公开(公告)号：US20240047414A1

公开(公告)日：2024-02-08

申请号：US17642046

申请日：2019-11-08

申请人： EV Group E. Thallner GmbH

发明人： Jürgen BURGGRAF

IPC分类号： H01L23/00 ,  H01L21/67

CPC分类号： H01L24/80 ,  H01L21/67121 ,  H01L2224/80895 ,  H01L2224/80896 ,  H01L2224/80091

摘要： A method and device for bonding a first substrate to a second substrate at contact surfaces of the substrates.
The method includes the following steps: mounting the first substrate on a first mounting surface of a first substrate holder and mounting the second substrate on a second mounting surface of a second substrate holder, wherein the substrate holders are arranged in a chamber;



contacting the contact surfaces at a bond initiation surface; and
bonding the first substrate to the second substrate from the bond initiation surface to the centre of the substrates.

公开(公告)号：US20220415675A1

公开(公告)日：2022-12-29

申请号：US17778476

申请日：2019-12-02

申请人： EV Group E. Thallner GmbH

发明人： Jürgen BURGGRAF

IPC分类号： H01L21/67 ,  H01L21/324

摘要： Apparatus and method for heating a substrate. The apparatus including a heater and a substrate holder with a substrate holder surface, wherein the substrate to be heated can be placed on the substrate holder surface, the apparatus further includes means for exerting forces on the heater, the apparatus further includes a control unit for controlling the means, wherein the heater is deformable by the means.