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公开(公告)号:US11699880B2
公开(公告)日:2023-07-11
申请号:US17334157
申请日:2021-05-28
发明人: Tao Song , Kun Liu , Rongzhe Guo , Chuanqi Gong , Xiaogang Liu , Ming Li
IPC分类号: H01R13/648 , H01R13/6471 , H01R13/40 , H01R13/6587 , H01R13/6591 , H01R13/514 , H01R13/518 , H01R12/72 , H01R13/6586 , H01R12/58 , H05K1/11 , H01R13/6588 , H01R13/6583 , H01R13/6585 , H01R13/6582 , H01R43/24 , H01R12/71 , H01R13/20 , H01R13/504 , H01R13/6461 , H01R13/6584 , H05K3/30 , H01R13/02 , H05K3/34 , H01R13/6474 , H01R13/502 , H01R13/46 , H01R13/646 , H01R13/6473 , H01R13/6581
CPC分类号: H01R13/6471 , H01R12/585 , H01R12/716 , H01R12/724 , H01R13/02 , H01R13/20 , H01R13/40 , H01R13/504 , H01R13/514 , H01R13/518 , H01R13/6461 , H01R13/6582 , H01R13/6583 , H01R13/6584 , H01R13/6585 , H01R13/6586 , H01R13/6587 , H01R13/6588 , H01R13/6591 , H01R43/24 , H05K1/115 , H05K3/306 , H05K3/3447 , H01R12/71 , H01R12/712 , H01R12/722 , H01R13/46 , H01R13/502 , H01R13/646 , H01R13/6473 , H01R13/6474 , H01R13/6581 , H05K2201/09236 , H05K2201/1078 , H05K2201/10189 , H05K2201/10371 , H05K2201/10871
摘要: A backplane connector includes a number of wafers and a spacer for assembling the number of wafers together. Each wafer includes an insulating frame. The insulating frame includes a first protrusion. The spacer includes a body portion. The body portion has a number of slots for holding the first protrusions of the wafers. A periphery of each slot is surrounded by the body portion. Compared with the prior art, the spacer of the present disclosure is provided with a number of slots for holding the first protrusions of the wafers. As a result, the wafers can be easily assembled and fixed as a whole.
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公开(公告)号:US11522321B2
公开(公告)日:2022-12-06
申请号:US17334088
申请日:2021-05-28
发明人: Tao Song , Kun Liu , Rongzhe Guo , Chuanqi Gong , Xiaogang Liu , Ming Li
IPC分类号: H01R4/66 , H01R13/6471 , H01R13/40 , H01R13/6587 , H01R13/6591 , H01R13/514 , H01R13/518 , H01R12/72 , H01R13/6586 , H01R12/58 , H05K1/11 , H01R13/6588 , H01R13/6583 , H01R13/6585 , H01R13/6582 , H01R43/24 , H01R12/71 , H01R13/20 , H01R13/504 , H01R13/6461 , H01R13/6584 , H01R13/6474
摘要: A backplane connector includes a number of conductive terminals, an insulating frame, a first metal shield and a second metal shield. The conductive terminal includes a connection portion and a contact portion. The conductive terminals include differential signal terminals, a first ground terminal and a second ground terminal. The first metal shield has a first extension portion. The second metal shield has a second extension portion. The backplane connector includes an insulating block sleeved on the contact portions of the differential signal terminal and a metal shell sleeved on the insulating block. The metal shell is in contact with the first extension portion and the second extension portion. This arrangement increases the grounding shielding area, reduces crosstalk and improves the quality of signal transmission.
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公开(公告)号:US11515671B2
公开(公告)日:2022-11-29
申请号:US17334159
申请日:2021-05-28
发明人: Tao Song , Kun Liu , Rongzhe Guo , Chuanqi Gong , Xiaogang Liu , Ming Li
IPC分类号: H01R13/648 , H01R13/6471 , H01R13/40 , H01R13/6587 , H01R13/6591 , H01R13/514 , H01R13/518 , H01R12/72 , H01R13/6586 , H01R12/58 , H05K1/11 , H01R13/6588 , H01R13/6583 , H01R13/6585 , H01R13/6582 , H01R43/24 , H01R12/71 , H01R13/20 , H01R13/504 , H01R13/6461 , H01R13/6584 , H01R13/6474
摘要: A backplane connector includes a wafer. The wafer includes a number of conductive terminals, an insulating frame, a first metal shield and a second metal shield located on opposite sides of the insulating frame. The insulating frame includes a number of first posts and a number of second posts. The first metal shield has a number of first mounting holes to receive the first posts. The second metal shield has a number of second mounting holes to receive the second posts. With this arrangement, the first metal shield and the second metal shield can be easily positioned with the insulating frame.
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公开(公告)号:US11502459B2
公开(公告)日:2022-11-15
申请号:US17334187
申请日:2021-05-28
发明人: Tao Song , Kun Liu , Rongzhe Guo , Chuanqi Gong , Xiaogang Liu , Ming Li
IPC分类号: H01R4/66 , H01R13/6471 , H01R13/40 , H01R13/6587 , H01R13/6591 , H01R13/514 , H01R13/518 , H01R12/72 , H01R13/6586 , H01R12/58 , H05K1/11 , H01R13/6588 , H01R13/6583 , H01R13/6585 , H01R13/6582 , H01R43/24 , H01R12/71 , H01R13/20 , H01R13/504 , H01R13/6461 , H01R13/6584 , H01R13/6474
摘要: A backplane connector includes a number of conductive terminals, an insulating frame, a first metal shield and a second metal shield. Each conductive terminal includes a connection portion. The conductive terminals include differential signal terminals, a first ground terminal and a second ground terminal. The first metal shield and the second metal shield are respectively in contact with two opposite side surfaces of the first ground terminal and the second ground terminal. As a result, a shielding cavity surrounding the connection portions of the differential signal terminals is formed. This arrangement can provide better shielding for the differential signal terminals over the length of the connection portion, reduce crosstalk, and improve the quality of signal transmission.
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公开(公告)号:USD943536S1
公开(公告)日:2022-02-15
申请号:US29759436
申请日:2020-11-23
设计人: Tao Song , Kun Liu , Rongzhe Guo , Chuanqi Gong , Xiaogang Liu , Ming Li
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公开(公告)号:USD940666S1
公开(公告)日:2022-01-11
申请号:US29759393
申请日:2020-11-23
设计人: Tao Song , Kun Liu , Rongzhe Guo , Chuanqi Gong , Xiaogang Liu , Ming Li
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公开(公告)号:US12107370B2
公开(公告)日:2024-10-01
申请号:US18328793
申请日:2023-06-05
发明人: Bin Huang , Ming Li , RongZhe Guo , HongJi Chen , KaiDe Wang , Tao Zeng , ShuYao Shen
IPC分类号: H01R13/6461 , H01R12/75 , H01R13/6594 , H01R12/71 , H01R13/502 , H01R13/6463 , H01R13/6471 , H01R13/648 , H01R13/6585 , H01R13/6591 , H01R13/6595 , H05K1/02
CPC分类号: H01R13/6461 , H01R12/75 , H01R13/6594 , H01R12/714 , H01R12/716 , H01R12/718 , H01R13/502 , H01R13/6463 , H01R13/6471 , H01R13/648 , H01R13/6585 , H01R13/6591 , H01R13/65914 , H01R13/6595 , H05K1/0219
摘要: An electrical connector connected with a cable connector connected to cables. The cable connector comprises a plurality of ground terminals, a plurality of signal terminals, and an electromagnetic shielding member. The electrical connector comprises a circuit board, a plurality of ground conductive pads, a plurality of signal conductive pads, and a shielding ground conductive pad. The circuit board comprises two electrical connecting areas that are parallel to each other along first direction. The plurality of ground conductive pads are disposed on a surface of the circuit board at intervals. At least one signal conductive pad is disposed between two adjacent ground conductive pads along second direction that is perpendicular to the first direction. Each of the signal conductive pads being directly connected with the corresponding signal terminal and not directly connected to the cables. The shielding ground conductive pad is disposed on the surface of the circuit board.
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公开(公告)号:US11563290B2
公开(公告)日:2023-01-24
申请号:US17334195
申请日:2021-05-28
发明人: Tao Song , Kun Liu , Rongzhe Guo , Chuanqi Gong , Xiaogang Liu , Ming Li
IPC分类号: H01R13/648 , H01R13/6471 , H01R13/40 , H01R13/6587 , H01R13/6591 , H01R13/514 , H01R13/518 , H01R12/72 , H01R13/6586 , H01R12/58 , H05K1/11 , H01R13/6588 , H01R13/6583 , H01R13/6585 , H01R13/6582 , H01R43/24 , H01R12/71 , H01R13/20 , H01R13/504 , H01R13/6461 , H01R13/6584 , H01R13/6474
摘要: A backplane connector includes a number of conductive terminals, an insulating frame, a first metal shield and a second metal shield. Each conductive terminal includes a connection portion and a contact portion. The conductive terminals include differential signal terminals, a first ground terminal and a second ground terminal. The first metal shield has a first elastic arm and a second elastic arm. The second metal shield has a third elastic arm and a fourth elastic arm. The first elastic arm and the third elastic arm are in contact with two opposite side surfaces of the contact portion of the first ground terminal. The second elastic arm and the fourth elastic arm are in contact with two opposite side surfaces of the contact portion of the second ground terminal. This arrangement increases the grounding shielding area, reduces crosstalk, and improves the quality of signal transmission.
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公开(公告)号:US11545787B2
公开(公告)日:2023-01-03
申请号:US17333968
申请日:2021-05-28
发明人: Tao Song , Kun Liu , Rongzhe Guo , Chuanqi Gong , Xiaogang Liu , Ming Li
IPC分类号: H01R9/03 , H01R13/6471 , H01R13/40 , H01R13/6587 , H01R13/6591 , H01R13/514 , H01R13/518 , H01R12/72 , H01R13/6586 , H01R12/58 , H05K1/11 , H01R13/6588 , H01R13/6583 , H01R13/6585 , H01R13/6582 , H01R43/24 , H01R12/71 , H01R13/20 , H01R13/504 , H01R13/6461 , H01R13/6584 , H01R13/6474
摘要: A backplane connector includes a number of conductive terminals, an insulating frame, a first metal shield and a second metal shield. The first metal shield and the second metal shield respectively include a first extension portion and a second extension portion. The conductive terminals include differential signal terminals, a first ground terminal and a second ground terminal. The first extension portion and the second extension portion in contact with the first ground terminal and the second ground terminal. As a result, a shielding space to enclose contact portions of the differential signal terminals is formed. This arrangement can provide better shielding for the differential signal terminals, reduce crosstalk, and improve the quality of signal transmission.
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公开(公告)号:US11522320B2
公开(公告)日:2022-12-06
申请号:US17333827
申请日:2021-05-28
发明人: Tao Song , Kun Liu , Rongzhe Guo , Chuanqi Gong , Xiaogang Liu , Ming Li
IPC分类号: H01R12/00 , H01R13/6471 , H01R13/40 , H01R13/6587 , H01R13/6591 , H01R13/514 , H01R13/518 , H01R12/72 , H01R13/6586 , H01R12/58 , H05K1/11 , H01R13/6588 , H01R13/6583 , H01R13/6585 , H01R13/6582 , H01R43/24 , H01R12/71 , H01R13/20 , H01R13/504 , H01R13/6461 , H01R13/6584 , H01R13/6474
摘要: A circuit board includes two first insertion holes, a second insertion hole located on one side of the two first insertion holes, a third insertion hole located on the other side of the two first insertion holes, and a number of grounding points. The grounding points are distributed on a periphery of the first insertion holes. The grounding points, the second insertion hole and the third insertion hole together form a shielding layer surrounding the periphery of the first insertion holes. The present disclosure also relates to a backplane connector assembly having a backplane connector and the circuit board. Compared with the prior art, the circuit board disclosed in the present disclosure improves the shielding effect of differential signal terminals, reduces crosstalk and improves the quality of signal transmission.
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