公开(公告)号：US20210162704A1

公开(公告)日：2021-06-03

申请号：US16613553

申请日：2018-05-07

Applicant: Dow Global Technologies LLC

Inventor： Attiganal N. Sreeram ,  Daniel S. Woodman ,  Michael J. Radler ,  Gary D. Parsons ,  Robert Baumann ,  Jai Venkatesan ,  Mark A. Barger ,  Stéphane Costeux ,  Michael H. Mazor ,  Richard Cesaretti

IPC: B32B5/20 ,  E04B1/76

Abstract: Fabricate a panel (5) by building a sacrificial relief (10) by an additive process of multilayer deposition, applying a facade layer (20,30) over the sacrificial relief so as to conform to the contour of the sacrificial relief, depositing a foamable composition (40, 50, 60) over the facade layer.