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公开(公告)号：US20200094371A1
公开(公告)日：2020-03-26
申请号：US16575844
申请日：2019-09-19
申请人： EBARA CORPORATION
发明人： Kenichi Akazawa , Makoto Kashiwagi , Yu Ishii , Atsushi Yoshida , Kenichi Kobayashi , Tetsuji Togawa , Hozumi Yasuda
摘要： Disclosed is a polishing head for a polishing apparatus for polishing a quadrangular substrate using a polishing pad attached to a polishing table, comprising a head body portion, a plurality of elastic bags disposed in a surface of the head body portion, which is to face the polishing table, and a substrate holding plate for holding the substrate, the substrate holding plate being pressed by the elastic bags in a direction away from the head body portion, the head body portion being provided with channels for bags, which are in communication with the respective elastic bags, the polishing head further including at least two support plates disposed between the elastic bags on one hand and the substrate holding plate on the other, the elastic bags being configured to press the substrate holding plate through the support plates.
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公开(公告)号：US11618123B2
公开(公告)日：2023-04-04
申请号：US17072870
申请日：2020-10-16
申请人： EBARA CORPORATION
发明人： Yu Ishii , Tetsuji Togawa , Atsushi Yoshida
IPC分类号： B24B37/005 , B24B49/16
摘要： A polishing method capable of accurately determining a polishing end point of a substrate is disclosed. The method comprises: rotating a polishing table supporting a polishing pad; and polishing the substrate by pressing the substrate against a polishing surface of the polishing pad by a polishing head, wherein polishing the substrate includes: an oscillation polishing process of polishing the substrate while causing the polishing head to oscillate along the polishing surface; and a static polishing process of polishing the substrate with the oscillation of the polishing head stopped, the static polishing process is performed after the oscillation polishing process, and the static polishing process comprises determining a static polishing end point which is a point in time at which a rate of change of torque for rotating the polishing table has reached a change-rate threshold value.
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公开(公告)号：US11511389B2
公开(公告)日：2022-11-29
申请号：US16575844
申请日：2019-09-19
申请人： EBARA CORPORATION
发明人： Kenichi Akazawa , Makoto Kashiwagi , Yu Ishii , Atsushi Yoshida , Kenichi Kobayashi , Tetsuji Togawa , Hozumi Yasuda
摘要： Disclosed is a polishing head for a polishing apparatus for polishing a quadrangular substrate using a polishing pad attached to a polishing table, comprising a head body portion, a plurality of elastic bags disposed in a surface of the head body portion, which is to face the polishing table, and a substrate holding plate for holding the substrate, the substrate holding plate being pressed by the elastic bags in a direction away from the head body portion, the head body portion being provided with channels for bags, which are in communication with the respective elastic bags, the polishing head further including at least two support plates disposed between the elastic bags on one hand and the substrate holding plate on the other, the elastic bags being configured to press the substrate holding plate through the support plates.
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公开(公告)号：US09399274B2
公开(公告)日：2016-07-26
申请号：US14167898
申请日：2014-01-29
申请人： EBARA CORPORATION
IPC分类号： B24B9/06 , H01L21/463 , B24B21/00
CPC分类号： B24B9/065 , B24B21/002 , B24B21/004 , B24B21/008 , B24B21/06 , B24B27/0076 , H01L21/02035 , H01L21/463
摘要： An apparatus and method of polishing a substrate is described. The polishing includes: rotating a substrate; pressing a first polishing tool against an edge portion of the substrate to polish the edge portion; and pressing a second polishing tool against the edge portion of the substrate to polish the edge portion. The second polishing tool is located more inwardly than the first polishing tool with respect to a radial direction of the substrate. The first polishing tool has a polishing surface rougher than a polishing surface of the second polishing tool.
摘要翻译： 描述了抛光衬底的装置和方法。 抛光包括：旋转衬底; 将第一抛光工具压靠在基板的边缘部分上以抛光边缘部分; 并且将第二抛光工具压靠在基板的边缘部分上以抛光边缘部分。 相对于基板的径向方向，第二抛光工具位于比第一抛光工具更向内的位置。 第一抛光工具具有比第二抛光工具的抛光表面更粗糙的抛光表面。
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公开(公告)号：US20210170541A1
公开(公告)日：2021-06-10
申请号：US17072870
申请日：2020-10-16
申请人： EBARA CORPORATION
发明人： Yu Ishii , Tetsuji Togawa , Atsushi Yoshida
IPC分类号： B24B37/005 , B24B49/16
摘要： A polishing method capable of accurately determining a polishing end point of a substrate is disclosed. The method comprises: rotating a polishing table supporting a polishing pad; and polishing the substrate by pressing the substrate against a polishing surface of the polishing pad by a polishing head, wherein polishing the substrate includes: an oscillation polishing process of polishing the substrate while causing the polishing head to oscillate along the polishing surface; and a static polishing process of polishing the substrate with the oscillation of the polishing head stopped, the static polishing process is performed after the oscillation polishing process, and the static polishing process comprises determining a static polishing end point which is a point in time at which a rate of change of torque for rotating the polishing table has reached a change-rate threshold value.
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公开(公告)号：US09630289B2
公开(公告)日：2017-04-25
申请号：US14034468
申请日：2013-09-23
申请人： EBARA CORPORATION
CPC分类号： B24B9/065 , B24B9/102 , B24B21/00 , B24B21/002 , B24B21/20
摘要： A polishing method includes rotating a substrate, performing a first polishing process of pressing a polishing tape against an edge portion of the substrate by a pressing member, with a portion of the polishing tape projecting from the pressing member inwardly in a radial direction of the substrate, to polish the edge portion of the substrate and bend the portion of the polishing tape along the pressing member, and performing a second polishing process of pressing the bent portion of the polishing tape inwardly in the radial direction of the substrate by the pressing member to further polish the edge portion of the substrate.
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公开(公告)号：US09604335B2
公开(公告)日：2017-03-28
申请号：US15188638
申请日：2016-06-21
申请人： EBARA CORPORATION
IPC分类号： B24B9/06 , H01L21/463 , B24B21/00 , H01L21/02
CPC分类号： B24B9/065 , B24B21/002 , B24B21/004 , B24B21/008 , B24B21/06 , B24B27/0076 , H01L21/02035 , H01L21/463
摘要： An apparatus and method of polishing a substrate is described. The polishing includes: rotating a substrate; pressing a first polishing tool against an edge portion of the substrate to polish the edge portion; and pressing a second polishing tool against the edge portion of the substrate to polish the edge portion. The second polishing tool is located more inwardly than the first polishing tool with respect to a radial direction of the substrate. The first polishing tool has a polishing surface rougher than a polishing surface of the second polishing tool.
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