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公开(公告)号：US20210212194A1
公开(公告)日：2021-07-08
申请号：US17100965
申请日：2020-11-23
Applicant: Delta Electronics (Shanghai) Co., Ltd.
IPC: H05K1/02 , H01L23/367 , B23K1/00 , H05K3/34 , H01L23/373 , H05K1/03
Abstract: An electronic apparatus includes: a circuit board having a first surface, a second surface and an opening, wherein the opening is between the first surface and the second surface; a thermal conductive material at least partially passing through the opening, and in contact with the circuit board; at least an electronic device disposed on the first surface of the circuit board, and in contact with the thermal conductive material; a heat dissipation plate disposed on the second surface of the circuit board; and an insulated thermal conductive sheet disposed between the thermal conductive material and the heat dissipation plate. By virtue of it, product volume can be reduced effectively, and a flow channel is simplified.
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Patent Agency Ranking
公开(公告)号：US20240049436A1
公开(公告)日：2024-02-08
申请号：US18356253
申请日：2023-07-21
Applicant: Delta Electronics (Shanghai) Co.,Ltd.
Inventor： Hongguang DING , Peiai YOU , Yueyong MENG , Jinfa ZHANG
CPC classification number: H05K7/20927 , H01F27/022 , H05K9/0081 , H01F27/10 , H05K7/20236
Abstract: The present disclosure discloses an onboard power device and a thermal management system, wherein the thermal management system comprises the onboard power device which comprises a power assembly comprising a plurality of electronic components and a shell comprising an inner cavity and a coolant passage that are isolated from each other, wherein the power assembly is disposed in the inner cavity which is filled with insulating heat conductive fluid, the power assembly being immersed in the insulating heat conductive fluid, and wherein a coolant flows through the coolant passage. The present disclosure allows the power assembly to be sufficiently and uniformly cooled by immersing in insulating heat conductive fluid, and by circulating coolant in the coolant passage of the onboard power device.
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公开(公告)号：US20210395583A1
公开(公告)日：2021-12-23
申请号：US17331851
申请日：2021-05-27
Applicant: DELTA ELECTRONICS (SHANGHAI) CO.,LTD.
Abstract: The present disclosure relates to a potting adhesive, including: a component A and a component B, the component A including a first liquid organic adhesive containing dimethyl siloxane, the component B including a second liquid organic adhesive containing methyl hydrogen siloxane and silicone oil, at least one of the component A and the component B further including ceramic particles which are spherical particles with a particle size of 0.1 mm to 3 mm. The present disclosure further relates to a heat dissipation device, including an adhesive potting groove, a transformer provided in the adhesive potting groove, and a filling medium which fills and is consolidated in a gap between the transformer and the adhesive potting groove.
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公开(公告)号：US20190245430A1
公开(公告)日：2019-08-08
申请号：US16239554
申请日：2019-01-04
Applicant: Delta Electronics (Shanghai) Co.,Ltd.
Inventor： Peiai YOU , Hao SUN , Jinfa ZHANG
Abstract: A power conversion apparatus is provided, which comprises a housing, a mother board, an electromagnetic filter board, a signal board, and a heat-dissipation module. The housing includes a first heat-dissipation wall and a coolant passage. The mother board is disposed upon the housing, and comprises a first surface facing the housing and a first power device. The heat-dissipation module includes a first insulated heat-conducting sheet adhered to the corresponding first heat-dissipation wall and a first elastic clamp. When the first surface of the mother board approaches the housing to clamp the first power device within the accommodating space, the first power device is pressed against by the first elastic clamp and thus adhered to the first insulated heat-conducting sheet, so that the first power device is thermally coupled to the first heat-dissipation wall and the coolant passage via the first insulated heat-conducting sheet.
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公开(公告)号：US20220178763A1
公开(公告)日：2022-06-09
申请号：US17452405
申请日：2021-10-27
Applicant: Delta Electronics (Shanghai) Co., Ltd.
Inventor： Zhen ZHOU , Peiai YOU , Jianhong CHEN
Abstract: The present application provides a temperature detection system and an on board charger, the system including a heat transfer element and a temperature sensor; the heat transfer element and the temperature sensor are both located on a printed circuit board. The heat transfer element is thermally connected to the temperature sensor, and is also configured to thermally connect to the power device on the printed circuit board. The heat transfer element is configured to transfer a temperature of the power device to the temperature sensor, so that the temperature sensor detects the temperature of the power device. The heat transfer element is an electrically insulating element. The heat transfer element is thermally connected to the power device and temperature sensor.
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公开(公告)号：US20190243431A1
公开(公告)日：2019-08-08
申请号：US16240802
申请日：2019-01-07
Applicant: Delta Electronics (Shanghai) Co.,Ltd.
Inventor： Peiai YOU , Hao SUN , Jinfa ZHANG
CPC classification number: G06F1/20 , H02M11/00 , H04B15/005 , H05K7/20154 , H05K7/20263
Abstract: A power conversion apparatus is provided, which comprises a housing, a main board, a first electromagnetic filtering board, a second electromagnetic filtering board, a signal board, a capacitor board, and a heat-dissipation module. The housing includes a heat-dissipation wall and a coolant runner. The main board is disposed upon the housing and comprises a first surface facing the housing and a power device. The heat-dissipation module includes an thermal conductive insulating sheet adhered to the heat-dissipation wall and an elastic clamp. When the main board approaches the housing to clamp the power device in the accommodating space between the elastic clamp and the thermal conductive insulating sheet, the power device is pressed against by the elastic clamp and thus adhered to the thermal conductive insulating sheet, so that the power device is thermally coupled to the heat-dissipation wall and the coolant runner via the thermal conductive insulating sheet.
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