公开(公告)号：US20180190536A1

公开(公告)日：2018-07-05

申请号：US15907637

申请日：2018-02-28

Applicant: EV GROUP E. THALLNER GMBH

Inventor： Erich THALLNER ,  Friedrich Paul LINDNER

IPC: H01L21/687 ,  B25J15/06 ,  H01L21/67

CPC classification number: H01L21/68785 ,  B25J15/0608 ,  H01L21/67092 ,  H01L21/68721 ,  H01L21/68728

Abstract: The invention relates to a retaining system for handling substrate stacks, including a retaining surface for retaining a first substrate, and one or more recesses provided relative to the retaining surface, for retaining first magnetic bodies for securing the first substrate relative to a second substrate that is aligned with the first substrate. Second magnetic bodies are applied on a holding side of the second substrate.

公开(公告)号：US20230015545A1

公开(公告)日：2023-01-19

申请号：US17781977

申请日：2019-12-19

Applicant: EV Group E. Thallner GmbH

Inventor： Gerald MITTENDORFER ,  Friedrich Paul LINDNER

IPC: H01L21/52 ,  H01L21/78

Abstract: A method for producing singulated encapsulated components. The method includes the steps of application of a frame structure on a substrate surface of a substrate, wherein the frame structure surrounds components arranged on the substrate surface; bonding of a cover substrate on the frame structure; hardening of the frame structure; and singulation of the encapsulated components, wherein the frame structure is formed from an adhesive.

公开(公告)号：US20170229336A1

公开(公告)日：2017-08-10

申请号：US15496042

申请日：2017-04-25

Applicant: EV GROUP E. THALLNER GMBH

Inventor： Erich THALLNER ,  Friedrich Paul LINDNER

IPC: H01L21/687 ,  B25J15/06 ,  H01L21/67

CPC classification number: H01L21/68785 ,  B25J15/0608 ,  H01L21/67092 ,  H01L21/68721 ,  H01L21/68728

Abstract: The invention relates to a retaining system for handling substrate stacks, including a retaining surface for retaining a first substrate, and one or more recesses provided relative to the retaining surface, for retaining first magnetic bodies for securing the first substrate relative to a second substrate that is aligned with the first substrate. Second magnetic bodies are applied on a holding side of the second substrate.

公开(公告)号：US20230150180A1

公开(公告)日：2023-05-18

申请号：US17910660

申请日：2020-04-01

Applicant: EV Group E. Thallner GmbH

Inventor： Gerald MITTENDORFER ,  Markus WIMPLINGER ,  Friedrich Paul LINDNER

IPC: B29C45/76 ,  B29C45/14 ,  B29C45/26

CPC classification number: B29C45/768 ,  B29C45/14 ,  B29C45/26 ,  B29C2945/76163 ,  B29C2945/76294 ,  B29C2945/76357 ,  B29C2945/76568 ,  B29C2945/76772 ,  B29C2945/76836

Abstract: A method and device for injection moulding, in particular for micro-injection moulding, at least comprising a mould with a first mould half and a second mould half, wherein the first mould half and the second mould half define an injection moulding space in the closed state of the mould, and an insert arranged in the injection moulding space.

公开(公告)号：US20160020136A1

公开(公告)日：2016-01-21

申请号：US14774167

申请日：2013-03-27

Applicant: EV GROUP E. THALLNER GMBH

Inventor： Erich THALLNER ,  Friedrich Paul LINDNER

IPC: H01L21/687 ,  B25J15/06

CPC classification number: H01L21/68785 ,  B25J15/0608 ,  H01L21/67092 ,  H01L21/68721 ,  H01L21/68728

Abstract: The invention relates to a retaining system for handling substrate stacks, including a retaining surface for retaining a first substrate, and one or more recesses provided relative to the retaining surface, for retaining first magnetic bodies for securing the first substrate relative to a second substrate that is aligned with the first substrate. Second magnetic bodies are applied on a holding side of the second substrate.

Abstract translation: 本发明涉及一种用于处理衬底叠层的保持系统，包括用于保持第一衬底的保持表面和相对于保持表面设置的一个或多个凹槽，用于保持第一磁体以相对于第二衬底固定第一衬底， 与第一基板对准。 第二磁体被施加在第二基板的保持侧上。