公开(公告)号：US20240203809A1

公开(公告)日：2024-06-20

申请号：US18085173

申请日：2022-12-20

Applicant: EAGLE TECHNOLOGY. LLC

Inventor： Louis R. PARADISO ,  Douglas R. HEILMAN

IPC: H01L23/31 ,  H01L21/52 ,  H01L21/56 ,  H01L23/00 ,  H01L23/053 ,  H01L23/20

CPC classification number: H01L23/3121 ,  H01L21/52 ,  H01L21/56 ,  H01L23/053 ,  H01L23/20 ,  H01L24/48 ,  H01L23/10

Abstract: An electronic device may include a dielectric substrate and bond wire pads on an upper surface thereof. The electronic device may also include a radio frequency (RF) integrated circuit (IC) mounted to the upper surface of the dielectric substrate and bond wires coupling the RF IC to respective bond wire pads. The electronic device may also include a rigid dielectric lid mounted to the upper surface of the dielectric substrate to define an air cavity above the RF IC and the bond wires, and a thermosetting polymer layer over the rigid dielectric lid.