公开(公告)号：US20220115253A1

公开(公告)日：2022-04-14

申请号：US17501382

申请日：2021-10-14

申请人： EMAGE EQUIPMENT PTE. LTD.

发明人： Soon Wei Wong ,  Victor Vertoprakhov

IPC分类号： H01L21/67 ,  G01N21/95 ,  H04N5/225 ,  H04N5/232 ,  G06T11/20 ,  G06T7/60

摘要： An apparatus and method for measuring loop height of overlapping bonded wires, interconnecting the pads of a single or stacked silicon chips to the pads of a substrate taking the steps of: focussing of an optical assembly at multiple points of the bond wire including overlapping bond wires, capturing an image of the bond wire at each of the predetermined focused points; calculating the height of each point of the wire with respect to a reference plane; and tabulating the height data using the X, Y and Z coordinates.

公开(公告)号：US11721571B2

公开(公告)日：2023-08-08

申请号：US17501382

申请日：2021-10-14

申请人： EMAGE EQUIPMENT PTE. LTD.

发明人： Soon Wei Wong ,  Victor Vertoprakhov

IPC分类号： H01L21/67 ,  G01N21/95 ,  G06T7/60 ,  G06T11/20 ,  H04N23/56 ,  H04N23/695 ,  H01L23/00

CPC分类号： H01L21/67288 ,  G01N21/9501 ,  G06T7/60 ,  G06T11/206 ,  H04N23/56 ,  H04N23/695 ,  G06T2207/20072 ,  G06T2207/30148 ,  H01L24/49 ,  H01L2224/4917

摘要： An apparatus and method for measuring loop height of overlapping bonded wires, interconnecting the pads of a single or stacked silicon chips to the pads of a substrate taking the steps of: focussing of an optical assembly at multiple points of the bond wire including overlapping bond wires, capturing an image of the bond wire at each of the predetermined focused points; calculating the height of each point of the wire with respect to a reference plane; and tabulating the height data using the X, Y and Z coordinates.