooks may make the sensor units receive sensing information of an object which is put on the touch display panel. In addition, the processing circuit may obtain the sensing information from the sensor units, and determine whether the object is a real finger based on the sensing information and reference information.

公开(公告)号：US12112567B2

公开(公告)日：2024-10-08

申请号：US18175574

申请日：2023-02-28

申请人： Egis Technology Inc.

发明人： Bruce C. S. Chou

IPC分类号： G06V40/13 ,  G06F3/041 ,  G06F21/32 ,  G06V40/12

CPC分类号： G06V40/1306 ,  G06F3/041661 ,  G06F21/32 ,  G06V40/1365

摘要： The embodiments of the present disclosure provide a biometric detection sensor and a signal processing method thereof. The biometric detection sensor includes an array of detection pixels, the signal processing method includes: acquiring a first detection signal of each detection pixel in the array of detection pixels; for each detection pixel of at least part of detection pixels, processing the first detection signal of the detection pixel based on a reference signal to obtain a detection processing signal of the detection pixel, wherein a resolution of the detection processing signal is lower than that of the first detection signal; and outputting the detection processing signals of the at least part of detection pixels in the array of detection pixels, wherein the detection processing signals are used for biometric identification. The signal processing method can effectively reduce the amount of data for the processor to receive and process during biometric identification.

公开(公告)号：US20230368565A1

公开(公告)日：2023-11-16

申请号：US18175574

申请日：2023-02-28

申请人： Egis Technology Inc.

发明人： Bruce C. S. Chou

IPC分类号： G06V40/13 ,  G06V40/12 ,  G06F3/041 ,  G06F21/32

CPC分类号： G06V40/1306 ,  G06V40/1365 ,  G06F3/041661 ,  G06F21/32

摘要： The embodiments of the present disclosure provide a biometric detection sensor and a signal processing method thereof. The biometric detection sensor includes an array of detection pixels, the signal processing method includes: acquiring a first detection signal of each detection pixel in the array of detection pixels; for each detection pixel of at least part of detection pixels, processing the first detection signal of the detection pixel based on a reference signal to obtain a detection processing signal of the detection pixel, wherein a resolution of the detection processing signal is lower than that of the first detection signal; and outputting the detection processing signals of the at least part of detection pixels in the array of detection pixels, wherein the detection processing signals are used for biometric identification. The signal processing method can effectively reduce the amount of data for the processor to receive and process during biometric identification.

公开(公告)号：US20230261013A1

公开(公告)日：2023-08-17

申请号：US17913820

申请日：2020-11-27

申请人： Egis Technology Inc.

发明人： Bruce C. S. Chou ,  Chen-Chang Huang ,  Chen-Chih Fan

IPC分类号： H01L27/146

CPC分类号： H01L27/1461 ,  H01L27/14643

摘要： The invention provides a photoelectric sensor including a substrate and multiple pixel structures. The pixel structures are disposed on the substrate and arranged in an array. Each of the pixel structures includes a transistor and a photodiode. The photodiode includes a first electrode, a photosensitive layer, and a second electrode. The first electrode and the transistor are laterally arranged side by side. A first part of the photosensitive layer is disposed on the first electrode, and a second part of the photosensitive layer extends from the first part to above the transistor. The second electrode is disposed on the photosensitive layer, and is located above the first electrode and the transistor.

公开(公告)号：US20220301337A1

公开(公告)日：2022-09-22

申请号：US17639586

申请日：2020-04-29

申请人： YU-KUO CHENG ,  Egis Technology Inc.

发明人： Yu-Hsiang Huang ,  Chen-Chih Fan ,  Yu-Kuo Cheng ,  Bruce C. S. Chou

IPC分类号： G06V40/13 ,  G06F3/042 ,  H01L27/146 ,  H01L27/32

摘要： A fingerprint sensing module suitable for receiving a sensing light beam and an electronic device is provided. The fingerprint sensing module includes a sensing element, a light transmitting layer disposed on the sensing element, a micro-lens layer disposed on the light transmitting layer, and a first light shielding layer disposed in the light transmitting layer and including multiple first openings arranged in an array. Positions of the first openings in odd-numbered rows are the same, and those in even-numbered rows are the same. Positions the first openings in the odd-numbered rows are different from those in the even-numbered rows. A sensing light beam includes multiple first light beams incident to a part of a sensing unit in a first transmission direction and multiple second light beams incident to another part of the sensing unit in a second transmission direction. The first transmission direction is different from the second transmission direction.

公开(公告)号：US20220254185A1

公开(公告)日：2022-08-11

申请号：US17580606

申请日：2022-01-20

申请人： Egis Technology Inc.

发明人： Bruce C. S. Chou ,  Tong-Long Fu

IPC分类号： G06V40/13

摘要： A fingerprint sensing device and an operation method thereof are provided. The fingerprint sensing device includes a sensing pixel array and a processing circuit. The sensing pixel array senses a finger during a fingerprint sensing period to obtain a fingerprint sensing signal. At least one pixel area of the sensing pixel array further continuously senses the finger during the fingerprint sensing period to obtain a physiological characteristic signal. The processing circuit is coupled to the sensing pixel array. The processing circuit generates a fingerprint image according to the fingerprint sensing signal, and generates physiological characteristic information according to the physiological characteristic signal.

公开(公告)号：US11288893B2

公开(公告)日：2022-03-29

申请号：US17073417

申请日：2020-10-19

申请人： Egis Technology Inc.

发明人： Tung-Yu Wu ,  Tang-Hung Po ,  Yu-Hsuan Lin ,  Bruce C. S. Chou

IPC分类号： G06V40/12 ,  G02F1/1333 ,  G02F1/163 ,  G06V40/40 ,  G06N3/02

摘要： A touch display device with a fingerprint anti-spoofing function and an associated fingerprint anti-spoofing method are provided, where the touch display device may include a touch display panel and a processing circuit. The touch display panel may include a plurality of display units and one or more codebooks, where each of the display units includes a sensor unit, and the one or more codebooks may make the sensor units receive sensing information of an object which is put on the touch display panel. In addition, the processing circuit may obtain the sensing information from the sensor units, and determine whether the object is a real finger based on the sensing information and reference information.

公开(公告)号：US20230132008A1

公开(公告)日：2023-04-27

申请号：US17886448

申请日：2022-08-11

申请人： Egis Technology Inc.

发明人： Chen-Chih Fan ,  Bruce C. S. Chou

IPC分类号： G01S17/32 ,  H01L31/16 ,  H01L31/0216

摘要： The present disclosure provides an optical sensor, an optical distance sensing module and a fabricating method thereof. According to the embodiments of the present disclosure, the optical sensor includes an optical sensing layer, a light transmitting layer and a light blocking layer. The optical sensing layer includes an array of optical sensing elements, the light transmitting layer is coated on the optical sensing layer, and the light blocking layer includes one or more light incident holes and is coated on the light transmitting layer. The optical sensing layer, the light transmitting layer and the light blocking layer are packaged as a wafer die. Light passes through the light incident holes and transmits through the light transmitting layer to irradiate on the array of optical sensing elements. The optical sensor effectively reduces the thickness, size and weight of the optical sensor, thereby expanding the application range of the optical sensor.