公开(公告)号：US11014180B2

公开(公告)日：2021-05-25

申请号：US16166286

申请日：2018-10-22

Applicant: ERSA GmbH

Inventor： Thomas Alletzhaeusser ,  Tim Alletzhaeusser

IPC: B23K3/00 ,  B23K3/02 ,  B23K3/04 ,  B23K3/06 ,  B23K3/08 ,  B23K3/03 ,  H04L29/08 ,  B23K3/047 ,  B23K31/12 ,  B23K37/02 ,  G05D23/22 ,  B23K101/42

Abstract: Soldering system includes a first soldering device having a control apparatus that has a central microcontroller and/or microprocessor and is designed for controlling at least one operating parameter of the soldering device, wherein a radio module is provided which includes a communication module designed for setting up a wireless data connection, and at least a second soldering device having a control apparatus that has a central microcontroller and/or microprocessor and is designed for controlling at least one operating parameter of the soldering device, wherein a radio module is provided which comprises a communication module designed for setting up a wireless data connection.

公开(公告)号：US20190126375A1

公开(公告)日：2019-05-02

申请号：US16166286

申请日：2018-10-22

Applicant: ERSA GmbH

Inventor： Thomas Alletzhaeusser ,  Tim Alletzhaeusser

IPC: B23K3/03 ,  G05D23/22 ,  H04L29/08 ,  B23K3/047 ,  B23K31/12 ,  B23K37/02

Abstract: Soldering system includes—a first soldering device having a control apparatus that has a central microcontroller and/or microprocessor and is designed for controlling at least one operating parameter of the soldering device, wherein a radio module is provided which includes a communication module designed for setting up a wireless data connection,—and at least a second soldering device having a control apparatus that has a central microcontroller and/or microprocessor and is designed for controlling at least one operating parameter of the soldering device, wherein a radio module is provided which comprises a communication module designed for setting up a wireless data connection.