公开(公告)号：US20130033672A1

公开(公告)日：2013-02-07

申请号：US13375476

申请日：2011-09-26

申请人： Dong Li ,  Feng She ,  Cheng-ming Huang

发明人： Dong Li ,  Feng She ,  Cheng-ming Huang

IPC分类号： G02F1/13 ,  B26D7/00

CPC分类号： B26D1/10 ,  B26D3/06 ,  B26D11/00 ,  G02F1/1303 ,  G02F1/133351 ,  Y10T29/49819 ,  Y10T83/0378 ,  Y10T83/051 ,  Y10T83/889 ,  Y10T225/12

摘要： The present invention provides a method for cutting a panel substrate and a substrate cutting apparatus. The substrate cutting apparatus comprises a first cutting unit and a second cutting unit. The method comprises the following steps: cutting off a first residual material and a second residual material at two opposite sides of the panel substrate; cutting off a third residual material and a fourth residual material at another two opposite sides of the panel substrate; cutting the panel substrate into a plurality of elongated substrates; and cutting each of the elongated substrates into the panel units. The present invention can reduce a process time for cutting the panel substrate.

摘要翻译： 本发明提供一种切割面板基板和基板切割装置的方法。 基板切割装置包括第一切割单元和第二切割单元。 该方法包括以下步骤：在面板基板的两个相对侧处切掉第一残留材料和第二残留材料; 在面板基板的另外两个相对侧切断第三残留材料和第四残留材料; 将所述面板基板切割成多个细长基板; 并将每个细长基板切割成面板单元。 本发明可以减少切割面板基板的处理时间。

公开(公告)号：US08978528B2

公开(公告)日：2015-03-17

申请号：US13375476

申请日：2011-09-26

申请人： Dong Li ,  Feng She ,  Cheng-ming Huang

发明人： Dong Li ,  Feng She ,  Cheng-ming Huang

IPC分类号： B26D7/00 ,  G02F1/13 ,  B26D1/10 ,  B26D3/06 ,  G02F1/1333 ,  B26D11/00

CPC分类号： B26D1/10 ,  B26D3/06 ,  B26D11/00 ,  G02F1/1303 ,  G02F1/133351 ,  Y10T29/49819 ,  Y10T83/0378 ,  Y10T83/051 ,  Y10T83/889 ,  Y10T225/12

摘要： The present invention provides a method for cutting a panel substrate and a substrate cutting apparatus. The substrate cutting apparatus comprises a first cutting unit and a second cutting unit. The method comprises the following steps: cutting off a first residual material and a second residual material at two opposite sides of the panel substrate; cutting off a third residual material and a fourth residual material at another two opposite sides of the panel substrate; cutting the panel substrate into a plurality of elongated substrates; and cutting each of the elongated substrates into the panel units. The present invention can reduce a process time for cutting the panel substrate.

摘要翻译： 本发明提供一种切割面板基板和基板切割装置的方法。 基板切割装置包括第一切割单元和第二切割单元。 该方法包括以下步骤：在面板基板的两个相对侧处切掉第一残留材料和第二残留材料; 在面板基板的另外两个相对侧切断第三残留材料和第四残留材料; 将所述面板基板切割成多个细长基板; 并将每个细长基板切割成面板单元。 本发明可以减少切割面板基板的处理时间。

公开(公告)号：US09067327B2

公开(公告)日：2015-06-30

申请号：US13379021

申请日：2011-11-30

申请人： Dong Li ,  Feng She ,  Cheng-ming Huang

发明人： Dong Li ,  Feng She ,  Cheng-ming Huang

IPC分类号： B26D1/11 ,  B26D5/08 ,  B26D7/20

CPC分类号： B26D1/11 ,  B26D5/086 ,  B26D7/20 ,  Y10T83/0586 ,  Y10T83/263 ,  Y10T83/889

摘要： A cutting device and a cutting method of a liquid crystal panel are provided. The liquid crystal panel includes a first substrate and a second substrate assembled together. The cutting device of the liquid crystal panel includes a first cutting portion for cutting the first substrate and a second cutting portion for cutting the second substrate. The second cutting portion includes a support portion. The support portion is used to support the first substrate when the first cutting portion cuts the first substrate and the second cutting portion does not cut the second substrate yet. The present invention assures the cutting quality, improves the cutting efficiency and reduces the cutting cost.

摘要翻译： 提供了一种液晶面板的切割装置和切割方法。 液晶面板包括组装在一起的第一基板和第二基板。 液晶面板的切割装置包括用于切割第一基板的第一切割部分和用于切割第二基板的第二切割部分。 第二切割部分包括支撑部分。 当第一切割部分切割第一基底并且第二切割部分未切割第二基底时，支撑部分用于支撑第一基底。 本发明确保切割质量，提高切割效率并降低切割成本。

公开(公告)号：US20130133491A1

公开(公告)日：2013-05-30

申请号：US13379021

申请日：2011-11-30

申请人： Dong Li ,  Feng She ,  Cheng-ming Huang

发明人： Dong Li ,  Feng She ,  Cheng-ming Huang

IPC分类号： B26D7/01 ,  B26D3/00 ,  B26D7/00

CPC分类号： B26D1/11 ,  B26D5/086 ,  B26D7/20 ,  Y10T83/0586 ,  Y10T83/263 ,  Y10T83/889

摘要： A cutting device and a cutting method of a liquid crystal panel are provided. The liquid crystal panel includes a first substrate and a second substrate assembled together. The cutting device of the liquid crystal panel includes a first cutting portion for cutting the first substrate and a second cutting portion for cutting the second substrate. The second cutting portion includes a support portion. The support portion is used to support the first substrate when the first cutting portion cuts the first substrate and the second cutting portion does not cut the second substrate yet. The present invention assures the cutting quality, improves the cutting efficiency and reduces the cutting cost.

摘要翻译： 提供了一种液晶面板的切割装置和切割方法。 液晶面板包括组装在一起的第一基板和第二基板。 液晶面板的切割装置包括用于切割第一基板的第一切割部分和用于切割第二基板的第二切割部分。 第二切割部分包括支撑部分。 当第一切割部分切割第一基底并且第二切割部分未切割第二基底时，支撑部分用于支撑第一基底。 本发明确保切割质量，提高切割效率并降低切割成本。

公开(公告)号：US20140301342A1

公开(公告)日：2014-10-09

申请号：US14356689

申请日：2012-11-06

申请人： Feng She ,  Hongwei Yang ,  Yun Deng

发明人： Feng She ,  Hongwei Yang ,  Yun Deng

IPC分类号： H04W52/04

CPC分类号： H04W52/04 ,  H04B17/318 ,  H04W52/242 ,  H04W52/245 ,  H04W52/386 ,  H04W52/40

摘要： An antenna system and a method for reporting enhanced Reference Signal Receiving Power (eRSRP) of the same are provided. According to an embodiment of the present invention, the method for reporting eRSRP includes: transmitting, by an evolved Node Base (eNB), different reference signals to different transport points being distributed; measuring, by a user equipment (UE), eRSRP of the different transport points; and reporting, by the UE, the measured eRSRP of the different transport points to the eNB. Compared with the prior art, the eNB can obtain channel information of path loss of each transport point, to fundamentally solve the problem of unbalanced power, and can perform other optimization operations based on the information to improve the system throughput and other performance.

摘要翻译： 提供了一种天线系统和用于报告增强的参考信号接收功率（eRSRP）的方法。 根据本发明的实施例，用于报告eRSRP的方法包括：由演进的节点基站（eNB）向正在分配的不同传输点发送不同的参考信号; 由用户设备（UE）测量不同传输点的eRSRP; 以及由所述UE向所述eNB报告所述不同传输点的所测量的eRSRP。 与现有技术相比，eNB可以获得每个传输点路径丢失的信道信息，从根本上解决不平衡功率的问题，并可以根据该信息进行其他优化操作，提高系统吞吐量等性能。

公开(公告)号：US20140328297A1

公开(公告)日：2014-11-06

申请号：US14356648

申请日：2012-11-06

申请人： Feng She ,  Yun Deng ,  Hongwei Yang

发明人： Feng She ,  Yun Deng ,  Hongwei Yang

IPC分类号： H04W72/04

CPC分类号： H04W72/0406 ,  H04L1/1812 ,  H04L1/1854 ,  H04L5/0055 ,  H04L5/0091

摘要： The present invention discloses a method for determining a Physical Uplink Control Channel PUCCH resource for a user equipment and a corresponding user equipment, and a method for facilitating the determination of a PUCCH resource for a user equipment and a corresponding base station, wherein the PUCCH resource is used to transmit a Hybrid Automatic Repeat Request HARQ feed back (ACK or NACK) of the user equipment with respect to its corresponding Physical Downlink Shared Channel PDSCH. In the present invention, an index value for a Control Channel Element CCE scheduled for the user equipment in an Enhanced Physical Downlink Control Channel E-PDCCH is firstly acquired, and then based on the index value and a first parameter, the PUCCH resource used to transmit the HARQ feedback of the user equipment with respect to its corresponding PDSCH is determined, the first parameter representing a reference value that should be used when determining the PUCCH resource used to transmit the HARQ feedback of the user equipment with respect to its corresponding PDSCH, if scheduling the CCE for the user equipment in the E-PDCCH.

摘要翻译： 本发明公开了一种用于确定用户设备和对应用户设备的物理上行链路控制信道PUCCH资源的方法，以及一种便于确定用于用户设备和相应基站的PUCCH资源的方法，其中PUCCH资源 用于相对于其对应的物理下行链路共享信道PDSCH发送用户设备的混合自动重传请求HARQ反馈（ACK或NACK）。 在本发明中，首先获取在增强物理下行链路控制信道E-PDCCH中为用户设备调度的控制信道要素CCE的索引值，然后基于索引值和第一参数，将PUCCH资源用于 确定相对于其对应的PDSCH发送用户设备的HARQ反馈，第一参数表示当确定用于发送用户设备的HARQ反馈的PUCCH资源相对于其对应的PDSCH时应当使用的参考值， 如果在E-PDCCH中为用户设备调度CCE。